JPS4885559U - - Google Patents

Info

Publication number
JPS4885559U
JPS4885559U JP1972006449U JP644972U JPS4885559U JP S4885559 U JPS4885559 U JP S4885559U JP 1972006449 U JP1972006449 U JP 1972006449U JP 644972 U JP644972 U JP 644972U JP S4885559 U JPS4885559 U JP S4885559U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1972006449U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1972006449U priority Critical patent/JPS4885559U/ja
Publication of JPS4885559U publication Critical patent/JPS4885559U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP1972006449U 1972-01-13 1972-01-13 Pending JPS4885559U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1972006449U JPS4885559U (ja) 1972-01-13 1972-01-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1972006449U JPS4885559U (ja) 1972-01-13 1972-01-13

Publications (1)

Publication Number Publication Date
JPS4885559U true JPS4885559U (ja) 1973-10-17

Family

ID=27848104

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1972006449U Pending JPS4885559U (ja) 1972-01-13 1972-01-13

Country Status (1)

Country Link
JP (1) JPS4885559U (ja)

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