JPS5079448A - - Google Patents

Info

Publication number
JPS5079448A
JPS5079448A JP48129156A JP12915673A JPS5079448A JP S5079448 A JPS5079448 A JP S5079448A JP 48129156 A JP48129156 A JP 48129156A JP 12915673 A JP12915673 A JP 12915673A JP S5079448 A JPS5079448 A JP S5079448A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48129156A
Other versions
JPS5224508B2 (ja
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TOKAI ELECTRO CHEMICAL CO
Original Assignee
TOKAI ELECTRO CHEMICAL CO
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TOKAI ELECTRO CHEMICAL CO filed Critical TOKAI ELECTRO CHEMICAL CO
Priority to JP48129156A priority Critical patent/JPS5224508B2/ja
Priority to CA209,481A priority patent/CA1039631A/en
Priority to US05/510,535 priority patent/US3936332A/en
Priority to IT28293/74A priority patent/IT1022770B/it
Priority to GB4477974A priority patent/GB1464041A/en
Priority to DE19742453429 priority patent/DE2453429A1/de
Priority to FR7437985A priority patent/FR2251631B1/fr
Publication of JPS5079448A publication Critical patent/JPS5079448A/ja
Priority to US05/810,730 priority patent/US4110237A/en
Publication of JPS5224508B2 publication Critical patent/JPS5224508B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Catalysts (AREA)
JP48129156A 1973-11-19 1973-11-19 Expired JPS5224508B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP48129156A JPS5224508B2 (ja) 1973-11-19 1973-11-19
CA209,481A CA1039631A (en) 1973-11-19 1974-09-18 Copper and copper alloy etching solutions and process
US05/510,535 US3936332A (en) 1973-11-19 1974-09-30 Copper and copper alloy etching solutions and process
IT28293/74A IT1022770B (it) 1973-11-19 1974-10-10 Soluzioni per l attacco di rame e leghe di rame e processo di attacco con tali soluzioni
GB4477974A GB1464041A (en) 1973-11-19 1974-10-16 Etching solutions and their use
DE19742453429 DE2453429A1 (de) 1973-11-19 1974-11-11 Aetzloesungen fuer kupfer und kupferlegierungen
FR7437985A FR2251631B1 (ja) 1973-11-19 1974-11-18
US05/810,730 US4110237A (en) 1973-11-19 1977-06-28 Compositions containing a diazine and a halogen compound for catalyzing copper etching solutions

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48129156A JPS5224508B2 (ja) 1973-11-19 1973-11-19

Publications (2)

Publication Number Publication Date
JPS5079448A true JPS5079448A (ja) 1975-06-27
JPS5224508B2 JPS5224508B2 (ja) 1977-07-01

Family

ID=15002514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48129156A Expired JPS5224508B2 (ja) 1973-11-19 1973-11-19

Country Status (7)

Country Link
US (1) US3936332A (ja)
JP (1) JPS5224508B2 (ja)
CA (1) CA1039631A (ja)
DE (1) DE2453429A1 (ja)
FR (1) FR2251631B1 (ja)
GB (1) GB1464041A (ja)
IT (1) IT1022770B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105980603A (zh) * 2013-12-06 2016-09-28 Mec股份有限公司 蚀刻液、补给液以及铜布线的形成方法
WO2017038175A1 (ja) * 2015-08-31 2017-03-09 メック株式会社 エッチング液、補給液及び銅配線の形成方法

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4110237A (en) * 1973-11-19 1978-08-29 Tokai Denka Kabushiki Kaisha Compositions containing a diazine and a halogen compound for catalyzing copper etching solutions
US4155866A (en) * 1978-04-24 1979-05-22 International Business Machines Corporation Method of controlling silicon wafer etching rates-utilizing a diazine catalyzed etchant
US4362595A (en) * 1980-05-19 1982-12-07 The Boeing Company Screen fabrication by hand chemical blanking
US4319955A (en) * 1980-11-05 1982-03-16 Philip A. Hunt Chemical Corp. Ammoniacal alkaline cupric etchant solution for and method of reducing etchant undercut
US4973380A (en) * 1983-10-06 1990-11-27 Olin Corporation Process for etching copper base materials
US4725374A (en) * 1983-10-06 1988-02-16 Olin Corporation Process and apparatus for etching copper base materials
DE3623504A1 (de) * 1986-07-09 1988-01-21 Schering Ag Kupferaetzloesungen
US5620585A (en) * 1988-03-07 1997-04-15 Great Lakes Chemical Corporation Inorganic perbromide compositions and methods of use thereof
US5607619A (en) * 1988-03-07 1997-03-04 Great Lakes Chemical Corporation Inorganic perbromide compositions and methods of use thereof
US5248386A (en) * 1991-02-08 1993-09-28 Aluminum Company Of America Milling solution and method
AU665197B2 (en) * 1991-04-12 1995-12-21 Great Lakes Chemical Corporation Inorganic perbromide compositions and methods of use thereof
JP3400558B2 (ja) * 1994-08-12 2003-04-28 メック株式会社 銅および銅合金のエッチング液
US20040035717A1 (en) * 2002-08-21 2004-02-26 Casio Micronics Co. , Ltd. Chemical treatment method and chemical treatment apparatus
TW200417628A (en) * 2002-09-09 2004-09-16 Shipley Co Llc Improved cleaning composition

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3410802A (en) * 1966-02-21 1968-11-12 Fmc Corp Process and composition for etching of copper metal
JPS5221460B1 (ja) * 1971-04-26 1977-06-10

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105980603A (zh) * 2013-12-06 2016-09-28 Mec股份有限公司 蚀刻液、补给液以及铜布线的形成方法
CN105980603B (zh) * 2013-12-06 2019-11-22 Mec股份有限公司 蚀刻液、补给液以及铜布线的形成方法
WO2017038175A1 (ja) * 2015-08-31 2017-03-09 メック株式会社 エッチング液、補給液及び銅配線の形成方法
US10174428B2 (en) 2015-08-31 2019-01-08 Mec Company Ltd. Etchant, replenishment solution and method for forming copper wiring

Also Published As

Publication number Publication date
DE2453429A1 (de) 1975-05-22
IT1022770B (it) 1978-04-20
GB1464041A (en) 1977-02-09
US3936332A (en) 1976-02-03
FR2251631A1 (ja) 1975-06-13
JPS5224508B2 (ja) 1977-07-01
CA1039631A (en) 1978-10-03
FR2251631B1 (ja) 1978-06-16

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