JPS4933565A - - Google Patents
Info
- Publication number
- JPS4933565A JPS4933565A JP47074183A JP7418372A JPS4933565A JP S4933565 A JPS4933565 A JP S4933565A JP 47074183 A JP47074183 A JP 47074183A JP 7418372 A JP7418372 A JP 7418372A JP S4933565 A JPS4933565 A JP S4933565A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85043—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a flame torch, e.g. hydrogen torch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85203—Thermocompression bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01027—Cobalt [Co]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01063—Europium [Eu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7418372A JPS5311192B2 (ja) | 1972-07-26 | 1972-07-26 | |
US05/379,972 US4119259A (en) | 1972-07-26 | 1973-07-17 | Automatic bonding apparatus for assembling semiconductor devices |
GB3426373A GB1433198A (en) | 1972-07-26 | 1973-07-18 | Automatic thermocompression wire bonding apparatus |
AU58322/73A AU5832273A (en) | 1972-07-26 | 1973-07-20 | Automatic bonding apparatus |
DE2337303A DE2337303B2 (de) | 1972-07-26 | 1973-07-23 | Automatische Verbindungsvorrichtung insbesondere zum Zusammenbau von Halbleiteranordnungen |
HK762/76*UA HK76276A (en) | 1972-07-26 | 1976-12-02 | Automatic thermocompression wire bonding apparatus |
MY101/77A MY7700101A (en) | 1972-07-26 | 1977-12-30 | Automatic thermocompression wire bonding apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7418372A JPS5311192B2 (ja) | 1972-07-26 | 1972-07-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS4933565A true JPS4933565A (ja) | 1974-03-28 |
JPS5311192B2 JPS5311192B2 (ja) | 1978-04-19 |
Family
ID=13539787
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7418372A Expired JPS5311192B2 (ja) | 1972-07-26 | 1972-07-26 |
Country Status (7)
Country | Link |
---|---|
US (1) | US4119259A (ja) |
JP (1) | JPS5311192B2 (ja) |
AU (1) | AU5832273A (ja) |
DE (1) | DE2337303B2 (ja) |
GB (1) | GB1433198A (ja) |
HK (1) | HK76276A (ja) |
MY (1) | MY7700101A (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52139016A (en) * | 1976-05-15 | 1977-11-19 | Toei Chemical Kk | Method of manufacturing dimer acid dimethyl ester |
JPS5323306A (en) * | 1976-08-16 | 1978-03-03 | Toei Chemical Kk | Filteration method of dimer acid dimethyl ester |
JPS5389659A (en) * | 1977-01-19 | 1978-08-07 | Shinkawa Seisakusho Kk | Wire bonder |
JPS5416981A (en) * | 1977-07-08 | 1979-02-07 | Shinkawa Seisakusho Kk | Device for bonding wires |
JPS5423377A (en) * | 1977-07-24 | 1979-02-21 | Shinkawa Seisakusho Kk | Device for bonding wires |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2457746C2 (de) * | 1974-12-06 | 1983-06-16 | Deutsche Itt Industries Gmbh, 7800 Freiburg | Planar-Halbleiterbauelement und Verfahren zu seiner Herstellung |
DE2917110A1 (de) * | 1979-04-27 | 1980-10-30 | Preh Elektro Feinmechanik | Verfahren zur verkleinerung des abstandes von mit einer traegerplatte verbindbaren kontaktfahnen auf das rastermass |
US4371105A (en) * | 1980-07-23 | 1983-02-01 | Melton Vernon L | Cam controlled multi-axis automatic welding machine |
GB8415912D0 (en) * | 1984-06-21 | 1984-07-25 | Abbalong Ltd | Step and repeat apparatus |
DE3447587A1 (de) * | 1984-12-28 | 1986-07-10 | Foton Production Automation GmbH Präzisionsmaschinenbau, 8000 München | Maschine zum befestigen der verbindungsdraehte an den anschlussstellen eines halbleiterbauelements und des das halbleiterbauelement aufnehmenden gehaeuses |
DE8714814U1 (ja) * | 1987-11-06 | 1989-03-09 | J. Muehlbauer Gmbh, 8495 Roding, De | |
US5653375A (en) * | 1994-10-29 | 1997-08-05 | Samsung Aerospace Industries, Ltd. | Wire bonding apparatus |
JP6250372B2 (ja) * | 2013-11-22 | 2017-12-20 | Ntn株式会社 | 自動溶接機 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3110425A (en) * | 1961-01-10 | 1963-11-12 | Gen Motors Corp | Fluid dispensing apparatus |
US3342395A (en) * | 1966-10-10 | 1967-09-19 | Unitek Corp | Precision drive apparatus for a tool mount |
US3653268A (en) * | 1970-03-10 | 1972-04-04 | John C Diepeveen | Tool moving mechanism |
US3773240A (en) * | 1972-03-06 | 1973-11-20 | Texas Instruments Inc | Automatic bonding machine |
US3813022A (en) * | 1972-06-19 | 1974-05-28 | Automated Equipment Corp | Wire bonder apparatus |
-
1972
- 1972-07-26 JP JP7418372A patent/JPS5311192B2/ja not_active Expired
-
1973
- 1973-07-17 US US05/379,972 patent/US4119259A/en not_active Expired - Lifetime
- 1973-07-18 GB GB3426373A patent/GB1433198A/en not_active Expired
- 1973-07-20 AU AU58322/73A patent/AU5832273A/en not_active Expired
- 1973-07-23 DE DE2337303A patent/DE2337303B2/de active Pending
-
1976
- 1976-12-02 HK HK762/76*UA patent/HK76276A/xx unknown
-
1977
- 1977-12-30 MY MY101/77A patent/MY7700101A/xx unknown
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52139016A (en) * | 1976-05-15 | 1977-11-19 | Toei Chemical Kk | Method of manufacturing dimer acid dimethyl ester |
JPS5437963B2 (ja) * | 1976-05-15 | 1979-11-17 | ||
JPS5323306A (en) * | 1976-08-16 | 1978-03-03 | Toei Chemical Kk | Filteration method of dimer acid dimethyl ester |
JPS5615760B2 (ja) * | 1976-08-16 | 1981-04-11 | ||
JPS5389659A (en) * | 1977-01-19 | 1978-08-07 | Shinkawa Seisakusho Kk | Wire bonder |
JPS5751934B2 (ja) * | 1977-01-19 | 1982-11-05 | ||
JPS5416981A (en) * | 1977-07-08 | 1979-02-07 | Shinkawa Seisakusho Kk | Device for bonding wires |
JPS5758050B2 (ja) * | 1977-07-08 | 1982-12-08 | Shinkawa Kk | |
JPS5423377A (en) * | 1977-07-24 | 1979-02-21 | Shinkawa Seisakusho Kk | Device for bonding wires |
JPS5826663B2 (ja) * | 1977-07-24 | 1983-06-04 | 株式会社新川 | ワイヤボンディング方法 |
Also Published As
Publication number | Publication date |
---|---|
DE2337303B2 (de) | 1975-05-15 |
GB1433198A (en) | 1976-04-22 |
DE2337303A1 (de) | 1974-02-14 |
JPS5311192B2 (ja) | 1978-04-19 |
US4119259A (en) | 1978-10-10 |
MY7700101A (en) | 1977-12-31 |
HK76276A (en) | 1976-12-10 |
AU5832273A (en) | 1975-01-23 |