JPS5066168A - - Google Patents

Info

Publication number
JPS5066168A
JPS5066168A JP48113907A JP11390773A JPS5066168A JP S5066168 A JPS5066168 A JP S5066168A JP 48113907 A JP48113907 A JP 48113907A JP 11390773 A JP11390773 A JP 11390773A JP S5066168 A JPS5066168 A JP S5066168A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP48113907A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP48113907A priority Critical patent/JPS5066168A/ja
Publication of JPS5066168A publication Critical patent/JPS5066168A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Microcomputers (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP48113907A 1973-10-12 1973-10-12 Pending JPS5066168A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP48113907A JPS5066168A (ja) 1973-10-12 1973-10-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP48113907A JPS5066168A (ja) 1973-10-12 1973-10-12

Publications (1)

Publication Number Publication Date
JPS5066168A true JPS5066168A (ja) 1975-06-04

Family

ID=14624151

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48113907A Pending JPS5066168A (ja) 1973-10-12 1973-10-12

Country Status (1)

Country Link
JP (1) JPS5066168A (ja)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55115061U (ja) * 1979-02-05 1980-08-13
JPS56116650A (en) * 1980-02-20 1981-09-12 Hitachi Ltd Semiconductor device
JPS57111048A (en) * 1980-12-26 1982-07-10 Hitachi Ltd Integrated circuit device
JPS5872844U (ja) * 1981-11-07 1983-05-17 日本ニユ−マチツク工業株式会社 Ｌｓｉパツケ−ジ
JPS58206147A (ja) * 1982-05-26 1983-12-01 Fujitsu Ltd 半導体装置モジユ−ル
JPS59104549U (ja) * 1982-12-28 1984-07-13 日本電気ホームエレクトロニクス株式会社 Ｉｃ装置
JPS59104487U (ja) * 1982-12-28 1984-07-13 日本電気ホームエレクトロニクス株式会社 ソケツト
JPS59192863U (ja) * 1983-06-10 1984-12-21 株式会社東芝 チツプ形電子部品
JPS6088554U (ja) * 1983-11-22 1985-06-18 三菱電機株式会社 モ−ルド形トランジスタモジユ−ル
JPS6154656A (ja) * 1984-08-24 1986-03-18 Fujitsu Ltd 半導体装置
JPH01144664A (ja) * 1988-03-01 1989-06-06 Mitsubishi Electric Corp 半導体メモリ用集積回路装置
EP0649010A2 (en) * 1993-10-14 1995-04-19 Fuji Electric Co. Ltd. Method for measuring pressure differences and device for converting displacements

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6020932Y2 (ja) * 1979-02-05 1985-06-22 日本電気株式会社 半導体装置
JPS55115061U (ja) * 1979-02-05 1980-08-13
JPS56116650A (en) * 1980-02-20 1981-09-12 Hitachi Ltd Semiconductor device
JPS57111048A (en) * 1980-12-26 1982-07-10 Hitachi Ltd Integrated circuit device
JPS5872844U (ja) * 1981-11-07 1983-05-17 日本ニユ−マチツク工業株式会社 Ｌｓｉパツケ−ジ
JPH0226785B2 (ja) * 1982-05-26 1990-06-12 Fujitsu Ltd
JPS58206147A (ja) * 1982-05-26 1983-12-01 Fujitsu Ltd 半導体装置モジユ−ル
JPS59104487U (ja) * 1982-12-28 1984-07-13 日本電気ホームエレクトロニクス株式会社 ソケツト
JPS59104549U (ja) * 1982-12-28 1984-07-13 日本電気ホームエレクトロニクス株式会社 Ｉｃ装置
JPS59192863U (ja) * 1983-06-10 1984-12-21 株式会社東芝 チツプ形電子部品
JPS6088554U (ja) * 1983-11-22 1985-06-18 三菱電機株式会社 モ−ルド形トランジスタモジユ−ル
JPH0452995Y2 (ja) * 1983-11-22 1992-12-14
JPS6154656A (ja) * 1984-08-24 1986-03-18 Fujitsu Ltd 半導体装置
JPH01144664A (ja) * 1988-03-01 1989-06-06 Mitsubishi Electric Corp 半導体メモリ用集積回路装置
EP0649010A2 (en) * 1993-10-14 1995-04-19 Fuji Electric Co. Ltd. Method for measuring pressure differences and device for converting displacements
EP0649010A3 (en) * 1993-10-14 1996-10-02 Fuji Electric Co Ltd Differential pressure measurement method and displacement conversion device.

Similar Documents

Publication Publication Date Title
AR201758A1 (ja)
AU476761B2 (ja)
AU465372B2 (ja)
AR201235Q (ja)
AR201231Q (ja)
AU474593B2 (ja)
AU474511B2 (ja)
AU474838B2 (ja)
AU465453B2 (ja)
AU465434B2 (ja)
AU471343B2 (ja)
AU450229B2 (ja)
AU476714B2 (ja)
AR201229Q (ja)
AU466283B2 (ja)
AU476696B2 (ja)
AU472848B2 (ja)
AR199451A1 (ja)
AU477823B2 (ja)
AR197627A1 (ja)
AR196382A1 (ja)
AR200256A1 (ja)
AU461342B2 (ja)
AR210729A1 (ja)
AR193950A1 (ja)