JPS4979467A - - Google Patents

Info

Publication number
JPS4979467A
JPS4979467A JP48118010A JP11801073A JPS4979467A JP S4979467 A JPS4979467 A JP S4979467A JP 48118010 A JP48118010 A JP 48118010A JP 11801073 A JP11801073 A JP 11801073A JP S4979467 A JPS4979467 A JP S4979467A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48118010A
Other versions
JPS5137512B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4979467A publication Critical patent/JPS4979467A/ja
Publication of JPS5137512B2 publication Critical patent/JPS5137512B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6644—Packaging aspects of high-frequency amplifiers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01011—Sodium [Na]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
JP48118010A 1972-11-03 1973-10-22 Expired JPS5137512B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US30346672A 1972-11-03 1972-11-03

Publications (2)

Publication Number Publication Date
JPS4979467A true JPS4979467A (ja) 1974-07-31
JPS5137512B2 JPS5137512B2 (ja) 1976-10-15

Family

ID=23172230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48118010A Expired JPS5137512B2 (ja) 1972-11-03 1973-10-22

Country Status (5)

Country Link
US (1) US3784884A (ja)
JP (1) JPS5137512B2 (ja)
DE (1) DE2352357A1 (ja)
FR (1) FR2205744A1 (ja)
GB (1) GB1404100A (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5154369A (ja) * 1974-11-07 1976-05-13 Fujitsu Ltd
JPS5154370A (ja) * 1974-11-07 1976-05-13 Fujitsu Ltd
JPS5161264A (ja) * 1974-11-26 1976-05-27 Fujitsu Ltd
JPS51135367A (en) * 1975-05-19 1976-11-24 Mitsubishi Electric Corp Semiconductor device
JPS5341065U (ja) * 1976-09-13 1978-04-10
JPS57167667A (en) * 1981-04-08 1982-10-15 Mitsubishi Electric Corp Semiconductor device

