JPS4938858A - - Google Patents

Info

Publication number
JPS4938858A
JPS4938858A JP8247372A JP8247372A JPS4938858A JP S4938858 A JPS4938858 A JP S4938858A JP 8247372 A JP8247372 A JP 8247372A JP 8247372 A JP8247372 A JP 8247372A JP S4938858 A JPS4938858 A JP S4938858A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8247372A
Other languages
Japanese (ja)
Other versions
JPS527422B2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8247372A priority Critical patent/JPS527422B2/ja
Publication of JPS4938858A publication Critical patent/JPS4938858A/ja
Publication of JPS527422B2 publication Critical patent/JPS527422B2/ja
Expired legal-status Critical Current

Links

JP8247372A 1972-08-19 1972-08-19 Expired JPS527422B2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8247372A JPS527422B2 (enrdf_load_stackoverflow) 1972-08-19 1972-08-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8247372A JPS527422B2 (enrdf_load_stackoverflow) 1972-08-19 1972-08-19

Publications (2)

Publication Number Publication Date
JPS4938858A true JPS4938858A (enrdf_load_stackoverflow) 1974-04-11
JPS527422B2 JPS527422B2 (enrdf_load_stackoverflow) 1977-03-02

Family

ID=13775467

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8247372A Expired JPS527422B2 (enrdf_load_stackoverflow) 1972-08-19 1972-08-19

Country Status (1)

Country Link
JP (1) JPS527422B2 (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5196268A (enrdf_load_stackoverflow) * 1975-02-20 1976-08-24
JPS526468A (en) * 1975-07-04 1977-01-18 Sumitomo Metal Mining Co Ltd Brazing material
EP0629464A1 (en) * 1993-06-16 1994-12-21 International Business Machines Corporation Lead-free, tin, antimony, bismuth, copper solder alloy
EP0629466A1 (en) * 1993-06-16 1994-12-21 International Business Machines Corporation High temperature, lead-free, tin based solder composition
JPH071179A (ja) * 1993-06-16 1995-01-06 Internatl Business Mach Corp <Ibm> 無鉛すず−ビスマスはんだ合金
JP2017127907A (ja) * 2015-03-24 2017-07-27 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置
CN109154036A (zh) * 2016-05-06 2019-01-04 爱法组装材料公司 高可靠度的无铅焊料合金
DE112020000278T5 (de) 2019-05-27 2021-09-16 Senju Metal Industry Co., Ltd. Lotlegierung, lotpaste, lötkugel, lötvorform und lötstelle
US11285569B2 (en) 2003-04-25 2022-03-29 Henkel Ag & Co. Kgaa Soldering material based on Sn Ag and Cu

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6713106B2 (ja) * 2014-02-24 2020-06-24 株式会社弘輝 鉛フリーはんだ合金、はんだ材料及び接合構造体

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5196268A (enrdf_load_stackoverflow) * 1975-02-20 1976-08-24
JPS526468A (en) * 1975-07-04 1977-01-18 Sumitomo Metal Mining Co Ltd Brazing material
JPH0788679A (ja) * 1993-06-16 1995-04-04 Internatl Business Mach Corp <Ibm> 無鉛すずアンチモン・ビスマス銅はんだ合金
EP0629466A1 (en) * 1993-06-16 1994-12-21 International Business Machines Corporation High temperature, lead-free, tin based solder composition
JPH071179A (ja) * 1993-06-16 1995-01-06 Internatl Business Mach Corp <Ibm> 無鉛すず−ビスマスはんだ合金
JPH0788680A (ja) * 1993-06-16 1995-04-04 Internatl Business Mach Corp <Ibm> 高温無鉛すずベースはんだの組成
EP0629464A1 (en) * 1993-06-16 1994-12-21 International Business Machines Corporation Lead-free, tin, antimony, bismuth, copper solder alloy
US11285569B2 (en) 2003-04-25 2022-03-29 Henkel Ag & Co. Kgaa Soldering material based on Sn Ag and Cu
JP2017127907A (ja) * 2015-03-24 2017-07-27 株式会社タムラ製作所 鉛フリーはんだ合金、電子回路基板および電子制御装置
CN109154036A (zh) * 2016-05-06 2019-01-04 爱法组装材料公司 高可靠度的无铅焊料合金
JP2019520985A (ja) * 2016-05-06 2019-07-25 アルファ・アセンブリー・ソリューションズ・インコーポレイテッドＡｌｐｈａ Ａｓｓｅｍｂｌｙ Ｓｏｌｕｔｉｏｎｓ Ｉｎｃ． 高信頼性鉛フリーはんだ合金
EP3449023B1 (en) * 2016-05-06 2022-04-20 Alpha Assembly Solutions Inc. High reliability lead-free solder alloy
DE112020000278T5 (de) 2019-05-27 2021-09-16 Senju Metal Industry Co., Ltd. Lotlegierung, lotpaste, lötkugel, lötvorform und lötstelle
US11571770B2 (en) 2019-05-27 2023-02-07 Senju Metal Industry Co., Ltd. Solder alloy, solder paste, solder ball, solder preform, and solder joint
DE112020000278B4 (de) 2019-05-27 2023-07-06 Senju Metal Industry Co., Ltd. Lotlegierung, lotpaste, lötkugel, lötvorform und lötstelle

Also Published As

Publication number Publication date
JPS527422B2 (enrdf_load_stackoverflow) 1977-03-02

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