JPS5117383B2 - - Google Patents
Info
- Publication number
- JPS5117383B2 JPS5117383B2 JP6296772A JP6296772A JPS5117383B2 JP S5117383 B2 JPS5117383 B2 JP S5117383B2 JP 6296772 A JP6296772 A JP 6296772A JP 6296772 A JP6296772 A JP 6296772A JP S5117383 B2 JPS5117383 B2 JP S5117383B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6296772A JPS5117383B2 (enrdf_load_stackoverflow) | 1972-06-22 | 1972-06-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6296772A JPS5117383B2 (enrdf_load_stackoverflow) | 1972-06-22 | 1972-06-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4923577A JPS4923577A (enrdf_load_stackoverflow) | 1974-03-02 |
| JPS5117383B2 true JPS5117383B2 (enrdf_load_stackoverflow) | 1976-06-02 |
Family
ID=13215600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6296772A Expired JPS5117383B2 (enrdf_load_stackoverflow) | 1972-06-22 | 1972-06-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5117383B2 (enrdf_load_stackoverflow) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5129874A (ja) * | 1974-09-06 | 1976-03-13 | Hitachi Ltd | Jushifushigatahandotaisochi |
| JPS522171A (en) * | 1975-06-24 | 1977-01-08 | Hitachi Ltd | Electronic parts |
| JPS5629969Y2 (enrdf_load_stackoverflow) * | 1975-11-14 | 1981-07-16 | ||
| JPS5554638Y2 (enrdf_load_stackoverflow) * | 1977-05-13 | 1980-12-17 | ||
| JPS55152741A (en) * | 1979-05-17 | 1980-11-28 | Mitsui Toatsu Chem Inc | Phenol-modified melamine resin with improved stability |
| JPS568858A (en) * | 1980-06-23 | 1981-01-29 | Hitachi Ltd | Resin sealing type semiconductor device |
| JPS568857A (en) * | 1980-06-23 | 1981-01-29 | Hitachi Ltd | Resin sealing type semiconductor device |
| JPS6163843U (enrdf_load_stackoverflow) * | 1984-09-28 | 1986-04-30 | ||
| JP2654958B2 (ja) * | 1988-03-11 | 1997-09-17 | 日本化成株式会社 | フェノール変性メラミン樹脂接着剤 |
-
1972
- 1972-06-22 JP JP6296772A patent/JPS5117383B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS4923577A (enrdf_load_stackoverflow) | 1974-03-02 |