JPS4979686A - - Google Patents

Info

Publication number
JPS4979686A
JPS4979686A JP12270872A JP12270872A JPS4979686A JP S4979686 A JPS4979686 A JP S4979686A JP 12270872 A JP12270872 A JP 12270872A JP 12270872 A JP12270872 A JP 12270872A JP S4979686 A JPS4979686 A JP S4979686A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12270872A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12270872A priority Critical patent/JPS4979686A/ja
Publication of JPS4979686A publication Critical patent/JPS4979686A/ja
Pending legal-status Critical Current

Links

JP12270872A 1972-12-07 1972-12-07 Pending JPS4979686A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12270872A JPS4979686A (ja) 1972-12-07 1972-12-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12270872A JPS4979686A (ja) 1972-12-07 1972-12-07

Publications (1)

Publication Number Publication Date
JPS4979686A true JPS4979686A (ja) 1974-08-01

Family

ID=14842629

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12270872A Pending JPS4979686A (ja) 1972-12-07 1972-12-07

Country Status (1)

Country Link
JP (1) JPS4979686A (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5481073A (en) * 1977-12-12 1979-06-28 Seiko Instr & Electronics Ltd Sealing method for semiconductor element
JPS5624956A (en) * 1979-08-08 1981-03-10 Nec Corp Resin-sealed semiconductor device
JPS6293963A (ja) * 1985-10-21 1987-04-30 Mitsubishi Electric Corp 樹脂封止形半導体集積回路装置
US10357609B2 (en) 2012-05-07 2019-07-23 Antares Pharma, Inc. Needle assisted jet injection device having reduced trigger force
US10478559B2 (en) 2012-03-06 2019-11-19 Antares Pharma, Inc. Prefilled syringe with breakaway force feature
US10478560B2 (en) 2005-01-24 2019-11-19 Antares Pharma, Inc. Prefilled syringe injector
US10543316B2 (en) 2006-05-03 2020-01-28 Antares Pharma, Inc. Injector with adjustable dosing
US10568809B2 (en) 2011-07-15 2020-02-25 Ferring B.V. Liquid-transfer adapter beveled spike

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5481073A (en) * 1977-12-12 1979-06-28 Seiko Instr & Electronics Ltd Sealing method for semiconductor element
JPS57655B2 (ja) * 1977-12-12 1982-01-07
JPS5624956A (en) * 1979-08-08 1981-03-10 Nec Corp Resin-sealed semiconductor device
JPS6293963A (ja) * 1985-10-21 1987-04-30 Mitsubishi Electric Corp 樹脂封止形半導体集積回路装置
US10478560B2 (en) 2005-01-24 2019-11-19 Antares Pharma, Inc. Prefilled syringe injector
US10543316B2 (en) 2006-05-03 2020-01-28 Antares Pharma, Inc. Injector with adjustable dosing
US10568809B2 (en) 2011-07-15 2020-02-25 Ferring B.V. Liquid-transfer adapter beveled spike
US10478559B2 (en) 2012-03-06 2019-11-19 Antares Pharma, Inc. Prefilled syringe with breakaway force feature
US10357609B2 (en) 2012-05-07 2019-07-23 Antares Pharma, Inc. Needle assisted jet injection device having reduced trigger force

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