JPS50105270A - - Google Patents
Info
- Publication number
- JPS50105270A JPS50105270A JP1051874A JP1051874A JPS50105270A JP S50105270 A JPS50105270 A JP S50105270A JP 1051874 A JP1051874 A JP 1051874A JP 1051874 A JP1051874 A JP 1051874A JP S50105270 A JPS50105270 A JP S50105270A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1051874A JPS50105270A (ja) | 1974-01-23 | 1974-01-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1051874A JPS50105270A (ja) | 1974-01-23 | 1974-01-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS50105270A true JPS50105270A (ja) | 1975-08-19 |
Family
ID=11752437
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1051874A Pending JPS50105270A (ja) | 1974-01-23 | 1974-01-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS50105270A (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62183151A (ja) * | 1986-02-06 | 1987-08-11 | Hitachi Maxell Ltd | 半導体装置の製造方法 |
JP2008227521A (ja) * | 2008-04-07 | 2008-09-25 | Renesas Technology Corp | 半導体ウエハおよび半導体装置の製造方法 |
JP2011071254A (ja) * | 2009-09-25 | 2011-04-07 | Mitsubishi Electric Corp | 炭化珪素基板およびその製造方法 |
JP2011210770A (ja) * | 2010-03-29 | 2011-10-20 | Fuji Electric Co Ltd | 半導体素子の製造方法 |
JP2011253915A (ja) * | 2010-06-02 | 2011-12-15 | Shin Etsu Handotai Co Ltd | シリコンウェーハ |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49131781A (ja) * | 1973-04-24 | 1974-12-17 |
-
1974
- 1974-01-23 JP JP1051874A patent/JPS50105270A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS49131781A (ja) * | 1973-04-24 | 1974-12-17 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62183151A (ja) * | 1986-02-06 | 1987-08-11 | Hitachi Maxell Ltd | 半導体装置の製造方法 |
JP2008227521A (ja) * | 2008-04-07 | 2008-09-25 | Renesas Technology Corp | 半導体ウエハおよび半導体装置の製造方法 |
JP4724729B2 (ja) * | 2008-04-07 | 2011-07-13 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
JP2011071254A (ja) * | 2009-09-25 | 2011-04-07 | Mitsubishi Electric Corp | 炭化珪素基板およびその製造方法 |
JP2011210770A (ja) * | 2010-03-29 | 2011-10-20 | Fuji Electric Co Ltd | 半導体素子の製造方法 |
JP2011253915A (ja) * | 2010-06-02 | 2011-12-15 | Shin Etsu Handotai Co Ltd | シリコンウェーハ |