JPS4933565A - - Google Patents

Info

Publication number
JPS4933565A
JPS4933565A JP47074183A JP7418372A JPS4933565A JP S4933565 A JPS4933565 A JP S4933565A JP 47074183 A JP47074183 A JP 47074183A JP 7418372 A JP7418372 A JP 7418372A JP S4933565 A JPS4933565 A JP S4933565A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP47074183A
Other languages
Japanese (ja)
Other versions
JPS5311192B2 (ref
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7418372A priority Critical patent/JPS5311192B2/ja
Priority to US05/379,972 priority patent/US4119259A/en
Priority to GB3426373A priority patent/GB1433198A/en
Priority to AU58322/73A priority patent/AU5832273A/en
Priority to DE2337303A priority patent/DE2337303B2/de
Publication of JPS4933565A publication Critical patent/JPS4933565A/ja
Priority to HK762/76*UA priority patent/HK76276A/xx
Priority to MY101/77A priority patent/MY7700101A/xx
Publication of JPS5311192B2 publication Critical patent/JPS5311192B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W72/075—
    • H10W72/01551—
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/07511—
    • H10W72/07521—
    • H10W72/07532—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5449—
    • H10W72/932—
    • H10W90/756—

Landscapes

  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
JP7418372A 1972-07-26 1972-07-26 Expired JPS5311192B2 (ref)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP7418372A JPS5311192B2 (ref) 1972-07-26 1972-07-26
US05/379,972 US4119259A (en) 1972-07-26 1973-07-17 Automatic bonding apparatus for assembling semiconductor devices
GB3426373A GB1433198A (en) 1972-07-26 1973-07-18 Automatic thermocompression wire bonding apparatus
AU58322/73A AU5832273A (en) 1972-07-26 1973-07-20 Automatic bonding apparatus
DE2337303A DE2337303B2 (de) 1972-07-26 1973-07-23 Automatische Verbindungsvorrichtung insbesondere zum Zusammenbau von Halbleiteranordnungen
HK762/76*UA HK76276A (en) 1972-07-26 1976-12-02 Automatic thermocompression wire bonding apparatus
MY101/77A MY7700101A (en) 1972-07-26 1977-12-30 Automatic thermocompression wire bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7418372A JPS5311192B2 (ref) 1972-07-26 1972-07-26

Publications (2)

Publication Number Publication Date
JPS4933565A true JPS4933565A (ref) 1974-03-28
JPS5311192B2 JPS5311192B2 (ref) 1978-04-19

Family

ID=13539787

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7418372A Expired JPS5311192B2 (ref) 1972-07-26 1972-07-26

Country Status (7)

Country Link
US (1) US4119259A (ref)
JP (1) JPS5311192B2 (ref)
AU (1) AU5832273A (ref)
DE (1) DE2337303B2 (ref)
GB (1) GB1433198A (ref)
HK (1) HK76276A (ref)
MY (1) MY7700101A (ref)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52139016A (en) * 1976-05-15 1977-11-19 Toei Chemical Kk Method of manufacturing dimer acid dimethyl ester
JPS5323306A (en) * 1976-08-16 1978-03-03 Toei Chemical Kk Filteration method of dimer acid dimethyl ester
JPS5389659A (en) * 1977-01-19 1978-08-07 Shinkawa Seisakusho Kk Wire bonder
JPS5416981A (en) * 1977-07-08 1979-02-07 Shinkawa Seisakusho Kk Device for bonding wires
JPS5423377A (en) * 1977-07-24 1979-02-21 Shinkawa Seisakusho Kk Device for bonding wires

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2457746C2 (de) * 1974-12-06 1983-06-16 Deutsche Itt Industries Gmbh, 7800 Freiburg Planar-Halbleiterbauelement und Verfahren zu seiner Herstellung
DE2917110A1 (de) * 1979-04-27 1980-10-30 Preh Elektro Feinmechanik Verfahren zur verkleinerung des abstandes von mit einer traegerplatte verbindbaren kontaktfahnen auf das rastermass
US4371105A (en) * 1980-07-23 1983-02-01 Melton Vernon L Cam controlled multi-axis automatic welding machine
GB8415912D0 (en) * 1984-06-21 1984-07-25 Abbalong Ltd Step and repeat apparatus
DE3447587A1 (de) * 1984-12-28 1986-07-10 Foton Production Automation GmbH Präzisionsmaschinenbau, 8000 München Maschine zum befestigen der verbindungsdraehte an den anschlussstellen eines halbleiterbauelements und des das halbleiterbauelement aufnehmenden gehaeuses
DE8714814U1 (de) * 1987-11-06 1989-03-09 J. Mühlbauer GmbH, 8495 Roding Die-Bonder
US5653375A (en) * 1994-10-29 1997-08-05 Samsung Aerospace Industries, Ltd. Wire bonding apparatus
JP6250372B2 (ja) * 2013-11-22 2017-12-20 Ntn株式会社 自動溶接機

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3110425A (en) * 1961-01-10 1963-11-12 Gen Motors Corp Fluid dispensing apparatus
US3342395A (en) * 1966-10-10 1967-09-19 Unitek Corp Precision drive apparatus for a tool mount
US3653268A (en) * 1970-03-10 1972-04-04 John C Diepeveen Tool moving mechanism
US3773240A (en) * 1972-03-06 1973-11-20 Texas Instruments Inc Automatic bonding machine
US3813022A (en) * 1972-06-19 1974-05-28 Automated Equipment Corp Wire bonder apparatus

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52139016A (en) * 1976-05-15 1977-11-19 Toei Chemical Kk Method of manufacturing dimer acid dimethyl ester
JPS5323306A (en) * 1976-08-16 1978-03-03 Toei Chemical Kk Filteration method of dimer acid dimethyl ester
JPS5389659A (en) * 1977-01-19 1978-08-07 Shinkawa Seisakusho Kk Wire bonder
JPS5416981A (en) * 1977-07-08 1979-02-07 Shinkawa Seisakusho Kk Device for bonding wires
JPS5423377A (en) * 1977-07-24 1979-02-21 Shinkawa Seisakusho Kk Device for bonding wires

Also Published As

Publication number Publication date
JPS5311192B2 (ref) 1978-04-19
AU5832273A (en) 1975-01-23
DE2337303B2 (de) 1975-05-15
DE2337303A1 (de) 1974-02-14
GB1433198A (en) 1976-04-22
HK76276A (en) 1976-12-10
US4119259A (en) 1978-10-10
MY7700101A (en) 1977-12-31

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