JPS4979467A - - Google Patents

Info

Publication number
JPS4979467A
JPS4979467A JP48118010A JP11801073A JPS4979467A JP S4979467 A JPS4979467 A JP S4979467A JP 48118010 A JP48118010 A JP 48118010A JP 11801073 A JP11801073 A JP 11801073A JP S4979467 A JPS4979467 A JP S4979467A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48118010A
Other languages
Japanese (ja)
Other versions
JPS5137512B2 (US06168776-20010102-C00041.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4979467A publication Critical patent/JPS4979467A/ja
Publication of JPS5137512B2 publication Critical patent/JPS5137512B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6644—Packaging aspects of high-frequency amplifiers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01011—Sodium [Na]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16195—Flat cap [not enclosing an internal cavity]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
JP48118010A 1972-11-03 1973-10-22 Expired JPS5137512B2 (US06168776-20010102-C00041.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US30346672A 1972-11-03 1972-11-03

Publications (2)

Publication Number Publication Date
JPS4979467A true JPS4979467A (US06168776-20010102-C00041.png) 1974-07-31
JPS5137512B2 JPS5137512B2 (US06168776-20010102-C00041.png) 1976-10-15

Family

ID=23172230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP48118010A Expired JPS5137512B2 (US06168776-20010102-C00041.png) 1972-11-03 1973-10-22

Country Status (5)

Country Link
US (1) US3784884A (US06168776-20010102-C00041.png)
JP (1) JPS5137512B2 (US06168776-20010102-C00041.png)
DE (1) DE2352357A1 (US06168776-20010102-C00041.png)
FR (1) FR2205744A1 (US06168776-20010102-C00041.png)
GB (1) GB1404100A (US06168776-20010102-C00041.png)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5154369A (US06168776-20010102-C00041.png) * 1974-11-07 1976-05-13 Fujitsu Ltd
JPS5154370A (US06168776-20010102-C00041.png) * 1974-11-07 1976-05-13 Fujitsu Ltd
JPS5161264A (US06168776-20010102-C00041.png) * 1974-11-26 1976-05-27 Fujitsu Ltd
JPS51135367A (en) * 1975-05-19 1976-11-24 Mitsubishi Electric Corp Semiconductor device
JPS5341065U (US06168776-20010102-C00041.png) * 1976-09-13 1978-04-10
JPS57167667A (en) * 1981-04-08 1982-10-15 Mitsubishi Electric Corp Semiconductor device

