MY7700101A - Automatic thermocompression wire bonding apparatus - Google Patents

Automatic thermocompression wire bonding apparatus

Info

Publication number
MY7700101A
MY7700101A MY101/77A MY7700101A MY7700101A MY 7700101 A MY7700101 A MY 7700101A MY 101/77 A MY101/77 A MY 101/77A MY 7700101 A MY7700101 A MY 7700101A MY 7700101 A MY7700101 A MY 7700101A
Authority
MY
Malaysia
Prior art keywords
wire bonding
bonding apparatus
thermocompression wire
automatic
automatic thermocompression
Prior art date
Application number
MY101/77A
Other languages
English (en)
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Publication of MY7700101A publication Critical patent/MY7700101A/xx

Links

Classifications

    • H10W72/075—
    • H10W72/01551—
    • H10W72/0711—
    • H10W72/07141—
    • H10W72/07511—
    • H10W72/07521—
    • H10W72/07532—
    • H10W72/50—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/5449—
    • H10W72/932—
    • H10W90/756—
MY101/77A 1972-07-26 1977-12-30 Automatic thermocompression wire bonding apparatus MY7700101A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7418372A JPS5311192B2 (ref) 1972-07-26 1972-07-26

Publications (1)

Publication Number Publication Date
MY7700101A true MY7700101A (en) 1977-12-31

Family

ID=13539787

Family Applications (1)

Application Number Title Priority Date Filing Date
MY101/77A MY7700101A (en) 1972-07-26 1977-12-30 Automatic thermocompression wire bonding apparatus

Country Status (7)

Country Link
US (1) US4119259A (ref)
JP (1) JPS5311192B2 (ref)
AU (1) AU5832273A (ref)
DE (1) DE2337303B2 (ref)
GB (1) GB1433198A (ref)
HK (1) HK76276A (ref)
MY (1) MY7700101A (ref)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2457746C2 (de) * 1974-12-06 1983-06-16 Deutsche Itt Industries Gmbh, 7800 Freiburg Planar-Halbleiterbauelement und Verfahren zu seiner Herstellung
JPS52139016A (en) * 1976-05-15 1977-11-19 Toei Chemical Kk Method of manufacturing dimer acid dimethyl ester
JPS5323306A (en) * 1976-08-16 1978-03-03 Toei Chemical Kk Filteration method of dimer acid dimethyl ester
JPS5389659A (en) * 1977-01-19 1978-08-07 Shinkawa Seisakusho Kk Wire bonder
JPS5416981A (en) * 1977-07-08 1979-02-07 Shinkawa Seisakusho Kk Device for bonding wires
JPS5826663B2 (ja) * 1977-07-24 1983-06-04 株式会社新川 ワイヤボンディング方法
DE2917110A1 (de) * 1979-04-27 1980-10-30 Preh Elektro Feinmechanik Verfahren zur verkleinerung des abstandes von mit einer traegerplatte verbindbaren kontaktfahnen auf das rastermass
US4371105A (en) * 1980-07-23 1983-02-01 Melton Vernon L Cam controlled multi-axis automatic welding machine
GB8415912D0 (en) * 1984-06-21 1984-07-25 Abbalong Ltd Step and repeat apparatus
DE3447587A1 (de) * 1984-12-28 1986-07-10 Foton Production Automation GmbH Präzisionsmaschinenbau, 8000 München Maschine zum befestigen der verbindungsdraehte an den anschlussstellen eines halbleiterbauelements und des das halbleiterbauelement aufnehmenden gehaeuses
DE8714814U1 (de) * 1987-11-06 1989-03-09 J. Mühlbauer GmbH, 8495 Roding Die-Bonder
US5653375A (en) * 1994-10-29 1997-08-05 Samsung Aerospace Industries, Ltd. Wire bonding apparatus
JP6250372B2 (ja) * 2013-11-22 2017-12-20 Ntn株式会社 自動溶接機

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3110425A (en) * 1961-01-10 1963-11-12 Gen Motors Corp Fluid dispensing apparatus
US3342395A (en) * 1966-10-10 1967-09-19 Unitek Corp Precision drive apparatus for a tool mount
US3653268A (en) * 1970-03-10 1972-04-04 John C Diepeveen Tool moving mechanism
US3773240A (en) * 1972-03-06 1973-11-20 Texas Instruments Inc Automatic bonding machine
US3813022A (en) * 1972-06-19 1974-05-28 Automated Equipment Corp Wire bonder apparatus

Also Published As

Publication number Publication date
JPS5311192B2 (ref) 1978-04-19
AU5832273A (en) 1975-01-23
DE2337303B2 (de) 1975-05-15
DE2337303A1 (de) 1974-02-14
GB1433198A (en) 1976-04-22
HK76276A (en) 1976-12-10
JPS4933565A (ref) 1974-03-28
US4119259A (en) 1978-10-10

Similar Documents

Publication Publication Date Title
JPS5366370A (en) Tool for bonding lead wire
ZA733704B (en) Wire connector
ZA731693B (en) Wire crate
ZA73379B (en) Wire cable anchoring arrangement
YU35789B (en) Device for manufacturing a wire rope
MY7700101A (en) Automatic thermocompression wire bonding apparatus
HK30879A (en) Wire bonding apparatus
GB1367833A (en) Bonding
YU36202B (en) Device for anchoring wires or stranded wires
GB1437422A (en) Strainer device
GB1524462A (en) Wire bonding apparartus
GB1556172A (en) Wire bonding unit
GB1416536A (en) Wire rwapping apparatus
CA986902A (en) Wire twisting device
JPS51146350A (en) Ultrasonic wire bonding device
ZA733915B (en) Electrotinning wire
AU6284073A (en) Wire strainer
JPS5281046A (en) Ultrasonic wire bonding device
CA909200A (en) Automatic guy wire tensioning device
AU478287B2 (en) wire TENSIONING DEVICE
ZA722603B (en) Bonding method
CA897328A (en) Automatic semiconductor bonding machine
AU464172B2 (en) Wire clamping device
AU5518673A (en) Wire rope connector
CA820664A (en) Barbed wire machine