JPS4953133A - - Google Patents

Info

Publication number
JPS4953133A
JPS4953133A JP7558873A JP7558873A JPS4953133A JP S4953133 A JPS4953133 A JP S4953133A JP 7558873 A JP7558873 A JP 7558873A JP 7558873 A JP7558873 A JP 7558873A JP S4953133 A JPS4953133 A JP S4953133A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7558873A
Other languages
Japanese (ja)
Other versions
JPS5439812B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4953133A publication Critical patent/JPS4953133A/ja
Publication of JPS5439812B2 publication Critical patent/JPS5439812B2/ja
Expired legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18Pretreatment of the material to be coated
    • C23C18/1851Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
    • C23C18/1872Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
    • C23C18/1886Multistep pretreatment
    • C23C18/1893Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
JP7558873A 1972-07-11 1973-07-03 Expired JPS5439812B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US27086172A 1972-07-11 1972-07-11

Publications (2)

Publication Number Publication Date
JPS4953133A true JPS4953133A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-05-23
JPS5439812B2 JPS5439812B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1979-11-30

Family

ID=23033117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7558873A Expired JPS5439812B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1972-07-11 1973-07-03

Country Status (12)

Country Link
JP (1) JPS5439812B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
AT (1) AT328248B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
AU (1) AU473729B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CA (1) CA1000453A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
CH (1) CH599350A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE2335497C3 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DK (1) DK143609C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
ES (1) ES416804A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
FR (1) FR2192189B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB1426462A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
IT (1) IT989827B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
NL (1) NL179491C (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5067727A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1973-10-18 1975-06-06

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4232060A (en) 1979-01-22 1980-11-04 Richardson Chemical Company Method of preparing substrate surface for electroless plating and products produced thereby
US4632857A (en) * 1974-05-24 1986-12-30 Richardson Chemical Company Electrolessly plated product having a polymetallic catalytic film underlayer
US4321285A (en) 1974-10-04 1982-03-23 Surface Technology, Inc. Electroless plating
US4265942A (en) 1974-10-04 1981-05-05 Nathan Feldstein Non-noble metal colloidal compositions comprising reaction products for electroless deposition
US4327125A (en) 1974-10-04 1982-04-27 Nathan Feldstein Colloidal compositions for electroless deposition comprising colloidal copper-stannic oxide product
US4136216A (en) * 1975-08-26 1979-01-23 Surface Technology, Inc. Non-precious metal colloidal dispersions for electroless metal deposition
US4297397A (en) * 1976-01-22 1981-10-27 Nathan Feldstein Catalytic promoters in electroless plating catalysts in true solutions
ZA77897B (en) * 1976-04-13 1977-12-28 Kollmorgen Corp Liquid seeders and catalyzation processes for electroless metal deposition
US4259376A (en) * 1977-09-16 1981-03-31 Nathan Feldstein Catalytic promoters in electroless plating catalysts applied as an emulsion
US4233344A (en) * 1978-07-20 1980-11-11 Learonal, Inc. Method of improving the adhesion of electroless metal deposits employing colloidal copper activator
US4282271A (en) * 1978-08-17 1981-08-04 Nathan Feldstein Dispersions for activating non-conductors for electroless plating
US4339476A (en) 1978-08-17 1982-07-13 Nathan Feldstein Dispersions for activating non-conductors for electroless plating
GB2134931A (en) * 1982-12-27 1984-08-22 Ibiden Co Ltd Non-electrolytic copper plating for printed circuit board
GB8613960D0 (en) * 1986-06-09 1986-07-16 Omi International Gb Ltd Treating laminates
US5200272A (en) * 1988-04-29 1993-04-06 Miles Inc. Process for metallizing substrate surfaces

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR824356A (fr) * 1936-10-21 1938-02-07 Saint Gobain Procédé de métallisation par voie humide
US2968578A (en) * 1958-04-18 1961-01-17 Corning Glass Works Chemical nickel plating on ceramic material
US3561995A (en) * 1967-04-03 1971-02-09 M & T Chemicals Inc Method of activating a polymer surface and resultant article

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5067727A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * 1973-10-18 1975-06-06

Also Published As

Publication number Publication date
DK143609B (da) 1981-09-14
DE2335497A1 (de) 1974-02-07
AT328248B (de) 1976-03-10
NL179491B (nl) 1986-04-16
IT989827B (it) 1975-06-10
DE2335497C3 (de) 1978-08-24
NL179491C (nl) 1986-09-16
DK143609C (da) 1982-02-22
CH599350A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1978-05-31
DE2335497B2 (de) 1977-05-05
GB1426462A (en) 1976-02-25
JPS5439812B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1979-11-30
FR2192189B1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1976-06-18
ATA601873A (de) 1975-05-15
FR2192189A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-02-08
CA1000453A (en) 1976-11-30
AU473729B2 (en) 1976-07-01
ES416804A1 (es) 1976-02-16
AU5673073A (en) 1974-12-12
NL7309650A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1974-01-15

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