JPS495577A - - Google Patents

Info

Publication number
JPS495577A
JPS495577A JP47044123A JP4412372A JPS495577A JP S495577 A JPS495577 A JP S495577A JP 47044123 A JP47044123 A JP 47044123A JP 4412372 A JP4412372 A JP 4412372A JP S495577 A JPS495577 A JP S495577A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP47044123A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP47044123A priority Critical patent/JPS495577A/ja
Publication of JPS495577A publication Critical patent/JPS495577A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view
    • H01L2224/05557—Shape in side view comprising protrusions or indentations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05556—Shape in side view
    • H01L2224/05558—Shape in side view conformal layer on a patterned surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4807—Shape of bonding interfaces, e.g. interlocking features
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4845—Details of ball bonds
    • H01L2224/48451—Shape
    • H01L2224/48453—Shape of the interface with the bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/485—Material
    • H01L2224/48505—Material at the bonding interface
    • H01L2224/48507—Material at the bonding interface comprising an intermetallic compound

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP47044123A 1972-05-02 1972-05-02 Pending JPS495577A (pl)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP47044123A JPS495577A (pl) 1972-05-02 1972-05-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP47044123A JPS495577A (pl) 1972-05-02 1972-05-02

Publications (1)

Publication Number Publication Date
JPS495577A true JPS495577A (pl) 1974-01-18

Family

ID=12682813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP47044123A Pending JPS495577A (pl) 1972-05-02 1972-05-02

Country Status (1)

Country Link
JP (1) JPS495577A (pl)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5798031A (en) * 1980-12-12 1982-06-18 Canon Inc Character processor
JPS5868141A (ja) * 1981-10-19 1983-04-22 Canon Inc 文字処理装置
JPS58127240A (ja) * 1982-01-22 1983-07-29 Canon Inc 文字処理装置
JPS58129639A (ja) * 1982-01-29 1983-08-02 Canon Inc 文字処理装置
JPS5947638A (ja) * 1982-09-08 1984-03-17 Sharp Corp 図表作成装置
JPS59111522A (ja) * 1982-12-17 1984-06-27 Matsushita Electric Ind Co Ltd 携帯用作表器
JPS59123045A (ja) * 1982-12-28 1984-07-16 Sharp Corp 文書処理装置の文章入力方式
JPS61262875A (ja) * 1985-05-15 1986-11-20 Fujitsu Ltd 表の数値合計演算指示方式
JPH05216904A (ja) * 1992-09-22 1993-08-27 Casio Comput Co Ltd 電子式表示装置
JPH05242119A (ja) * 1992-09-22 1993-09-21 Casio Comput Co Ltd 電子式表示装置
JPH05242090A (ja) * 1992-09-22 1993-09-21 Casio Comput Co Ltd 電子式表示装置
JPH05242118A (ja) * 1992-09-22 1993-09-21 Casio Comput Co Ltd 電子式表示装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS415379Y1 (pl) * 1964-05-15 1966-03-24
JPS4414745Y1 (pl) * 1966-12-07 1969-06-24

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS415379Y1 (pl) * 1964-05-15 1966-03-24
JPS4414745Y1 (pl) * 1966-12-07 1969-06-24

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0419585B2 (pl) * 1980-12-12 1992-03-30 Canon Kk
JPS5798031A (en) * 1980-12-12 1982-06-18 Canon Inc Character processor
JPS5868141A (ja) * 1981-10-19 1983-04-22 Canon Inc 文字処理装置
JPS58127240A (ja) * 1982-01-22 1983-07-29 Canon Inc 文字処理装置
JPS58129639A (ja) * 1982-01-29 1983-08-02 Canon Inc 文字処理装置
JPH0517587B2 (pl) * 1982-01-29 1993-03-09 Canon Kk
JPS5947638A (ja) * 1982-09-08 1984-03-17 Sharp Corp 図表作成装置
JPS59111522A (ja) * 1982-12-17 1984-06-27 Matsushita Electric Ind Co Ltd 携帯用作表器
JPS59123045A (ja) * 1982-12-28 1984-07-16 Sharp Corp 文書処理装置の文章入力方式
JPS61262875A (ja) * 1985-05-15 1986-11-20 Fujitsu Ltd 表の数値合計演算指示方式
JPH05216904A (ja) * 1992-09-22 1993-08-27 Casio Comput Co Ltd 電子式表示装置
JPH05242119A (ja) * 1992-09-22 1993-09-21 Casio Comput Co Ltd 電子式表示装置
JPH05242090A (ja) * 1992-09-22 1993-09-21 Casio Comput Co Ltd 電子式表示装置
JPH05242118A (ja) * 1992-09-22 1993-09-21 Casio Comput Co Ltd 電子式表示装置
JPH0711813B2 (ja) * 1992-09-22 1995-02-08 カシオ計算機株式会社 電子式表示装置
JP2698825B2 (ja) * 1992-09-22 1998-01-19 カシオ計算機株式会社 電子式表示装置

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