JPS4951131A - - Google Patents

Info

Publication number
JPS4951131A
JPS4951131A JP48046335A JP4633573A JPS4951131A JP S4951131 A JPS4951131 A JP S4951131A JP 48046335 A JP48046335 A JP 48046335A JP 4633573 A JP4633573 A JP 4633573A JP S4951131 A JPS4951131 A JP S4951131A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48046335A
Other languages
Japanese (ja)
Other versions
JPS5315455B2 (en:Method
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4951131A publication Critical patent/JPS4951131A/ja
Publication of JPS5315455B2 publication Critical patent/JPS5315455B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/04—Tubes; Rings; Hollow bodies
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1518—Vertically held PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Electroplating Methods And Accessories (AREA)
JP4633573A 1972-06-09 1973-04-25 Expired JPS5315455B2 (en:Method)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US26145972A 1972-06-09 1972-06-09

Publications (2)

Publication Number Publication Date
JPS4951131A true JPS4951131A (en:Method) 1974-05-17
JPS5315455B2 JPS5315455B2 (en:Method) 1978-05-25

Family

ID=22993399

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4633573A Expired JPS5315455B2 (en:Method) 1972-06-09 1973-04-25

Country Status (6)

Country Link
US (1) US3798136A (en:Method)
JP (1) JPS5315455B2 (en:Method)
CA (1) CA976667A (en:Method)
FR (1) FR2195696B1 (en:Method)
GB (1) GB1422466A (en:Method)
IT (1) IT987431B (en:Method)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51126339A (en) * 1975-04-28 1976-11-04 Mamoru Kuroiwa Method of plating inner surface of holes with emitted plating solution
JPS58123685A (ja) * 1982-01-18 1983-07-22 古河電気工業株式会社 アルミニウム端子の製造方法

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4368106A (en) * 1980-10-27 1983-01-11 General Electric Company Implantation of electrical feed-through conductors
US4396467A (en) * 1980-10-27 1983-08-02 General Electric Company Periodic reverse current pulsing to form uniformly sized feed through conductors
US4499655A (en) * 1981-03-18 1985-02-19 General Electric Company Method for making alignment-enhancing feed-through conductors for stackable silicon-on-sapphire
US4496437A (en) * 1983-06-22 1985-01-29 The Dow Chemical Company Method for producing a dual porosity body
JPS6063987A (ja) * 1983-09-17 1985-04-12 沖電気工業株式会社 印刷配線基板の製造方法
US4647476A (en) * 1984-03-05 1987-03-03 General Electric Company Insulating glass body with electrical feedthroughs and method of preparation
US4692222A (en) * 1984-11-19 1987-09-08 Pellegrino Peter P Electroplating method and apparatus for electroplating high aspect ratio thru-holes
US4587000A (en) * 1984-11-19 1986-05-06 Pellegrino Peter P Electroplating method and apparatus for electroplating high aspect ratio thru-holes
US4595478A (en) * 1984-11-23 1986-06-17 Pellegrino Peter P Turbulent cell electroplating method and apparatus
GB2181743A (en) * 1985-07-16 1987-04-29 Kay Kazuo Metal plating of through holes in printed circuit boards
IN170278B (en:Method) * 1986-11-13 1992-03-07 Rieter Ag Maschf
JPS63274794A (ja) * 1987-05-01 1988-11-11 Oki Electric Ind Co Ltd 誘電体コアの電解メツキ方法
GB8802393D0 (en) * 1988-02-03 1988-03-02 Gen Electric Co Plc Apparatus for selectively coating part of member
EP0327298A3 (en) * 1988-02-03 1990-06-27 THE GENERAL ELECTRIC COMPANY, p.l.c. Apparatus for selectively coating part of a member
US4915796A (en) * 1988-10-14 1990-04-10 Charles Denofrio Electroplating process
US5597412A (en) * 1995-02-15 1997-01-28 Fujitsu Limited Apparatus for forcing plating solution into via openings
US6767817B2 (en) * 2002-07-11 2004-07-27 Micron Technology, Inc. Asymmetric plating
US20080169124A1 (en) * 2007-01-12 2008-07-17 Tonglong Zhang Padless via and method for making same
TWM491679U (zh) * 2014-07-29 2014-12-11 Min Aik Prec Ind Co Ltd 可對加工件穿孔鍍金的電鍍設備
US10184189B2 (en) * 2016-07-18 2019-01-22 ECSI Fibrotools, Inc. Apparatus and method of contact electroplating of isolated structures
KR102720915B1 (ko) * 2018-03-28 2024-10-24 다이니폰 인사츠 가부시키가이샤 배선 기판, 및 배선 기판을 제조하는 방법
CN112850347A (zh) * 2020-12-30 2021-05-28 广东成功自动化设备有限公司 一种vcp线卷对卷上料装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51126339A (en) * 1975-04-28 1976-11-04 Mamoru Kuroiwa Method of plating inner surface of holes with emitted plating solution
JPS58123685A (ja) * 1982-01-18 1983-07-22 古河電気工業株式会社 アルミニウム端子の製造方法

Also Published As

Publication number Publication date
DE2324653B2 (de) 1975-11-27
US3798136A (en) 1974-03-19
FR2195696B1 (en:Method) 1976-06-11
CA976667A (en) 1975-10-21
IT987431B (it) 1975-02-20
FR2195696A1 (en:Method) 1974-03-08
GB1422466A (en) 1976-01-28
DE2324653A1 (de) 1974-01-03
JPS5315455B2 (en:Method) 1978-05-25

Similar Documents

Publication Publication Date Title
AU465354B2 (en:Method)
CH571650A5 (en:Method)
CH561123A5 (en:Method)
BG18046A1 (en:Method)
BG18080A1 (en:Method)
BG18097A1 (en:Method)
BG18101A1 (en:Method)
BG18352A1 (en:Method)
BG18374A1 (en:Method)
BG18476A1 (en:Method)
BG18497A1 (en:Method)
BG18528A1 (en:Method)
BG18536A1 (en:Method)
BG18659A1 (en:Method)
BG18687A1 (en:Method)
BG18715A1 (en:Method)
BG18894A1 (en:Method)
BG18920A1 (en:Method)
BG19256A1 (en:Method)
BG20087A3 (en:Method)
BG20677A1 (en:Method)
BG20737A1 (en:Method)
BG21155A1 (en:Method)
CH1043973A4 (en:Method)
CH545513A (en:Method)