JPS49135832A - - Google Patents
Info
- Publication number
- JPS49135832A JPS49135832A JP48139258A JP13925873A JPS49135832A JP S49135832 A JPS49135832 A JP S49135832A JP 48139258 A JP48139258 A JP 48139258A JP 13925873 A JP13925873 A JP 13925873A JP S49135832 A JPS49135832 A JP S49135832A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US31511272A | 1972-12-14 | 1972-12-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS49135832A true JPS49135832A (enrdf_load_html_response) | 1974-12-27 |
| JPS5727190B2 JPS5727190B2 (enrdf_load_html_response) | 1982-06-09 |
Family
ID=23222945
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13925873A Expired JPS5727190B2 (enrdf_load_html_response) | 1972-12-14 | 1973-12-12 |
Country Status (11)
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5791594A (en) * | 1980-11-29 | 1982-06-07 | Anritsu Electric Co Ltd | Method of plating through hole with copper |
| JPS6482598A (en) * | 1987-09-24 | 1989-03-28 | Fujitsu Ltd | Copper plating method for printed board |
| JP2007517140A (ja) * | 2003-12-22 | 2007-06-28 | エントン インコーポレイテッド | 微小電子機器における銅の電着 |
| JP2015510038A (ja) * | 2012-01-25 | 2015-04-02 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ | つや消し銅めっきの製造方法 |
| JP2023547583A (ja) * | 2021-10-26 | 2023-11-13 | 寧徳時代新能源科技股▲分▼有限公司 | 銅めっき液及びそれにより製造された負極複合集電体 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS641687A (en) * | 1987-03-28 | 1989-01-06 | Toshiji Shimokawa | Water discharging device for vessel |
| GB8801827D0 (en) * | 1988-01-27 | 1988-02-24 | Jct Controls Ltd | Improvements in electrochemical processes |
| DE10100954A1 (de) * | 2001-01-11 | 2002-07-18 | Raschig Gmbh | Verwendung von Polyolefinen mit basischen, aromatischen Substituenten als Hilfsmittel zur elektrolytischen Abscheidung von metallischen Schichten |
| FR3152590B1 (fr) | 2023-08-31 | 2025-09-05 | Safran Aircraft Engines | Dispositif de surveillance vibratoire d’un système de transmission de puissance mécanique d’un moteur d’aéronef |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3328273A (en) * | 1966-08-15 | 1967-06-27 | Udylite Corp | Electro-deposition of copper from acidic baths |
| US3542655A (en) * | 1968-04-29 | 1970-11-24 | M & T Chemicals Inc | Electrodeposition of copper |
| ZA708430B (en) * | 1970-02-12 | 1971-09-29 | Udylite Corp | Electrodeposition of copper from acidic baths |
| US3682788A (en) * | 1970-07-28 | 1972-08-08 | M & T Chemicals Inc | Copper electroplating |
-
1973
- 1973-12-06 ZA ZA739310A patent/ZA739310B/xx unknown
- 1973-12-06 DE DE2360892A patent/DE2360892A1/de not_active Withdrawn
- 1973-12-12 FR FR7344403A patent/FR2210673B1/fr not_active Expired
- 1973-12-12 BE BE138804A patent/BE808564A/xx not_active IP Right Cessation
- 1973-12-12 JP JP13925873A patent/JPS5727190B2/ja not_active Expired
- 1973-12-13 IT IT9720/73A patent/IT1000992B/it active
- 1973-12-13 GB GB5792473A patent/GB1433040A/en not_active Expired
- 1973-12-13 PL PL1973167270A patent/PL94267B1/pl unknown
- 1973-12-13 CA CA188,095A patent/CA1020900A/en not_active Expired
- 1973-12-14 NL NL7317204A patent/NL7317204A/xx not_active Application Discontinuation
- 1973-12-14 CS CS738691A patent/CS191224B2/cs unknown
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5791594A (en) * | 1980-11-29 | 1982-06-07 | Anritsu Electric Co Ltd | Method of plating through hole with copper |
| JPS6482598A (en) * | 1987-09-24 | 1989-03-28 | Fujitsu Ltd | Copper plating method for printed board |
| JP2007517140A (ja) * | 2003-12-22 | 2007-06-28 | エントン インコーポレイテッド | 微小電子機器における銅の電着 |
| JP2015510038A (ja) * | 2012-01-25 | 2015-04-02 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツングＡｔｏｔｅｃｈ Ｄｅｕｔｓｃｈｌａｎｄ ＧｍｂＨ | つや消し銅めっきの製造方法 |
| JP2023547583A (ja) * | 2021-10-26 | 2023-11-13 | 寧徳時代新能源科技股▲分▼有限公司 | 銅めっき液及びそれにより製造された負極複合集電体 |
| US11932959B2 (en) | 2021-10-26 | 2024-03-19 | Contemporary Amperex Technology Co., Limited | Copper plating solution and negative electrode composite current collector prepared using same |
Also Published As
| Publication number | Publication date |
|---|---|
| AU6354273A (en) | 1975-06-12 |
| PL94267B1 (enrdf_load_html_response) | 1977-07-30 |
| GB1433040A (en) | 1976-04-22 |
| JPS5727190B2 (enrdf_load_html_response) | 1982-06-09 |
| ZA739310B (en) | 1974-11-27 |
| FR2210673B1 (enrdf_load_html_response) | 1977-08-19 |
| DE2360892A1 (de) | 1974-06-20 |
| FR2210673A1 (enrdf_load_html_response) | 1974-07-12 |
| BE808564A (fr) | 1974-03-29 |
| CS191224B2 (en) | 1979-06-29 |
| CA1020900A (en) | 1977-11-15 |
| NL7317204A (enrdf_load_html_response) | 1974-06-18 |
| IT1000992B (it) | 1976-04-10 |