JPS5023972A - - Google Patents

Info

Publication number
JPS5023972A
JPS5023972A JP49063004A JP6300474A JPS5023972A JP S5023972 A JPS5023972 A JP S5023972A JP 49063004 A JP49063004 A JP 49063004A JP 6300474 A JP6300474 A JP 6300474A JP S5023972 A JPS5023972 A JP S5023972A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP49063004A
Other versions
JPS5720709B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5023972A publication Critical patent/JPS5023972A/ja
Publication of JPS5720709B2 publication Critical patent/JPS5720709B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W72/20—
    • H10W72/07236—
    • H10W72/251—
    • H10W72/252—
    • H10W72/923—
    • H10W72/952—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49144—Assembling to base an electrical component, e.g., capacitor, etc. by metal fusion

Landscapes

  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP6300474A 1973-06-25 1974-06-05 Expired JPS5720709B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US00373524A US3839727A (en) 1973-06-25 1973-06-25 Semiconductor chip to substrate solder bond using a locally dispersed, ternary intermetallic compound

Publications (2)

Publication Number Publication Date
JPS5023972A true JPS5023972A (ja) 1975-03-14
JPS5720709B2 JPS5720709B2 (ja) 1982-04-30

Family

ID=23472749

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6300474A Expired JPS5720709B2 (ja) 1973-06-25 1974-06-05

Country Status (8)

Country Link
US (1) US3839727A (ja)
JP (1) JPS5720709B2 (ja)
BE (1) BE816811A (ja)
CA (1) CA1007760A (ja)
DE (1) DE2424857C2 (ja)
FR (1) FR2234661B1 (ja)
GB (1) GB1481015A (ja)
IT (1) IT1012362B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002280417A (ja) * 2001-01-15 2002-09-27 Nec Corp 半導体装置及びその製造方法並びに半導体製造装置
JP2014007227A (ja) * 2012-06-22 2014-01-16 Murata Mfg Co Ltd 電子部品モジュールおよびその製造方法

