JPS4960486A - - Google Patents

Info

Publication number
JPS4960486A
JPS4960486A JP47102238A JP10223872A JPS4960486A JP S4960486 A JPS4960486 A JP S4960486A JP 47102238 A JP47102238 A JP 47102238A JP 10223872 A JP10223872 A JP 10223872A JP S4960486 A JPS4960486 A JP S4960486A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP47102238A
Other languages
Japanese (ja)
Other versions
JPS5242517B2 (cg-RX-API-DMAC10.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47102238A priority Critical patent/JPS5242517B2/ja
Priority to DE19732351112 priority patent/DE2351112A1/de
Priority to US00405534A priority patent/US3848329A/en
Priority to FR7336322A priority patent/FR2203172A1/fr
Publication of JPS4960486A publication Critical patent/JPS4960486A/ja
Publication of JPS5242517B2 publication Critical patent/JPS5242517B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D48/00—Individual devices not covered by groups H10D1/00 - H10D44/00
    • H10D48/50—Devices controlled by mechanical forces, e.g. pressure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00—Subject matter not provided for in other groups of this subclass
    • H10P14/24—
    • H10P14/2905—
    • H10P14/2925—
    • H10P14/2926—
    • H10P14/3411—
    • H10P95/00—
    • H10W20/40—
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49103—Strain gauge making

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
JP47102238A 1972-10-11 1972-10-11 Expired JPS5242517B2 (cg-RX-API-DMAC10.html)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP47102238A JPS5242517B2 (cg-RX-API-DMAC10.html) 1972-10-11 1972-10-11
DE19732351112 DE2351112A1 (de) 1972-10-11 1973-10-11 Dehnungsempfindliches halbleiterbauelement fuer einen wandler zum umformen mechanischer spannungen bzw. verformungen in eine elektrische groesse und verfahren zur herstellung des halbleiterbauelements
US00405534A US3848329A (en) 1972-10-11 1973-10-11 Method for producing a semiconductor strain sensitive element of an electromechanical semiconductor transducer
FR7336322A FR2203172A1 (cg-RX-API-DMAC10.html) 1972-10-11 1973-10-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47102238A JPS5242517B2 (cg-RX-API-DMAC10.html) 1972-10-11 1972-10-11

Publications (2)

Publication Number Publication Date
JPS4960486A true JPS4960486A (cg-RX-API-DMAC10.html) 1974-06-12
JPS5242517B2 JPS5242517B2 (cg-RX-API-DMAC10.html) 1977-10-25

Family

ID=14322043

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47102238A Expired JPS5242517B2 (cg-RX-API-DMAC10.html) 1972-10-11 1972-10-11

Country Status (4)

Country Link
US (1) US3848329A (cg-RX-API-DMAC10.html)
JP (1) JPS5242517B2 (cg-RX-API-DMAC10.html)
DE (1) DE2351112A1 (cg-RX-API-DMAC10.html)
FR (1) FR2203172A1 (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50150585A (cg-RX-API-DMAC10.html) * 1974-05-28 1975-12-03
JP2021025929A (ja) * 2019-08-07 2021-02-22 株式会社東芝 圧力センサ
JP2021051002A (ja) * 2019-09-25 2021-04-01 愛知時計電機株式会社 センサチップ

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3935636A (en) * 1974-03-29 1976-02-03 Tyco Laboratories, Inc. Method of making a pressure transducer
US4093933A (en) * 1976-05-14 1978-06-06 Becton, Dickinson Electronics Company Sculptured pressure diaphragm
FR2380640A1 (fr) * 1977-02-09 1978-09-08 Diax Corp Transducteur d'energie a l'etat solide et son procede de fabrication
DE2809549C2 (de) * 1977-03-07 1985-03-14 Hitachi, Ltd., Tokio/Tokyo Verfahren zur Herstellung eines Halbleiter-Druckmeßfühlers und Halbleiter-Druckmeßfühler
EP0337380B1 (en) * 1988-04-15 1993-09-08 Honeywell Inc. Semiconductor pressure sensor
JP3891037B2 (ja) * 2002-05-21 2007-03-07 株式会社デンソー 半導体圧力センサおよび半導体圧力センサ用の半導体ウェハ
WO2006006677A1 (ja) * 2004-07-14 2006-01-19 Nagano Keiki Co., Ltd. 荷重センサ及びその製造方法
US20060030062A1 (en) * 2004-08-05 2006-02-09 Jun He Micromachined wafer strain gauge
US7412892B1 (en) 2007-06-06 2008-08-19 Measurement Specialties, Inc. Method of making pressure transducer and apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3428933A (en) * 1966-08-29 1969-02-18 Automation Ind Inc Strain gage unit and method of applying the gage
US3757414A (en) * 1971-03-26 1973-09-11 Honeywell Inc Method for batch fabricating semiconductor devices
US3798754A (en) * 1972-05-15 1974-03-26 Motorola Inc Semiconductor strain gage and method of fabricating same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50150585A (cg-RX-API-DMAC10.html) * 1974-05-28 1975-12-03
JP2021025929A (ja) * 2019-08-07 2021-02-22 株式会社東芝 圧力センサ
JP2021051002A (ja) * 2019-09-25 2021-04-01 愛知時計電機株式会社 センサチップ

Also Published As

Publication number Publication date
JPS5242517B2 (cg-RX-API-DMAC10.html) 1977-10-25
FR2203172A1 (cg-RX-API-DMAC10.html) 1974-05-10
US3848329A (en) 1974-11-19
DE2351112A1 (de) 1974-04-18

Similar Documents

Publication Publication Date Title
JPS4928282A (cg-RX-API-DMAC10.html)
JPS5242517B2 (cg-RX-API-DMAC10.html)
JPS4878973A (cg-RX-API-DMAC10.html)
JPS498078A (cg-RX-API-DMAC10.html)
FR2196770B1 (cg-RX-API-DMAC10.html)
JPS5113166B2 (cg-RX-API-DMAC10.html)
JPS4982246U (cg-RX-API-DMAC10.html)
CS155025B1 (cg-RX-API-DMAC10.html)
JPS4980125U (cg-RX-API-DMAC10.html)
JPS4890501U (cg-RX-API-DMAC10.html)
JPS4940922U (cg-RX-API-DMAC10.html)
JPS4916033U (cg-RX-API-DMAC10.html)
JPS4998570U (cg-RX-API-DMAC10.html)
CS162070B1 (cg-RX-API-DMAC10.html)
CS161353B1 (cg-RX-API-DMAC10.html)
CS160339B1 (cg-RX-API-DMAC10.html)
CS160295B1 (cg-RX-API-DMAC10.html)
CS159945B1 (cg-RX-API-DMAC10.html)
CS159430B1 (cg-RX-API-DMAC10.html)
CS155798B1 (cg-RX-API-DMAC10.html)
CS155384B1 (cg-RX-API-DMAC10.html)
CS151864B1 (cg-RX-API-DMAC10.html)
CS153945B1 (cg-RX-API-DMAC10.html)
CH559541A5 (cg-RX-API-DMAC10.html)
CH598186A5 (cg-RX-API-DMAC10.html)