JPS5019363A - - Google Patents
Info
- Publication number
- JPS5019363A JPS5019363A JP6924573A JP6924573A JPS5019363A JP S5019363 A JPS5019363 A JP S5019363A JP 6924573 A JP6924573 A JP 6924573A JP 6924573 A JP6924573 A JP 6924573A JP S5019363 A JPS5019363 A JP S5019363A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Formation Of Insulating Films (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6924573A JPS5019363A (ja) | 1973-06-21 | 1973-06-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6924573A JPS5019363A (ja) | 1973-06-21 | 1973-06-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5019363A true JPS5019363A (ja) | 1975-02-28 |
Family
ID=13397160
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6924573A Pending JPS5019363A (ja) | 1973-06-21 | 1973-06-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5019363A (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55143039A (en) * | 1979-04-25 | 1980-11-08 | Hitachi Ltd | Treating method of semiconductor wafer with heat |
| JPS58197826A (ja) * | 1982-05-14 | 1983-11-17 | Hitachi Ltd | 半導体装置の製造方法 |
| JPS6110255A (ja) * | 1985-05-02 | 1986-01-17 | Hitachi Ltd | 半導体装置の製造方法 |
| WO2003048041A1 (fr) * | 2001-12-06 | 2003-06-12 | Kst World Corp. | Procede permettant de former une couche de dioxyde de silicium |
-
1973
- 1973-06-21 JP JP6924573A patent/JPS5019363A/ja active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55143039A (en) * | 1979-04-25 | 1980-11-08 | Hitachi Ltd | Treating method of semiconductor wafer with heat |
| JPS58197826A (ja) * | 1982-05-14 | 1983-11-17 | Hitachi Ltd | 半導体装置の製造方法 |
| JPH0122731B2 (ja) * | 1982-05-14 | 1989-04-27 | Hitachi Ltd | |
| JPS6110255A (ja) * | 1985-05-02 | 1986-01-17 | Hitachi Ltd | 半導体装置の製造方法 |
| JPS6216013B2 (ja) * | 1985-05-02 | 1987-04-10 | Hitachi Ltd | |
| WO2003048041A1 (fr) * | 2001-12-06 | 2003-06-12 | Kst World Corp. | Procede permettant de former une couche de dioxyde de silicium |
| US7754286B2 (en) | 2001-12-06 | 2010-07-13 | Kst World Corp. | Method of forming a silicon dioxide film |