JPS495598B1 - - Google Patents
Info
- Publication number
- JPS495598B1 JPS495598B1 JP44093552A JP9355269A JPS495598B1 JP S495598 B1 JPS495598 B1 JP S495598B1 JP 44093552 A JP44093552 A JP 44093552A JP 9355269 A JP9355269 A JP 9355269A JP S495598 B1 JPS495598 B1 JP S495598B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US77765668A | 1968-11-21 | 1968-11-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS495598B1 true JPS495598B1 (cg-RX-API-DMAC7.html) | 1974-02-07 |
Family
ID=25110873
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP44093552A Pending JPS495598B1 (cg-RX-API-DMAC7.html) | 1968-11-21 | 1969-11-21 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US3575333A (cg-RX-API-DMAC7.html) |
| JP (1) | JPS495598B1 (cg-RX-API-DMAC7.html) |
| DE (1) | DE1958328B2 (cg-RX-API-DMAC7.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51126789U (cg-RX-API-DMAC7.html) * | 1975-03-24 | 1976-10-14 |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3672034A (en) * | 1970-01-14 | 1972-06-27 | Bell Telephone Labor Inc | Method for bonding a beam-lead device to a substrate |
| US3700156A (en) * | 1970-05-20 | 1972-10-24 | Mech El Ind Inc | Bonding head for bonding beam leaded devices to a substrate |
| US3752382A (en) * | 1970-08-03 | 1973-08-14 | Gen Motors Corp | Apparatus for welding a cover to a tubular ceramic housing |
| NL165332C (nl) * | 1970-10-07 | 1981-08-17 | Philips Nv | Inrichting voor het verbinden van een halfgeleider- inrichting met een substraat. |
| US3747829A (en) * | 1971-12-13 | 1973-07-24 | Raytheon Co | Semiconductor lead bonding machine |
| US3938722A (en) * | 1973-04-30 | 1976-02-17 | Mech-El Industries, Inc. | Ultrasonic thermal compression beam lead, flip chip bonder |
| US3921884A (en) * | 1973-09-28 | 1975-11-25 | Calx Inc | Beam lead tool |
| US3883945A (en) * | 1974-03-13 | 1975-05-20 | Mallory & Co Inc P R | Method for transferring and joining beam leaded chips |
| US3964664A (en) * | 1974-03-13 | 1976-06-22 | P. R. Mallory & Co., Inc. | Beam leaded device welding machine |
| US4140263A (en) * | 1976-03-22 | 1979-02-20 | Diepeveen John C | Method for moving tool or the like |
| US4591087A (en) * | 1984-03-07 | 1986-05-27 | Kulicke And Soffa Industries Inc. | Apparatus for making rolling spot bonds |
| FR2588121B1 (fr) * | 1985-10-02 | 1990-02-23 | Bull Sa | Procede et dispositif de soudage d'elements sur les plots correspondants d'une plaquette telle que notamment une plaquette de circuits integres de haute densite |
| JP3504448B2 (ja) * | 1996-10-17 | 2004-03-08 | 株式会社ルネサステクノロジ | 半導体装置 |
| JP3370553B2 (ja) * | 1997-05-07 | 2003-01-27 | 株式会社新川 | ボンディング荷重の補正方法及びワイヤボンディング装置 |
| JP3556498B2 (ja) * | 1998-12-14 | 2004-08-18 | Ｔｄｋ株式会社 | チップ接合用ノズル |
| DE102018132839A1 (de) * | 2018-12-19 | 2020-06-25 | Herrmann Ultraschalltechnik Gmbh & Co. Kg | Ultraschallschweißanlage mit Abstützelement |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3426951A (en) * | 1961-11-06 | 1969-02-11 | Lehfeldt & Co Gmbh Dr | Ultrasonic welding apparatus |
| US3305157A (en) * | 1965-12-20 | 1967-02-21 | Matheus D Pennings | Ultrasonic wire bonder |
| US3342395A (en) * | 1966-10-10 | 1967-09-19 | Unitek Corp | Precision drive apparatus for a tool mount |
| US3464102A (en) * | 1967-03-10 | 1969-09-02 | Branson Instr | Solid acoustic horn with suction means |
| US3508986A (en) * | 1967-04-05 | 1970-04-28 | Robertshaw Controls Co | Method of sonically welded channel plates |
| US3442432A (en) * | 1967-06-15 | 1969-05-06 | Western Electric Co | Bonding a beam-leaded device to a substrate |
-
1968
- 1968-11-21 US US777656A patent/US3575333A/en not_active Expired - Lifetime
-
1969
- 1969-11-20 DE DE19691958328 patent/DE1958328B2/de active Pending
- 1969-11-21 JP JP44093552A patent/JPS495598B1/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51126789U (cg-RX-API-DMAC7.html) * | 1975-03-24 | 1976-10-14 |
Also Published As
| Publication number | Publication date |
|---|---|
| US3575333A (en) | 1971-04-20 |
| DE1958328A1 (de) | 1970-08-13 |
| DE1958328B2 (de) | 1972-05-04 |