JPS5056880A - - Google Patents
Info
- Publication number
- JPS5056880A JPS5056880A JP10375473A JP10375473A JPS5056880A JP S5056880 A JPS5056880 A JP S5056880A JP 10375473 A JP10375473 A JP 10375473A JP 10375473 A JP10375473 A JP 10375473A JP S5056880 A JPS5056880 A JP S5056880A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Electrodes Of Semiconductors (AREA)
- Thyristors (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10375473A JPS5056880A (de) | 1973-09-17 | 1973-09-17 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10375473A JPS5056880A (de) | 1973-09-17 | 1973-09-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5056880A true JPS5056880A (de) | 1975-05-17 |
Family
ID=14362331
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10375473A Pending JPS5056880A (de) | 1973-09-17 | 1973-09-17 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5056880A (de) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5242383A (en) * | 1975-10-01 | 1977-04-01 | Toshiba Corp | Gate turn-off thryistor |
JPS5382278A (en) * | 1976-12-28 | 1978-07-20 | Toshiba Corp | Production of semiconductor device |
JPS5395584A (en) * | 1977-02-01 | 1978-08-21 | Toshiba Corp | Mesa type semiconductor device |
JPS572377U (de) * | 1980-06-04 | 1982-01-07 | ||
JPS5871656A (ja) * | 1981-10-23 | 1983-04-28 | Toshiba Corp | 圧接型半導体装置 |
-
1973
- 1973-09-17 JP JP10375473A patent/JPS5056880A/ja active Pending
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5242383A (en) * | 1975-10-01 | 1977-04-01 | Toshiba Corp | Gate turn-off thryistor |
JPS5382278A (en) * | 1976-12-28 | 1978-07-20 | Toshiba Corp | Production of semiconductor device |
JPS5726425B2 (de) * | 1976-12-28 | 1982-06-04 | ||
JPS5395584A (en) * | 1977-02-01 | 1978-08-21 | Toshiba Corp | Mesa type semiconductor device |
JPS572377U (de) * | 1980-06-04 | 1982-01-07 | ||
JPS6015097Y2 (ja) * | 1980-06-04 | 1985-05-13 | 富士電機株式会社 | 製氷機 |
JPS5871656A (ja) * | 1981-10-23 | 1983-04-28 | Toshiba Corp | 圧接型半導体装置 |