JPS5077865A - - Google Patents

Info

Publication number
JPS5077865A
JPS5077865A JP49119179A JP11917974A JPS5077865A JP S5077865 A JPS5077865 A JP S5077865A JP 49119179 A JP49119179 A JP 49119179A JP 11917974 A JP11917974 A JP 11917974A JP S5077865 A JPS5077865 A JP S5077865A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49119179A
Other languages
Japanese (ja)
Other versions
JPS5524718B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5077865A publication Critical patent/JPS5077865A/ja
Publication of JPS5524718B2 publication Critical patent/JPS5524718B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0292—Programmable, customizable or modifiable circuits having a modifiable lay-out, i.e. adapted for engineering changes or repair
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP11917974A 1973-10-17 1974-10-16 Expired JPS5524718B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/407,181 US4016463A (en) 1973-10-17 1973-10-17 High density multilayer printed circuit card assembly and method

Publications (2)

Publication Number Publication Date
JPS5077865A true JPS5077865A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1975-06-25
JPS5524718B2 JPS5524718B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1980-07-01

Family

ID=23610970

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11917974A Expired JPS5524718B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1973-10-17 1974-10-16

Country Status (2)

Country Link
US (1) US4016463A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS5524718B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5290065A (en) * 1976-01-23 1977-07-28 Oki Electric Ind Co Ltd Multiilayer printed circuit board
JPS52118965U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1976-03-04 1977-09-09
JPS5422575A (en) * 1977-07-22 1979-02-20 Hitachi Ltd Print circuit substrate
JPH03150895A (ja) * 1989-11-08 1991-06-27 Hitachi Ltd 多層回路基板及びその製造方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3435804A1 (de) * 1984-09-28 1986-04-10 Siemens AG, 1000 Berlin und 8000 München Rueckwandverdrahtung fuer einschiebbare elektrische baugruppen
DE3435773A1 (de) * 1984-09-28 1986-04-10 Siemens AG, 1000 Berlin und 8000 München Rueckwandverdrahtung fuer einschiebbare elektrische baugruppen
DE3502295A1 (de) * 1985-01-24 1986-07-24 ANT Nachrichtentechnik GmbH, 7150 Backnang Aufbausystem fuer geraete der elektrischen nachrichtentechnik
JPS6288346A (ja) * 1985-10-15 1987-04-22 Hitachi Ltd 多層配線基板
JPS62136098A (ja) * 1985-12-09 1987-06-19 富士通株式会社 高密度配線基板
JPS63142894A (ja) * 1986-12-06 1988-06-15 株式会社東芝 フラツトパツケ−ジ集積回路の配線基板
US4985808A (en) * 1988-11-02 1991-01-15 Communications Systems, Inc. Printed circuit board switching system for resistor network
US5060116A (en) * 1990-04-20 1991-10-22 Grobman Warren D Electronics system with direct write engineering change capability
DE4015788C2 (de) * 1990-05-16 1994-06-23 Siemens Nixdorf Inf Syst Baugruppe
US5285353A (en) * 1992-12-28 1994-02-08 Delco Electronics Corporation Support bar for circuit boards
US5644272A (en) * 1996-03-05 1997-07-01 Telefonaktiebolaget Lm Ericsson High frequency balun provided in a multilayer substrate
JPH10303562A (ja) * 1997-04-30 1998-11-13 Toshiba Corp プリント配線板
EP1100295B1 (en) * 1999-11-12 2012-03-28 Panasonic Corporation Capacitor-mounted metal foil and a method for producing the same, and a circuit board and a method for producing the same
US6965170B2 (en) * 2003-11-18 2005-11-15 International Business Machines Corporation High wireability microvia substrate
US8344505B2 (en) 2007-08-29 2013-01-01 Ati Technologies Ulc Wafer level packaging of semiconductor chips
WO2023163719A1 (en) * 2022-02-28 2023-08-31 Hewlett-Packard Development Company, L.P. Logic board having selectable secondary conductive traces

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3300686A (en) * 1963-07-30 1967-01-24 Ibm Compatible packaging of miniaturized circuit modules
US3680005A (en) * 1966-03-24 1972-07-25 Burroughs Corp Integral electrical power distribution network having stacked plural circuit planes of differing characteristic impedance with intermediate ground plane for separating circuit planes
US3564114A (en) * 1967-09-28 1971-02-16 Loral Corp Universal multilayer printed circuit board
GB1220370A (en) * 1968-08-13 1971-01-27 Litton Industries Inc Electrical circuit boards
DE1919110B2 (de) * 1969-04-15 1972-08-17 Siemens AG, 1000 Berlin u. 8000 München Anordnung fuer impulsbetrieb mit einem oder mehreren wellenleitersystemen
US3726002A (en) * 1971-08-27 1973-04-10 Ibm Process for forming a multi-layer glass-metal module adaptable for integral mounting to a dissimilar refractory substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5290065A (en) * 1976-01-23 1977-07-28 Oki Electric Ind Co Ltd Multiilayer printed circuit board
JPS52118965U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1976-03-04 1977-09-09
JPS5422575A (en) * 1977-07-22 1979-02-20 Hitachi Ltd Print circuit substrate
JPH03150895A (ja) * 1989-11-08 1991-06-27 Hitachi Ltd 多層回路基板及びその製造方法

Also Published As

Publication number Publication date
JPS5524718B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1980-07-01
US4016463A (en) 1977-04-05

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