JPS5018239B1 - - Google Patents

Info

Publication number
JPS5018239B1
JPS5018239B1 JP45027767A JP2776770A JPS5018239B1 JP S5018239 B1 JPS5018239 B1 JP S5018239B1 JP 45027767 A JP45027767 A JP 45027767A JP 2776770 A JP2776770 A JP 2776770A JP S5018239 B1 JPS5018239 B1 JP S5018239B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP45027767A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5018239B1 publication Critical patent/JPS5018239B1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP45027767A 1969-04-01 1970-04-01 Pending JPS5018239B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH495069A CH522464A (fr) 1969-04-01 1969-04-01 Dispositif d'usinage par laser

Publications (1)

Publication Number Publication Date
JPS5018239B1 true JPS5018239B1 (ja) 1975-06-27

Family

ID=4285342

Family Applications (1)

Application Number Title Priority Date Filing Date
JP45027767A Pending JPS5018239B1 (ja) 1969-04-01 1970-04-01

Country Status (9)

Country Link
US (1) US3622740A (ja)
JP (1) JPS5018239B1 (ja)
CH (1) CH522464A (ja)
DE (1) DE2014448C3 (ja)
FR (1) FR2042185A5 (ja)
GB (1) GB1262613A (ja)
NL (1) NL159826B (ja)
SE (1) SE359048B (ja)
SU (1) SU673157A3 (ja)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3943324A (en) * 1970-12-14 1976-03-09 Arthur D. Little, Inc. Apparatus for forming refractory tubing
CH562078A5 (ja) * 1972-05-30 1975-05-30 Omega Brandt & Freres Sa Louis
DE2350933C3 (de) * 1973-10-10 1981-10-29 Winkler & Dünnebier, Maschinenfabrik und Eisengießerei GmbH & Co KG, 5450 Neuwied Vorrichtung zum Formbrennschneiden einer bewegten Materialbahn mittels eines Laserstrahles
US4060769A (en) * 1974-09-20 1977-11-29 Battelle Memorial Institute Directing radiation
US3993402A (en) * 1974-10-29 1976-11-23 Photon Sources, Inc. Apparatus for directing a laser beam
US4083629A (en) * 1976-11-29 1978-04-11 Gte Laboratories Incorporated Beam splitting system for a welding laser
JPS583478B2 (ja) * 1978-03-03 1983-01-21 株式会社日立製作所 レ−ザ加熱方法および装置
CA1119912A (en) * 1978-05-22 1982-03-16 Ernest Cashwell Apparatus and method for perforating articles by laser
US4410785A (en) * 1978-06-07 1983-10-18 Philip Morris Incorporated Method and apparatus for perforation of sheet material by laser
GB2022492B (en) * 1978-06-07 1982-06-09 Philip Morris Inc Method and apparatus for perforation of sheet material by laser
US4439663A (en) * 1978-08-10 1984-03-27 Philip Morris Incorporated Method and system for laser perforation of sheet material
US4327277A (en) * 1978-08-24 1982-04-27 Raytheon Company Method for laser soldering
US4404454A (en) * 1978-09-20 1983-09-13 Philip Morris Incorporated Light energy perforation apparatus and system
DE2853258A1 (de) * 1978-12-09 1980-06-12 Hoesch Werke Ag Verfahren und anordnung zum aufbringen einer kennzeichnung auf der oberflaeche von bewegten tafeln und baendern
US4404452A (en) * 1979-06-08 1983-09-13 Philip Morris Incorporated Optical perforating apparatus and system
FR2464658A1 (fr) * 1980-06-16 1981-03-20 Philip Morris Inc Procede et appareil pour perforer des articles, notamment des cigarettes au moyen d'un laser
EP0129603A4 (en) * 1982-12-17 1985-06-10 Inoue Japax Res CUTTING DEVICE WITH LASER.
DE3333386A1 (de) * 1983-09-15 1985-04-11 Siemens AG, 1000 Berlin und 8000 München Verfahren und einrichtung zum beschriften von teilen, insbesondere von elektronischen bauelementen
US4691093A (en) * 1986-04-22 1987-09-01 United Technologies Corporation Twin spot laser welding
GB2227965B (en) * 1988-10-12 1993-02-10 Rolls Royce Plc Apparatus for drilling a shaped hole in a workpiece
US4927226A (en) * 1989-03-27 1990-05-22 General Electric Company Multiplexer for high power CW lasers
DE19902909C2 (de) * 1999-01-26 2001-03-15 Fraunhofer Ges Forschung Vorrichtung und Verfahren zum Bearbeiten von Werkstücken mit Laserstrahlung
US7411150B2 (en) * 2002-06-12 2008-08-12 Alstom Technology Ltd. Method of producing a composite component
US8049135B2 (en) * 2004-06-18 2011-11-01 Electro Scientific Industries, Inc. Systems and methods for alignment of laser beam(s) for semiconductor link processing
CN104297926A (zh) * 2014-11-12 2015-01-21 核工业理化工程研究院 高功率激光分光光纤装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3419321A (en) * 1966-02-24 1968-12-31 Lear Siegler Inc Laser optical apparatus for cutting holes

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3262122A (en) * 1963-05-01 1966-07-19 Ibm Thermoplastic memory
US3256524A (en) * 1963-11-29 1966-06-14 Honeywell Inc Laser recording apparatus
US3463898A (en) * 1965-07-09 1969-08-26 Tokyo Shibaura Electric Co Welding device utilizing laser beams
US3364497A (en) * 1966-05-18 1968-01-16 Eastman Kodak Co Recording of digital data

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3419321A (en) * 1966-02-24 1968-12-31 Lear Siegler Inc Laser optical apparatus for cutting holes

Also Published As

Publication number Publication date
DE2014448A1 (de) 1970-10-08
SE359048B (ja) 1973-08-20
NL159826B (nl) 1979-03-15
NL7004278A (ja) 1970-10-05
DE2014448B2 (de) 1973-05-10
GB1262613A (en) 1972-02-02
FR2042185A5 (ja) 1971-02-05
US3622740A (en) 1971-11-23
DE2014448C3 (de) 1973-11-29
CH522464A (fr) 1972-06-30
SU673157A3 (ru) 1979-07-05

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