Families Citing this family (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3916434A (en) * 1972-11-30 1975-10-28 Power Hybrids Inc Hermetically sealed encapsulation of semiconductor devices
US3832732A (en) * 1973-01-11 1974-08-27 Westinghouse Electric Corp Light-activated lateral thyristor and ac switch
US3943556A (en) * 1973-07-30 1976-03-09 Motorola, Inc. Method of making a high frequency semiconductor package
US3893159A (en) * 1974-02-26 1975-07-01 Rca Corp Multiple cell high frequency power semiconductor device having bond wires of differing inductance from cell to cell
EP0015053A1 (en) * 1979-01-27 1980-09-03 LUCAS INDUSTRIES public limited company A method of manufacturing a semi-conductor power device assembly and an assembly thereby produced
US4383270A (en) * 1980-07-10 1983-05-10 Rca Corporation Structure for mounting a semiconductor chip to a metal core substrate
JPS5753947A (en) * 1980-09-17 1982-03-31 Hitachi Ltd Transistor and electronic device containing it
FR2506075A1 (fr) * 1981-05-18 1982-11-19 Radiotechnique Compelec Procede d'assemblage d'un dispositif semi-conducteur et de son boitier de protection
JPS6022345A (ja) * 1983-07-19 1985-02-04 Toyota Central Res & Dev Lab Inc 半導体装置
US4649416A (en) * 1984-01-03 1987-03-10 Raytheon Company Microwave transistor package
US4736236A (en) * 1984-03-08 1988-04-05 Olin Corporation Tape bonding material and structure for electronic circuit fabrication
DE3512628A1 (de) * 1984-04-11 1985-10-17 Moran, Peter, Cork Packung fuer eine integrierte schaltung
JPH02184054A (ja) * 1989-01-11 1990-07-18 Toshiba Corp ハイブリッド型樹脂封止半導体装置
US5103283A (en) * 1989-01-17 1992-04-07 Hite Larry R Packaged integrated circuit with in-cavity decoupling capacitors
JPH0777261B2 (ja) * 1989-07-10 1995-08-16 三菱電機株式会社 固体撮像装置及びその組立方法
US5159750A (en) * 1989-12-20 1992-11-03 National Semiconductor Corporation Method of connecting an IC component with another electrical component
US5283463A (en) * 1992-03-05 1994-02-01 Westinghouse Electric Corp. High power self commutating semiconductor switch
US5428188A (en) * 1992-10-09 1995-06-27 U.S. Terminals, Inc. Low-cost package for electronic components
US5509579A (en) * 1992-11-19 1996-04-23 Robbins, Iii; Edward S. No drip dispensing cap
US5542579A (en) * 1992-11-19 1996-08-06 Robbins, Iii; Edward S. Dispensing cap with internal measuring chamber and selectively useable sifter
US5325268A (en) * 1993-01-28 1994-06-28 National Semiconductor Corporation Interconnector for a multi-chip module or package
US5665649A (en) * 1993-05-21 1997-09-09 Gardiner Communications Corporation Process for forming a semiconductor device base array and mounting semiconductor devices thereon
US5596171A (en) * 1993-05-21 1997-01-21 Harris; James M. Package for a high frequency semiconductor device and methods for fabricating and connecting the same to an external circuit
EP0878025B1 (en) * 1996-11-05 2004-04-14 Koninklijke Philips Electronics N.V. Semiconductor device with a high-frequency bipolar transistor on an insulating substrate
US6476481B2 (en) 1998-05-05 2002-11-05 International Rectifier Corporation High current capacity semiconductor device package and lead frame with large area connection posts and modified outline
US6072211A (en) * 1998-08-03 2000-06-06 Motorola, Inc. Semiconductor package
WO2000075990A1 (en) * 1999-06-07 2000-12-14 Ericsson Inc. High impedance matched rf power transistor
JP2001308264A (ja) * 2000-04-21 2001-11-02 Toyota Industries Corp 半導体装置
US6525372B2 (en) 2000-11-16 2003-02-25 Silicon Wireless Corporation Vertical power devices having insulated source electrodes in discontinuous deep trenches
US6422426B1 (en) 2001-03-28 2002-07-23 Edward S. Robbins, III Dispensing cap with internal measuring chamber
JP2006352008A (ja) * 2005-06-20 2006-12-28 Nec Electronics Corp 半導体装置および回路基板
US20070175660A1 (en) * 2006-01-27 2007-08-02 Yeung Betty H Warpage-reducing packaging design
JP4817924B2 (ja) * 2006-03-29 2011-11-16 株式会社東芝 半導体パッケージ
US7683480B2 (en) * 2006-03-29 2010-03-23 Freescale Semiconductor, Inc. Methods and apparatus for a reduced inductance wirebond array
JP2009123736A (ja) * 2007-11-12 2009-06-04 Nec Corp デバイスの実装構造及びデバイスの実装方法
US8724939B2 (en) 2011-03-18 2014-05-13 Cisco Technology, Inc. Enhanced low inductance interconnections between electronic and opto-electronic integrated circuits
JP6412900B2 (ja) * 2016-06-23 2018-10-24 株式会社東芝 高周波半導体用パッケージ
JP6781021B2 (ja) * 2016-11-29 2020-11-04 モレックス エルエルシー 電子部品
US10431526B2 (en) * 2017-10-09 2019-10-01 Cree, Inc. Rivetless lead fastening for a semiconductor package

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3698082A (en) * 1966-04-25 1972-10-17 Texas Instruments Inc Complex circuit array method
US3626259A (en) * 1970-07-15 1971-12-07 Trw Inc High-frequency semiconductor package
US3641398A (en) * 1970-09-23 1972-02-08 Rca Corp High-frequency semiconductor device
US3683241A (en) * 1971-03-08 1972-08-08 Communications Transistor Corp Radio frequency transistor package

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5154369A (US06168776-20010102-C00041.png) * 1974-11-07 1976-05-13 Fujitsu Ltd
JPS5154370A (US06168776-20010102-C00041.png) * 1974-11-07 1976-05-13 Fujitsu Ltd
JPS5728951B2 (US06168776-20010102-C00041.png) * 1974-11-07 1982-06-19
JPS5161264A (US06168776-20010102-C00041.png) * 1974-11-26 1976-05-27 Fujitsu Ltd
JPS5728952B2 (US06168776-20010102-C00041.png) * 1974-11-26 1982-06-19
JPS51135367A (en) * 1975-05-19 1976-11-24 Mitsubishi Electric Corp Semiconductor device
JPS5840339B2 (ja) * 1975-05-19 1983-09-05 三菱電機株式会社 高周波トランジスタ
JPS5341065U (US06168776-20010102-C00041.png) * 1976-09-13 1978-04-10
JPS57167667A (en) * 1981-04-08 1982-10-15 Mitsubishi Electric Corp Semiconductor device
JPS6227738B2 (US06168776-20010102-C00041.png) * 1981-04-08 1987-06-16 Mitsubishi Electric Corp

Also Published As

Publication number Publication date
FR2205744A1 (US06168776-20010102-C00041.png) 1974-05-31
US3784884A (en) 1974-01-08
GB1404100A (en) 1975-08-28
JPS5137512B2 (US06168776-20010102-C00041.png) 1976-10-15
DE2352357A1 (de) 1974-05-16

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