JPS4917969A - - Google Patents
Info
- Publication number
- JPS4917969A JPS4917969A JP48037490A JP3749073A JPS4917969A JP S4917969 A JPS4917969 A JP S4917969A JP 48037490 A JP48037490 A JP 48037490A JP 3749073 A JP3749073 A JP 3749073A JP S4917969 A JPS4917969 A JP S4917969A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01025—Manganese [Mn]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12033—Gunn diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL7204574.A NL159818B (nl) | 1972-04-06 | 1972-04-06 | Halfgeleiderinrichting, bevattende een flexibele isolerende folie, die aan een zijde is voorzien van metalen geleider- sporen. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4917969A true JPS4917969A (US08124317-20120228-C00026.png) | 1974-02-16 |
| JPS5113993B2 JPS5113993B2 (US08124317-20120228-C00026.png) | 1976-05-06 |
Family
ID=19815786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48037490A Expired JPS5113993B2 (US08124317-20120228-C00026.png) | 1972-04-06 | 1973-04-03 |
Country Status (9)
Families Citing this family (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1478797A (en) * | 1974-09-17 | 1977-07-06 | Siemens Ag | Semiconductor arrangements |
| JPS5649559Y2 (US08124317-20120228-C00026.png) * | 1976-03-25 | 1981-11-19 | ||
| DE2742882C2 (de) * | 1977-09-23 | 1986-10-09 | Blaupunkt-Werke Gmbh, 3200 Hildesheim | Elektronisches Bauelement |
| FR2521350B1 (fr) * | 1982-02-05 | 1986-01-24 | Hitachi Ltd | Boitier porteur de puce semi-conductrice |
| US4602314A (en) * | 1983-10-14 | 1986-07-22 | Intel Corporation | Heat conduction mechanism for semiconductor devices |
| JPS6092829U (ja) * | 1983-11-30 | 1985-06-25 | アルプス電気株式会社 | マイクロ波トランジスタの取付構造体 |
| DE3402538A1 (de) * | 1984-01-26 | 1985-08-01 | Robert Bosch Gmbh, 7000 Stuttgart | Waermeableitende befestigung |
| US4835598A (en) * | 1985-06-13 | 1989-05-30 | Matsushita Electric Works, Ltd. | Wiring board |
| DE3627372C3 (de) * | 1986-08-12 | 1994-04-14 | Loewe Opta Gmbh | Anordnung, bestehend aus einer Leiterplatte, einem Kühlkörper und zu kühlenden elektronischen Bauelementen |
| US4962416A (en) * | 1988-04-18 | 1990-10-09 | International Business Machines Corporation | Electronic package with a device positioned above a substrate by suction force between the device and heat sink |
| US4849856A (en) * | 1988-07-13 | 1989-07-18 | International Business Machines Corp. | Electronic package with improved heat sink |
| JPH0310224A (ja) * | 1989-06-07 | 1991-01-17 | Sharp Corp | 表示装置 |
| GB2237682A (en) * | 1989-09-28 | 1991-05-08 | Redpoint Limited | Heatsink for semiconductor devices |
| GB2240425B (en) * | 1990-01-20 | 1994-01-12 | Motorola Ltd | Radio transmitter power amplifier with cooling apparatus |
| US5263245A (en) * | 1992-01-27 | 1993-11-23 | International Business Machines Corporation | Method of making an electronic package with enhanced heat sinking |
| US5278724A (en) * | 1992-07-06 | 1994-01-11 | International Business Machines Corporation | Electronic package and method of making same |
| ATE203355T1 (de) * | 1995-06-27 | 2001-08-15 | Braun Gmbh | Wärmeleite-befestigung eines elektronischen leistungsbauelementes auf einer leiterplatte mit kühlblech |
| IT1285396B1 (it) * | 1996-06-04 | 1998-06-03 | Magneti Marelli Spa | Dispositivo dissipatore per circuiti integrati. |
| FR2764114B1 (fr) * | 1997-06-02 | 2003-04-25 | Sgs Thomson Microelectronics | Dispositif semi-conducteur muni d'un dissipateur thermique |
