JPS5032788B1 - - Google Patents

Info

Publication number
JPS5032788B1
JPS5032788B1 JP6072370A JP6072370A JPS5032788B1 JP S5032788 B1 JPS5032788 B1 JP S5032788B1 JP 6072370 A JP6072370 A JP 6072370A JP 6072370 A JP6072370 A JP 6072370A JP S5032788 B1 JPS5032788 B1 JP S5032788B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6072370A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5032788B1 publication Critical patent/JPS5032788B1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D23/00—Control of temperature
    • G05D23/19—Control of temperature characterised by the use of electric means
    • G05D23/275—Control of temperature characterised by the use of electric means with sensing element expanding, contracting, or fusing in response to changes of temperature
    • G05D23/27535—Details of the sensing element
    • G05D23/2754—Details of the sensing element using bimetallic element
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/02—Details
    • H01H37/32—Thermally-sensitive members
    • H01H37/52—Thermally-sensitive members actuated due to deflection of bimetallic element
    • H01H37/54—Thermally-sensitive members actuated due to deflection of bimetallic element wherein the bimetallic element is inherently snap acting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/045—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body the other leads having an insulating passage through the base
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Thermal Sciences (AREA)
  • Thermally Actuated Switches (AREA)
  • Die Bonding (AREA)
  • Power Conversion In General (AREA)
JP6072370A 1969-07-17 1970-07-13 Pending JPS5032788B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US84251669A 1969-07-17 1969-07-17

Publications (1)

Publication Number Publication Date
JPS5032788B1 true JPS5032788B1 (ja) 1975-10-24

Family

ID=25287505

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6072370A Pending JPS5032788B1 (ja) 1969-07-17 1970-07-13

Country Status (4)

Country Link
US (1) US3575645A (ja)
JP (1) JPS5032788B1 (ja)
DE (1) DE2035398C3 (ja)
GB (1) GB1257404A (ja)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3699403A (en) * 1970-10-23 1972-10-17 Rca Corp Fusible semiconductor device including means for reducing the required fusing current
US3693047A (en) * 1971-09-28 1972-09-19 Gen Electric Apparatus for protecting electrical devices
US3700969A (en) * 1972-02-14 1972-10-24 Gen Motors Corp Repairable semiconductor assembly
US3832606A (en) * 1973-02-15 1974-08-27 Gen Motors Corp Semiconductor diode package with protection fuse
US3845440A (en) * 1973-12-04 1974-10-29 Texas Instruments Inc Time delay relay
US4268812A (en) * 1979-06-18 1981-05-19 Satterlee Jesse D Miniature device for sensing overheating of bearings
DE3009192C2 (de) * 1980-03-11 1984-05-10 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Überlastschutzanordnung
NL8002635A (nl) * 1980-05-08 1981-12-01 Philips Nv Programmeerbare halfgeleiderinrichting en werkwijze ter vervaardiging daarvan.
US4367452A (en) * 1982-02-11 1983-01-04 Elmwood Sensors, Inc. Thermostatic switch construction
US4456941A (en) * 1982-09-23 1984-06-26 Carrier Corporation Protection device
US4774558A (en) * 1984-03-05 1988-09-27 Hughes Aircraft Company Thermally-activated, shorting diode switch having non-operationally-alterable junction path
DE3426199C2 (de) * 1984-07-17 1994-02-03 Asea Brown Boveri Überbrückungselement
DE3426200C2 (de) * 1984-07-17 1994-02-10 Asea Brown Boveri Überbrückungselement
IT1183036B (it) * 1985-12-04 1987-10-05 Texas Instruments Italia Spa Dispositivo protettore termico a bimetallo per dispositivi a semiconduttore e simili
FR2591028B3 (fr) * 1985-12-04 1988-03-18 Texas Instruments Italia Spa Dispositif de protection thermique bimetallique pour dispositifs semiconducteurs ou similaires
DE19720610C2 (de) * 1997-05-16 2003-02-27 Abb Patent Gmbh Übertemperaturschutzeinrichtung
US6879239B2 (en) * 2002-04-08 2005-04-12 Woodlane Environmental Technology, Inc. Thermostat assembly
EP1443546A3 (en) * 2003-01-28 2009-05-06 Hitachi Ltd. Working method of metal material and semiconductor apparatus fabricated by the method
WO2017201656A1 (en) * 2016-05-23 2017-11-30 Littelfuse Semiconductor (Wuxi) Co., Ltd. Transient voltage suppression device with thermal cutoff

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1738113A (en) * 1928-06-26 1929-12-03 Kodel Radio Corp Rectifier for alternating current
US3226603A (en) * 1961-06-05 1965-12-28 Int Rectifier Corp High current rectifier employing a plurality of wafers having respective fuse elements
DE1260538B (de) * 1964-09-09 1968-02-08 Siemens Ag Druckelektrischer Wandler
US3386007A (en) * 1965-07-22 1968-05-28 Sprague Electric Co Multi-shot voltage sensitive switch for protecting components or circuits subject tovariable voltage conditions
US3401317A (en) * 1966-07-11 1968-09-10 Int Rectifier Corp Fused semiconductor device

Also Published As

Publication number Publication date
DE2035398B2 (de) 1973-04-19
US3575645A (en) 1971-04-20
DE2035398C3 (de) 1973-11-15
DE2035398A1 (de) 1971-02-04
GB1257404A (ja) 1971-12-15

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