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3916434A (en) * 1972-11-30 1975-10-28 Power Hybrids Inc Hermetically sealed encapsulation of semiconductor devices
US3832732A (en) * 1973-01-11 1974-08-27 Westinghouse Electric Corp Light-activated lateral thyristor and ac switch
US3943556A (en) * 1973-07-30 1976-03-09 Motorola, Inc. Method of making a high frequency semiconductor package
US3893159A (en) * 1974-02-26 1975-07-01 Rca Corp Multiple cell high frequency power semiconductor device having bond wires of differing inductance from cell to cell
EP0015053A1 (en) * 1979-01-27 1980-09-03 LUCAS INDUSTRIES public limited company A method of manufacturing a semi-conductor power device assembly and an assembly thereby produced
US4383270A (en) * 1980-07-10 1983-05-10 Rca Corporation Structure for mounting a semiconductor chip to a metal core substrate
JPS5753947A (en) * 1980-09-17 1982-03-31 Hitachi Ltd Transistor and electronic device containing it
FR2506075A1 (fr) * 1981-05-18 1982-11-19 Radiotechnique Compelec Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection
JPS6022345A (ja) * 1983-07-19 1985-02-04 Toyota Central Res & Dev Lab Inc 半導体装置
US4649416A (en) * 1984-01-03 1987-03-10 Raytheon Company Microwave transistor package
US4736236A (en) * 1984-03-08 1988-04-05 Olin Corporation Tape bonding material and structure for electronic circuit fabrication
DE3512628A1 (de) * 1984-04-11 1985-10-17 Moran, Peter, Cork Packung fuer eine integrierte schaltung
JPH02184054A (ja) * 1989-01-11 1990-07-18 Toshiba Corp ハイブリッド型樹脂封止半導体装置
US5103283A (en) * 1989-01-17 1992-04-07 Hite Larry R Packaged integrated circuit with in-cavity decoupling capacitors
JPH0777261B2 (ja) * 1989-07-10 1995-08-16 三菱電機株式会社 固体撮像装置及びその組立方法
US5159750A (en) * 1989-12-20 1992-11-03 National Semiconductor Corporation Method of connecting an IC component with another electrical component
US5283463A (en) * 1992-03-05 1994-02-01 Westinghouse Electric Corp. High power self commutating semiconductor switch
US5428188A (en) * 1992-10-09 1995-06-27 U.S. Terminals, Inc. Low-cost package for electronic components
US5509579A (en) * 1992-11-19 1996-04-23 Robbins, Iii; Edward S. No drip dispensing cap
US5542579A (en) * 1992-11-19 1996-08-06 Robbins, Iii; Edward S. Dispensing cap with internal measuring chamber and selectively useable sifter
US5325268A (en) * 1993-01-28 1994-06-28 National Semiconductor Corporation Interconnector for a multi-chip module or package
US5665649A (en) * 1993-05-21 1997-09-09 Gardiner Communications Corporation Process for forming a semiconductor device base array and mounting semiconductor devices thereon
US5596171A (en) * 1993-05-21 1997-01-21 Harris; James M. Package for a high frequency semiconductor device and methods for fabricating and connecting the same to an external circuit
EP0878025B1 (en) * 1996-11-05 2004-04-14 Koninklijke Philips Electronics N.V. Semiconductor device with a high-frequency bipolar transistor on an insulating substrate
US6476481B2 (en) 1998-05-05 2002-11-05 International Rectifier Corporation High current capacity semiconductor device package and lead frame with large area connection posts and modified outline
US6072211A (en) * 1998-08-03 2000-06-06 Motorola, Inc. Semiconductor package
WO2000075990A1 (en) * 1999-06-07 2000-12-14 Ericsson Inc. High impedance matched rf power transistor
JP2001308264A (ja) * 2000-04-21 2001-11-02 Toyota Industries Corp 半導体装置
US6525372B2 (en) 2000-11-16 2003-02-25 Silicon Wireless Corporation Vertical power devices having insulated source electrodes in discontinuous deep trenches
US6422426B1 (en) 2001-03-28 2002-07-23 Edward S. Robbins, III Dispensing cap with internal measuring chamber
JP2006352008A (ja) * 2005-06-20 2006-12-28 Nec Electronics Corp 半導体装置および回路基板
US20070175660A1 (en) * 2006-01-27 2007-08-02 Yeung Betty H Warpage-reducing packaging design
JP4817924B2 (ja) * 2006-03-29 2011-11-16 株式会社東芝 半導体パッケージ
US7683480B2 (en) * 2006-03-29 2010-03-23 Freescale Semiconductor, Inc. Methods and apparatus for a reduced inductance wirebond array
JP2009123736A (ja) * 2007-11-12 2009-06-04 Nec Corp デバイスの実装構造及びデバイスの実装方法
US8724939B2 (en) 2011-03-18 2014-05-13 Cisco Technology, Inc. Enhanced low inductance interconnections between electronic and opto-electronic integrated circuits
JP6412900B2 (ja) * 2016-06-23 2018-10-24 株式会社東芝 高周波半導体用パッケージ
JP6781021B2 (ja) * 2016-11-29 2020-11-04 モレックス エルエルシー 電子部品
US10431526B2 (en) * 2017-10-09 2019-10-01 Cree, Inc. Rivetless lead fastening for a semiconductor package

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3698082A (en) * 1966-04-25 1972-10-17 Texas Instruments Inc Complex circuit array method
US3626259A (en) * 1970-07-15 1971-12-07 Trw Inc High-frequency semiconductor package
US3641398A (en) * 1970-09-23 1972-02-08 Rca Corp High-frequency semiconductor device
US3683241A (en) * 1971-03-08 1972-08-08 Communications Transistor Corp Radio frequency transistor package

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5154369A (ja) * 1974-11-07 1976-05-13 Fujitsu Ltd
JPS5154370A (ja) * 1974-11-07 1976-05-13 Fujitsu Ltd
JPS5728951B2 (ja) * 1974-11-07 1982-06-19
JPS5161264A (ja) * 1974-11-26 1976-05-27 Fujitsu Ltd
JPS5728952B2 (ja) * 1974-11-26 1982-06-19
JPS51135367A (en) * 1975-05-19 1976-11-24 Mitsubishi Electric Corp Semiconductor device
JPS5840339B2 (ja) * 1975-05-19 1983-09-05 三菱電機株式会社 高周波トランジスタ
JPS5341065U (ja) * 1976-09-13 1978-04-10
JPS57167667A (en) * 1981-04-08 1982-10-15 Mitsubishi Electric Corp Semiconductor device
JPS6227738B2 (ja) * 1981-04-08 1987-06-16 Mitsubishi Electric Corp

Also Published As

Publication number Publication date
FR2205744A1 (ja) 1974-05-31
US3784884A (en) 1974-01-08
GB1404100A (en) 1975-08-28
JPS5137512B2 (ja) 1976-10-15
DE2352357A1 (de) 1974-05-16

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