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US4290079A (en) * 1979-06-29 1981-09-15 International Business Machines Corporation Improved solder interconnection between a semiconductor device and a supporting substrate
US4360142A (en) * 1979-06-29 1982-11-23 International Business Machines Corporation Method of forming a solder interconnection capable of sustained high power levels between a semiconductor device and a supporting substrate
US4352449A (en) * 1979-12-26 1982-10-05 Bell Telephone Laboratories, Incorporated Fabrication of circuit packages
US4498096A (en) * 1981-01-30 1985-02-05 Motorola, Inc. Button rectifier package for non-planar die
JPS5839047A (ja) * 1981-09-02 1983-03-07 Hitachi Ltd 半導体装置およびその製法
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
US4664309A (en) * 1983-06-30 1987-05-12 Raychem Corporation Chip mounting device
US4672739A (en) * 1985-04-11 1987-06-16 International Business Machines Corporation Method for use in brazing an interconnect pin to a metallization pattern situated on a brittle dielectric substrate
US4755631A (en) * 1985-04-11 1988-07-05 International Business Machines Corporation Apparatus for providing an electrical connection to a metallic pad situated on a brittle dielectric substrate
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
DE3788263T2 (de) * 1986-09-25 1994-03-24 Toshiba Kawasaki Kk Verfahren zum elektrischen Verbinden von zwei Objekten.
US4757934A (en) * 1987-02-06 1988-07-19 Motorola, Inc. Low stress heat sinking for semiconductors
US4950623A (en) * 1988-08-02 1990-08-21 Microelectronics Center Of North Carolina Method of building solder bumps
US5038996A (en) * 1988-10-12 1991-08-13 International Business Machines Corporation Bonding of metallic surfaces
US5048744A (en) * 1988-12-23 1991-09-17 International Business Machines Corporation Palladium enhanced fluxless soldering and bonding of semiconductor device contacts
US5225711A (en) * 1988-12-23 1993-07-06 International Business Machines Corporation Palladium enhanced soldering and bonding of semiconductor device contacts
EP0374475B1 (en) * 1988-12-23 1993-06-09 International Business Machines Corporation Soldering and bonding of semiconductor device contacts
US5121871A (en) * 1990-04-20 1992-06-16 The United States Of America As Represented By The United States Department Of Energy Solder extrusion pressure bonding process and bonded products produced thereby
US5298685A (en) * 1990-10-30 1994-03-29 International Business Machines Corporation Interconnection method and structure for organic circuit boards
US5237269A (en) * 1991-03-27 1993-08-17 International Business Machines Corporation Connections between circuit chips and a temporary carrier for use in burn-in tests
US5262347A (en) * 1991-08-14 1993-11-16 Bell Communications Research, Inc. Palladium welding of a semiconductor body
JP3077316B2 (ja) * 1991-10-30 2000-08-14 富士電機株式会社 集積回路装置
US5289631A (en) * 1992-03-04 1994-03-01 Mcnc Method for testing, burn-in, and/or programming of integrated circuit chips
US5428249A (en) * 1992-07-15 1995-06-27 Canon Kabushiki Kaisha Photovoltaic device with improved collector electrode
US5221038A (en) * 1992-10-05 1993-06-22 Motorola, Inc. Method for forming tin-indium or tin-bismuth solder connection having increased melting temperature
JP2967666B2 (ja) * 1992-12-08 1999-10-25 株式会社村田製作所 チップ型電子部品
WO1994018350A1 (fr) * 1993-02-03 1994-08-18 World Metal Co., Ltd. Alliage a plaquer, son procede de placage et solution de placage
US5719447A (en) 1993-06-03 1998-02-17 Intel Corporation Metal alloy interconnections for integrated circuits
US5820014A (en) * 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
JP2664878B2 (ja) * 1994-01-31 1997-10-22 インターナショナル・ビジネス・マシーンズ・コーポレイション 半導体チップパッケージおよびその製造方法
US5542174A (en) * 1994-09-15 1996-08-06 Intel Corporation Method and apparatus for forming solder balls and solder columns
TW253856B (en) * 1994-12-13 1995-08-11 At & T Corp Method of solder bonding, and article produced by the method
ATE271718T1 (de) 1995-03-20 2004-08-15 Unitive Int Ltd Löthöcker-herstellungsverfahren und strukturen mit einer titan-sperrschicht
US5994152A (en) * 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US6002172A (en) 1997-03-12 1999-12-14 International Business Machines Corporation Substrate structure and method for improving attachment reliability of semiconductor chips and modules
US6082610A (en) 1997-06-23 2000-07-04 Ford Motor Company Method of forming interconnections on electronic modules
US6337522B1 (en) 1997-07-10 2002-01-08 International Business Machines Corporation Structure employing electrically conductive adhesives
US6297559B1 (en) * 1997-07-10 2001-10-02 International Business Machines Corporation Structure, materials, and applications of ball grid array interconnections
US6120885A (en) 1997-07-10 2000-09-19 International Business Machines Corporation Structure, materials, and methods for socketable ball grid
US6025649A (en) 1997-07-22 2000-02-15 International Business Machines Corporation Pb-In-Sn tall C-4 for fatigue enhancement
US6080494A (en) * 1997-08-29 2000-06-27 Texas Instruments Incorporated Method to manufacture ball grid arrays with excellent solder ball adhesion for semiconductor packaging and the array
US6347901B1 (en) * 1999-11-01 2002-02-19 International Business Machines Corporation Solder interconnect techniques
US6613671B1 (en) * 2000-03-03 2003-09-02 Micron Technology, Inc. Conductive connection forming methods, oxidation reducing methods, and integrated circuits formed thereby
DE50014427D1 (de) * 2000-07-28 2007-08-02 Infineon Technologies Ag Verfahren zur Kontaktierung eines Halbleiterbauelementes
DE60108413T2 (de) 2000-11-10 2005-06-02 Unitive Electronics, Inc. Verfahren zum positionieren von komponenten mit hilfe flüssiger antriebsmittel und strukturen hierfür
US20020056742A1 (en) * 2000-11-10 2002-05-16 Rinne Glenn A. Methods and systems for attaching substrates to one another using solder structures having portions with different melting points
US6863209B2 (en) 2000-12-15 2005-03-08 Unitivie International Limited Low temperature methods of bonding components
WO2004001837A2 (en) 2002-06-25 2003-12-31 Unitive International Limited Methods of forming electronic structures including conductive shunt layers and related structures
US7547623B2 (en) 2002-06-25 2009-06-16 Unitive International Limited Methods of forming lead free solder bumps
US7531898B2 (en) 2002-06-25 2009-05-12 Unitive International Limited Non-Circular via holes for bumping pads and related structures
TWI225899B (en) 2003-02-18 2005-01-01 Unitive Semiconductor Taiwan C Etching solution and method for manufacturing conductive bump using the etching solution to selectively remove barrier layer
US7005745B2 (en) * 2004-01-22 2006-02-28 Texas Instruments Incorporated Method and structure to reduce risk of gold embrittlement in solder joints
US20060060639A1 (en) * 2004-09-21 2006-03-23 Byrne Tiffany A Doped contact formations
US7726545B2 (en) * 2005-03-16 2010-06-01 Panasonic Corporation Flip chip mounting process and bump-forming process using electrically-conductive particles as nuclei
CN101156236B (zh) * 2005-04-06 2011-11-16 松下电器产业株式会社 倒装片安装方法及凸块形成方法
KR100790978B1 (ko) * 2006-01-24 2008-01-02 삼성전자주식회사 저온에서의 접합 방법, 및 이를 이용한 반도체 패키지 실장 방법
JP5438114B2 (ja) * 2008-09-18 2014-03-12 アイメック 材料ボンディングのための方法およびシステム
US7902060B2 (en) * 2008-12-23 2011-03-08 Intel Corporation Attachment using magnetic particle based solder composites
JP2010179336A (ja) * 2009-02-05 2010-08-19 Toyota Central R&D Labs Inc 接合体、半導体モジュール、及び接合体の製造方法
US9847308B2 (en) * 2010-04-28 2017-12-19 Intel Corporation Magnetic intermetallic compound interconnect
US8939347B2 (en) 2010-04-28 2015-01-27 Intel Corporation Magnetic intermetallic compound interconnect
US8313958B2 (en) 2010-05-12 2012-11-20 Intel Corporation Magnetic microelectronic device attachment
US8434668B2 (en) 2010-05-12 2013-05-07 Intel Corporation Magnetic attachment structure
US8609532B2 (en) 2010-05-26 2013-12-17 Intel Corporation Magnetically sintered conductive via
TW201208007A (en) * 2010-08-02 2012-02-16 Advanced Semiconductor Eng Semiconductor package
US8997832B1 (en) * 2010-11-23 2015-04-07 Western Digital (Fremont), Llc Method of fabricating micrometer scale components
US9024205B2 (en) 2012-12-03 2015-05-05 Invensas Corporation Advanced device assembly structures and methods
US9324566B1 (en) * 2014-12-31 2016-04-26 International Business Machines Corporation Controlled spalling using a reactive material stack
US9738056B2 (en) 2015-09-23 2017-08-22 Toyota Motor Engineering & Manufacturing North America, Inc. Systems of bonded substrates and methods for bonding substrates
US11682640B2 (en) 2020-11-24 2023-06-20 International Business Machines Corporation Protective surface layer on under bump metallurgy for solder joining

