JPS5077865A - - Google Patents

Info

Publication number
JPS5077865A
JPS5077865A JP49119179A JP11917974A JPS5077865A JP S5077865 A JPS5077865 A JP S5077865A JP 49119179 A JP49119179 A JP 49119179A JP 11917974 A JP11917974 A JP 11917974A JP S5077865 A JPS5077865 A JP S5077865A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49119179A
Other languages
Japanese (ja)
Other versions
JPS5524718B2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5077865A publication Critical patent/JPS5077865A/ja
Publication of JPS5524718B2 publication Critical patent/JPS5524718B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP11917974A 1973-10-17 1974-10-16 Expired JPS5524718B2 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/407,181 US4016463A (en) 1973-10-17 1973-10-17 High density multilayer printed circuit card assembly and method

Publications (2)

Publication Number Publication Date
JPS5077865A true JPS5077865A (enExample) 1975-06-25
JPS5524718B2 JPS5524718B2 (enExample) 1980-07-01

Family

ID=23610970

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11917974A Expired JPS5524718B2 (enExample) 1973-10-17 1974-10-16

Country Status (2)

Country Link
US (1) US4016463A (enExample)
JP (1) JPS5524718B2 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5290065A (en) * 1976-01-23 1977-07-28 Oki Electric Ind Co Ltd Multiilayer printed circuit board
JPS52118965U (enExample) * 1976-03-04 1977-09-09
JPS5422575A (en) * 1977-07-22 1979-02-20 Hitachi Ltd Print circuit substrate
JPH03150895A (ja) * 1989-11-08 1991-06-27 Hitachi Ltd 多層回路基板及びその製造方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3435804A1 (de) * 1984-09-28 1986-04-10 Siemens AG, 1000 Berlin und 8000 München Rueckwandverdrahtung fuer einschiebbare elektrische baugruppen
DE3435773A1 (de) * 1984-09-28 1986-04-10 Siemens AG, 1000 Berlin und 8000 München Rueckwandverdrahtung fuer einschiebbare elektrische baugruppen
DE3502295A1 (de) * 1985-01-24 1986-07-24 ANT Nachrichtentechnik GmbH, 7150 Backnang Aufbausystem fuer geraete der elektrischen nachrichtentechnik
JPS6288346A (ja) * 1985-10-15 1987-04-22 Hitachi Ltd 多層配線基板
JPS62136098A (ja) * 1985-12-09 1987-06-19 富士通株式会社 高密度配線基板
JPS63142894A (ja) * 1986-12-06 1988-06-15 株式会社東芝 フラツトパツケ−ジ集積回路の配線基板
US4985808A (en) * 1988-11-02 1991-01-15 Communications Systems, Inc. Printed circuit board switching system for resistor network
US5060116A (en) * 1990-04-20 1991-10-22 Grobman Warren D Electronics system with direct write engineering change capability
DE4015788C2 (de) * 1990-05-16 1994-06-23 Siemens Nixdorf Inf Syst Baugruppe
US5285353A (en) * 1992-12-28 1994-02-08 Delco Electronics Corporation Support bar for circuit boards
US5644272A (en) * 1996-03-05 1997-07-01 Telefonaktiebolaget Lm Ericsson High frequency balun provided in a multilayer substrate
JPH10303562A (ja) * 1997-04-30 1998-11-13 Toshiba Corp プリント配線板
US6525921B1 (en) * 1999-11-12 2003-02-25 Matsushita Electric Industrial Co., Ltd Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same
US6965170B2 (en) * 2003-11-18 2005-11-15 International Business Machines Corporation High wireability microvia substrate
US8344505B2 (en) * 2007-08-29 2013-01-01 Ati Technologies Ulc Wafer level packaging of semiconductor chips
US20250151196A1 (en) * 2022-02-28 2025-05-08 Hewlett-Packard Development Company, L.P. Logic board having selectable secondary conductive traces

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3300686A (en) * 1963-07-30 1967-01-24 Ibm Compatible packaging of miniaturized circuit modules
US3680005A (en) * 1966-03-24 1972-07-25 Burroughs Corp Integral electrical power distribution network having stacked plural circuit planes of differing characteristic impedance with intermediate ground plane for separating circuit planes
US3564114A (en) * 1967-09-28 1971-02-16 Loral Corp Universal multilayer printed circuit board
GB1220370A (en) * 1968-08-13 1971-01-27 Litton Industries Inc Electrical circuit boards
DE1919110B2 (de) * 1969-04-15 1972-08-17 Siemens AG, 1000 Berlin u. 8000 München Anordnung fuer impulsbetrieb mit einem oder mehreren wellenleitersystemen
US3968193A (en) * 1971-08-27 1976-07-06 International Business Machines Corporation Firing process for forming a multilayer glass-metal module

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5290065A (en) * 1976-01-23 1977-07-28 Oki Electric Ind Co Ltd Multiilayer printed circuit board
JPS52118965U (enExample) * 1976-03-04 1977-09-09
JPS5422575A (en) * 1977-07-22 1979-02-20 Hitachi Ltd Print circuit substrate
JPH03150895A (ja) * 1989-11-08 1991-06-27 Hitachi Ltd 多層回路基板及びその製造方法

Also Published As

Publication number Publication date
JPS5524718B2 (enExample) 1980-07-01
US4016463A (en) 1977-04-05

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