JPS4953387A - - Google Patents

Info

Publication number
JPS4953387A
JPS4953387A JP9614372A JP9614372A JPS4953387A JP S4953387 A JPS4953387 A JP S4953387A JP 9614372 A JP9614372 A JP 9614372A JP 9614372 A JP9614372 A JP 9614372A JP S4953387 A JPS4953387 A JP S4953387A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9614372A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9614372A priority Critical patent/JPS4953387A/ja
Publication of JPS4953387A publication Critical patent/JPS4953387A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
JP9614372A 1972-09-27 1972-09-27 Pending JPS4953387A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9614372A JPS4953387A (ja) 1972-09-27 1972-09-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9614372A JPS4953387A (ja) 1972-09-27 1972-09-27

Publications (1)

Publication Number Publication Date
JPS4953387A true JPS4953387A (ja) 1974-05-23

Family

ID=14157148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9614372A Pending JPS4953387A (ja) 1972-09-27 1972-09-27

Country Status (1)

Country Link
JP (1) JPS4953387A (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58110061A (ja) * 1981-12-23 1983-06-30 Fujitsu Ltd 半導体装置等のパッケージ製造方法
JPS6261350A (ja) * 1985-09-11 1987-03-18 Toshiba Chem Corp 樹脂封止型半導体装置
JPS642340A (en) * 1987-06-25 1989-01-06 Ibiden Co Ltd Semiconductor device
WO2004082036A1 (ja) * 2003-03-10 2004-09-23 Toyoda Gosei Co., Ltd. 固体素子デバイスおよびその製造方法
JPWO2004082036A1 (ja) * 2003-03-10 2006-06-15 豊田合成株式会社 固体素子デバイスおよびその製造方法
US7497597B2 (en) 2004-01-19 2009-03-03 Toyoda Gosei Co., Ltd. Light emitting apparatus

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58110061A (ja) * 1981-12-23 1983-06-30 Fujitsu Ltd 半導体装置等のパッケージ製造方法
JPH0250622B2 (ja) * 1981-12-23 1990-11-02 Fujitsu Ltd
JPS6261350A (ja) * 1985-09-11 1987-03-18 Toshiba Chem Corp 樹脂封止型半導体装置
JPS642340A (en) * 1987-06-25 1989-01-06 Ibiden Co Ltd Semiconductor device
WO2004082036A1 (ja) * 2003-03-10 2004-09-23 Toyoda Gosei Co., Ltd. 固体素子デバイスおよびその製造方法
JPWO2004082036A1 (ja) * 2003-03-10 2006-06-15 豊田合成株式会社 固体素子デバイスおよびその製造方法
US7824937B2 (en) 2003-03-10 2010-11-02 Toyoda Gosei Co., Ltd. Solid element device and method for manufacturing the same
US8154047B2 (en) 2003-03-10 2012-04-10 Toyoda Gosei Co., Ltd. Solid element device and method for manufacturing the same
US8685766B2 (en) 2003-03-10 2014-04-01 Toyoda Gosei Co., Ltd. Solid element device and method for manufacturing the same
US7497597B2 (en) 2004-01-19 2009-03-03 Toyoda Gosei Co., Ltd. Light emitting apparatus

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