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE577086A (ja) * 1958-04-03 1900-01-01
US3429040A (en) * 1965-06-18 1969-02-25 Ibm Method of joining a component to a substrate
US3436818A (en) * 1965-12-13 1969-04-08 Ibm Method of fabricating a bonded joint
US3458925A (en) * 1966-01-20 1969-08-05 Ibm Method of forming solder mounds on substrates
US3585713A (en) * 1968-03-25 1971-06-22 Sony Corp Method of making connecting parts of semiconductor devices or the like
CA892844A (en) * 1970-08-14 1972-02-08 H. Hantusch Gerald Semiconductor heat sink

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
IBM TECHNICAL DISCLOSURE BULLETIN#N11=1966 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002280417A (ja) * 2001-01-15 2002-09-27 Nec Corp 半導体装置及びその製造方法並びに半導体製造装置
JP2014007227A (ja) * 2012-06-22 2014-01-16 Murata Mfg Co Ltd 電子部品モジュールおよびその製造方法

Also Published As

Publication number Publication date
DE2424857A1 (de) 1975-01-16
GB1481015A (en) 1977-07-27
DE2424857C2 (de) 1985-11-28
FR2234661A1 (ja) 1975-01-17
JPS5720709B2 (ja) 1982-04-30
CA1007760A (en) 1977-03-29
FR2234661B1 (ja) 1976-06-25
IT1012362B (it) 1977-03-10
US3839727A (en) 1974-10-01
BE816811A (fr) 1974-10-16

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