| US6861735B2 (en) * | 1997-06-27 | 2005-03-01 | Matsushita Electric Industrial Co., Ltd. | Resin molded type semiconductor device and a method of manufacturing the same |
| JP2915892B2 (ja) * | 1997-06-27 | 1999-07-05 | 松下電子工業株式会社 | 樹脂封止型半導体装置およびその製造方法 |
| JP3003638B2 (ja) * | 1997-08-05 | 2000-01-31 | 日本電気株式会社 | 半導体装置、その製造方法 |
| US7023087B1 (en) * | 1998-08-05 | 2006-04-04 | Agere Systems Inc. | Integrated circuit carrier and method of manufacturing and integrated circuit |
| DE19853777A1 (de) * | 1998-11-21 | 2000-05-25 | Wuerth Elektronik Gmbh & Co Kg | Kühlelement für Leiterplatten |
| DE19905055A1 (de) | 1999-02-08 | 2000-08-17 | Siemens Ag | Halbleiterbauelement mit einem Chipträger mit Öffnungen zur Kontaktierung |
| TW428295B (en) | 1999-02-24 | 2001-04-01 | Matsushita Electronics Corp | Resin-sealing semiconductor device, the manufacturing method and the lead frame thereof |
| US6215663B1 (en) * | 2000-03-16 | 2001-04-10 | Philips Electronics North America Corporation | Printed circuit board assembly with improved thermal performance |
| DE102004057494A1 (de) * | 2004-11-29 | 2006-06-08 | Siemens Ag | Metallisierte Folie zur flächigen Kontaktierung |
| DE102010013334A1 (de) * | 2010-03-30 | 2012-05-10 | Borgwarner Beru Systems Gmbh | Leiterplatte mit Bauelement und Verfahren zum Bestücken einer Leiterplatte |
| US8987875B2 (en) | 2013-03-08 | 2015-03-24 | Delphi Technologies, Inc. | Balanced stress assembly for semiconductor devices |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3614832A (en) * | 1966-03-09 | 1971-10-26 | Ibm | Decal connectors and methods of forming decal connections to solid state devices |
| US3480836A (en) * | 1966-08-11 | 1969-11-25 | Ibm | Component mounted in a printed circuit |
| US3544857A (en) * | 1966-08-16 | 1970-12-01 | Signetics Corp | Integrated circuit assembly with lead structure and method |
| US3624462A (en) * | 1969-07-03 | 1971-11-30 | Fairchild Camera Instr Co | Face-bonded photoarray package |
| US3724068A (en) * | 1971-02-25 | 1973-04-03 | Du Pont | Semiconductor chip packaging apparatus and method |
| US3711625A (en) * | 1971-03-31 | 1973-01-16 | Microsystems Int Ltd | Plastic support means for lead frame ends |
-
1972
- 1972-04-06 NL NL7204574.A patent/NL159818B/xx unknown
-
1973
- 1973-03-22 DE DE2314247A patent/DE2314247C3/de not_active Expired
- 1973-03-26 US US00345136A patent/US3825803A/en not_active Expired - Lifetime
- 1973-04-02 CA CA167,681A patent/CA974663A/en not_active Expired
- 1973-04-03 GB GB1590473A patent/GB1418520A/en not_active Expired
- 1973-04-03 IT IT22533/73A patent/IT981860B/it active
- 1973-04-03 CH CH475673A patent/CH551690A/xx not_active IP Right Cessation
- 1973-04-03 JP JP48037490A patent/JPS5113993B2/ja not_active Expired
- 1973-04-04 FR FR7312123A patent/FR2179103B1/fr not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| FR2179103B1 (US08124317-20120228-C00026.png) | 1978-05-26 |
| DE2314247C3 (de) | 1979-07-05 |
| FR2179103A1 (US08124317-20120228-C00026.png) | 1973-11-16 |
| US3825803A (en) | 1974-07-23 |
| GB1418520A (en) | 1975-12-24 |
| CH551690A (de) | 1974-07-15 |
| IT981860B (it) | 1974-10-10 |
| DE2314247A1 (de) | 1973-10-18 |
| CA974663A (en) | 1975-09-16 |
| JPS5113993B2 (US08124317-20120228-C00026.png) | 1976-05-06 |
| DE2314247B2 (de) | 1978-10-26 |
| NL159818B (nl) | 1979-03-15 |
| NL7204574A (US08124317-20120228-C00026.png) | 1973-10-09 |
