JPS498171A - - Google Patents
Info
- Publication number
- JPS498171A JPS498171A JP47046155A JP4615572A JPS498171A JP S498171 A JPS498171 A JP S498171A JP 47046155 A JP47046155 A JP 47046155A JP 4615572 A JP4615572 A JP 4615572A JP S498171 A JPS498171 A JP S498171A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/4901—Structure
- H01L2224/4903—Connectors having different sizes, e.g. different diameters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47046155A JPS498171A (ja) | 1972-05-10 | 1972-05-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP47046155A JPS498171A (ja) | 1972-05-10 | 1972-05-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS498171A true JPS498171A (ja) | 1974-01-24 |
Family
ID=12739085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP47046155A Pending JPS498171A (ja) | 1972-05-10 | 1972-05-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS498171A (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5542698U (ja) * | 1978-09-14 | 1980-03-19 | ||
| JPS55114765U (ja) * | 1979-02-09 | 1980-08-13 | ||
| JPS58115842A (ja) * | 1981-12-28 | 1983-07-09 | Fujitsu Ltd | 半導体装置 |
-
1972
- 1972-05-10 JP JP47046155A patent/JPS498171A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5542698U (ja) * | 1978-09-14 | 1980-03-19 | ||
| JPS55114765U (ja) * | 1979-02-09 | 1980-08-13 | ||
| JPS6138849Y2 (ja) * | 1979-02-09 | 1986-11-08 | ||
| JPS58115842A (ja) * | 1981-12-28 | 1983-07-09 | Fujitsu Ltd | 半導体装置 |