JPS5010564A - - Google Patents
Info
- Publication number
- JPS5010564A JPS5010564A JP5780973A JP5780973A JPS5010564A JP S5010564 A JPS5010564 A JP S5010564A JP 5780973 A JP5780973 A JP 5780973A JP 5780973 A JP5780973 A JP 5780973A JP S5010564 A JPS5010564 A JP S5010564A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5780973A JPS5010564A (ja) | 1973-05-25 | 1973-05-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5780973A JPS5010564A (ja) | 1973-05-25 | 1973-05-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5010564A true JPS5010564A (ja) | 1975-02-03 |
Family
ID=13066237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5780973A Pending JPS5010564A (ja) | 1973-05-25 | 1973-05-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5010564A (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5821847A (ja) * | 1981-07-31 | 1983-02-08 | Nec Corp | 電子部品取付用構成体の製造方法 |
| JPS58155747A (ja) * | 1982-03-12 | 1983-09-16 | Kyodo Printing Co Ltd | Ｉｃ基板の製法 |
| JPS61140533U (ja) * | 1985-02-21 | 1986-08-30 | ||
| JPH01217933A (ja) * | 1988-02-26 | 1989-08-31 | Hitachi Ltd | テープキャリア |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4528098Y1 (ja) * | 1967-08-22 | 1970-10-29 |
-
1973
- 1973-05-25 JP JP5780973A patent/JPS5010564A/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4528098Y1 (ja) * | 1967-08-22 | 1970-10-29 |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5821847A (ja) * | 1981-07-31 | 1983-02-08 | Nec Corp | 電子部品取付用構成体の製造方法 |
| JPS6244855B2 (ja) * | 1981-07-31 | 1987-09-22 | Nippon Denki Kk | |
| JPS58155747A (ja) * | 1982-03-12 | 1983-09-16 | Kyodo Printing Co Ltd | Ｉｃ基板の製法 |
| JPH0219977B2 (ja) * | 1982-03-12 | 1990-05-07 | Kyodo Printing Co Ltd | |
| JPS61140533U (ja) * | 1985-02-21 | 1986-08-30 | ||
| JPH01217933A (ja) * | 1988-02-26 | 1989-08-31 | Hitachi Ltd | テープキャリア |