JPS5020012B1 - - Google Patents

Info

Publication number
JPS5020012B1
JPS5020012B1 JP2289865A JP2289865A JPS5020012B1 JP S5020012 B1 JPS5020012 B1 JP S5020012B1 JP 2289865 A JP2289865 A JP 2289865A JP 2289865 A JP2289865 A JP 2289865A JP S5020012 B1 JPS5020012 B1 JP S5020012B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2289865A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5020012B1 publication Critical patent/JPS5020012B1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
JP2289865A 1964-06-24 1965-04-17 Pending JPS5020012B1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US37750964A 1964-06-24 1964-06-24

Publications (1)

Publication Number Publication Date
JPS5020012B1 true JPS5020012B1 (zh) 1975-07-11

Family

ID=23489393

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2289865A Pending JPS5020012B1 (zh) 1964-06-24 1965-04-17

Country Status (4)

Country Link
JP (1) JPS5020012B1 (zh)
DK (1) DK130725B (zh)
GB (1) GB1058915A (zh)
SE (1) SE316667B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA945305A (en) * 1970-04-20 1974-04-16 Frederick W. Schneble (Jr.) Electroless silver plating
DE3707817A1 (de) * 1987-03-09 1988-09-22 Schering Ag Stabilisiertes alkalisches goldbad zur stromlosen abscheidung von gold
JP5840454B2 (ja) * 2011-10-27 2016-01-06 上村工業株式会社 還元型無電解銀めっき液及び還元型無電解銀めっき方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3062666A (en) * 1958-11-26 1962-11-06 Du Pont Bath compositions for the chemical reductive plating of nickel-boron and cobalt-boron alloys

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3062666A (en) * 1958-11-26 1962-11-06 Du Pont Bath compositions for the chemical reductive plating of nickel-boron and cobalt-boron alloys

Also Published As

Publication number Publication date
GB1058915A (en) 1967-02-15
DK130725C (zh) 1975-09-01
SE316667B (zh) 1969-10-27
DK130725B (da) 1975-04-01

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