JPS5065868A - - Google Patents
Info
- Publication number
- JPS5065868A JPS5065868A JP11494673A JP11494673A JPS5065868A JP S5065868 A JPS5065868 A JP S5065868A JP 11494673 A JP11494673 A JP 11494673A JP 11494673 A JP11494673 A JP 11494673A JP S5065868 A JPS5065868 A JP S5065868A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11494673A JPS5065868A (en) | 1973-10-13 | 1973-10-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11494673A JPS5065868A (en) | 1973-10-13 | 1973-10-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5065868A true JPS5065868A (en) | 1975-06-03 |
Family
ID=14650556
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11494673A Pending JPS5065868A (en) | 1973-10-13 | 1973-10-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5065868A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5249469A (en) * | 1975-10-17 | 1977-04-20 | Hitachi Ltd | Printed circuit substrate plating pretreating method |
| JPS62200796A (en) * | 1986-02-27 | 1987-09-04 | イビデン株式会社 | Manufacture of extra-thin copper laminated board |
| JPH0222887A (en) * | 1988-07-12 | 1990-01-25 | Mitsubishi Gas Chem Co Inc | Manufacture of thin copper foil clad circuit board |
-
1973
- 1973-10-13 JP JP11494673A patent/JPS5065868A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5249469A (en) * | 1975-10-17 | 1977-04-20 | Hitachi Ltd | Printed circuit substrate plating pretreating method |
| JPS6019160B2 (en) * | 1975-10-17 | 1985-05-14 | 株式会社日立製作所 | printed circuit board processing method |
| JPS62200796A (en) * | 1986-02-27 | 1987-09-04 | イビデン株式会社 | Manufacture of extra-thin copper laminated board |
| JPH0222887A (en) * | 1988-07-12 | 1990-01-25 | Mitsubishi Gas Chem Co Inc | Manufacture of thin copper foil clad circuit board |