JPS4923577A - - Google Patents

Info

Publication number
JPS4923577A
JPS4923577A JP6296772A JP6296772A JPS4923577A JP S4923577 A JPS4923577 A JP S4923577A JP 6296772 A JP6296772 A JP 6296772A JP 6296772 A JP6296772 A JP 6296772A JP S4923577 A JPS4923577 A JP S4923577A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6296772A
Other languages
Japanese (ja)
Other versions
JPS5117383B2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP6296772A priority Critical patent/JPS5117383B2/ja
Publication of JPS4923577A publication Critical patent/JPS4923577A/ja
Publication of JPS5117383B2 publication Critical patent/JPS5117383B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP6296772A 1972-06-22 1972-06-22 Expired JPS5117383B2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6296772A JPS5117383B2 (enrdf_load_stackoverflow) 1972-06-22 1972-06-22

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6296772A JPS5117383B2 (enrdf_load_stackoverflow) 1972-06-22 1972-06-22

Publications (2)

Publication Number Publication Date
JPS4923577A true JPS4923577A (enrdf_load_stackoverflow) 1974-03-02
JPS5117383B2 JPS5117383B2 (enrdf_load_stackoverflow) 1976-06-02

Family

ID=13215600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6296772A Expired JPS5117383B2 (enrdf_load_stackoverflow) 1972-06-22 1972-06-22

Country Status (1)

Country Link
JP (1) JPS5117383B2 (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5129874A (ja) * 1974-09-06 1976-03-13 Hitachi Ltd Jushifushigatahandotaisochi
JPS522171A (en) * 1975-06-24 1977-01-08 Hitachi Ltd Electronic parts
JPS5268171U (enrdf_load_stackoverflow) * 1975-11-14 1977-05-20
JPS53156295U (enrdf_load_stackoverflow) * 1977-05-13 1978-12-07
JPS55152741A (en) * 1979-05-17 1980-11-28 Mitsui Toatsu Chem Inc Phenol-modified melamine resin with improved stability
JPS568857A (en) * 1980-06-23 1981-01-29 Hitachi Ltd Resin sealing type semiconductor device
JPS568858A (en) * 1980-06-23 1981-01-29 Hitachi Ltd Resin sealing type semiconductor device
JPS6163843U (enrdf_load_stackoverflow) * 1984-09-28 1986-04-30
JPH01230686A (ja) * 1988-03-11 1989-09-14 Nippon Kasei Kk フェノール変性メラミン樹脂接着剤

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5129874A (ja) * 1974-09-06 1976-03-13 Hitachi Ltd Jushifushigatahandotaisochi
JPS522171A (en) * 1975-06-24 1977-01-08 Hitachi Ltd Electronic parts
JPS5268171U (enrdf_load_stackoverflow) * 1975-11-14 1977-05-20
JPS53156295U (enrdf_load_stackoverflow) * 1977-05-13 1978-12-07
JPS55152741A (en) * 1979-05-17 1980-11-28 Mitsui Toatsu Chem Inc Phenol-modified melamine resin with improved stability
JPS568857A (en) * 1980-06-23 1981-01-29 Hitachi Ltd Resin sealing type semiconductor device
JPS568858A (en) * 1980-06-23 1981-01-29 Hitachi Ltd Resin sealing type semiconductor device
JPS6163843U (enrdf_load_stackoverflow) * 1984-09-28 1986-04-30
JPH01230686A (ja) * 1988-03-11 1989-09-14 Nippon Kasei Kk フェノール変性メラミン樹脂接着剤

Also Published As

Publication number Publication date
JPS5117383B2 (enrdf_load_stackoverflow) 1976-06-02

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