JPS4913112B1 - - Google Patents
Info
- Publication number
- JPS4913112B1 JPS4913112B1 JP45011069A JP1106970A JPS4913112B1 JP S4913112 B1 JPS4913112 B1 JP S4913112B1 JP 45011069 A JP45011069 A JP 45011069A JP 1106970 A JP1106970 A JP 1106970A JP S4913112 B1 JPS4913112 B1 JP S4913112B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/68—Shapes or dispositions thereof
- H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/15—Containers comprising an insulating or insulated base
- H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12188—All metal or with adjacent metals having marginal feature for indexing or weakened portion for severing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/1234—Honeycomb, or with grain orientation or elongated elements in defined angular relationship in respective components [e.g., parallel, inter- secting, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12361—All metal or with adjacent metals having aperture or cut
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US80390369A | 1969-03-03 | 1969-03-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS4913112B1 true JPS4913112B1 (enExample) | 1974-03-29 |
Family
ID=25187731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP45011069A Pending JPS4913112B1 (enExample) | 1969-03-03 | 1970-02-06 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US3550766A (enExample) |
| JP (1) | JPS4913112B1 (enExample) |
| FR (1) | FR2033678A5 (enExample) |
| GB (1) | GB1238569A (enExample) |
| NL (1) | NL6917610A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56126419U (enExample) * | 1979-12-24 | 1981-09-26 |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3665592A (en) * | 1970-03-18 | 1972-05-30 | Vernitron Corp | Ceramic package for an integrated circuit |
| US3795492A (en) * | 1970-10-09 | 1974-03-05 | Motorola Inc | Lanced and relieved lead strips |
| GB1514595A (en) * | 1975-03-03 | 1978-06-14 | Hughes Aircraft Co | Package for hermetically sealing electronic circuits |
| US4291815B1 (en) * | 1980-02-19 | 1998-09-29 | Semiconductor Packaging Materi | Ceramic lid assembly for hermetic sealing of a semiconductor chip |
| US4296456A (en) * | 1980-06-02 | 1981-10-20 | Burroughs Corporation | Electronic package for high density integrated circuits |
| GB2079534A (en) * | 1980-07-02 | 1982-01-20 | Fairchild Camera Instr Co | Package for semiconductor devices |
| FR2498814B1 (fr) * | 1981-01-26 | 1985-12-20 | Burroughs Corp | Boitier pour circuit integre, moyen pour le montage et procede de fabrication |
| US4483441A (en) * | 1981-03-26 | 1984-11-20 | Tokyo Shibaura Denki Kabushiki Kaisha | Flat-type semiconductor device and packing thereof |
| DE3379882D1 (en) * | 1982-03-02 | 1989-06-22 | Siemens Ag | Film carrier for an electrical conductor pattern |
| FR2538961B1 (fr) * | 1982-12-30 | 1985-07-12 | Europ Composants Electron | Embase pour circuit integre |
| US4663664A (en) * | 1983-10-31 | 1987-05-05 | R. F. Monolithics, Inc. | Electronic ticket method and apparatus for television signal scrambling and descrambling |
| US4768077A (en) * | 1986-02-20 | 1988-08-30 | Aegis, Inc. | Lead frame having non-conductive tie-bar for use in integrated circuit packages |
| US4815595A (en) * | 1986-12-03 | 1989-03-28 | Sgs-Thomson Microelectronics, Inc. | Uniform leadframe carrier |
| US5111935A (en) * | 1986-12-03 | 1992-05-12 | Sgs-Thomson Microelectronics, Inc. | Universal leadframe carrier |
| JPH0625976Y2 (ja) * | 1987-04-21 | 1994-07-06 | テルモ株式会社 | 電子回路用基板接続体 |
| US5063432A (en) * | 1989-05-22 | 1991-11-05 | Advanced Micro Devices, Inc. | Integrated circuit lead assembly structure with first and second lead patterns spaced apart in parallel planes with a part of each lead in one lead pattern perpendicular to a part of each lead in the other lead pattern |
| US5133118A (en) * | 1991-08-06 | 1992-07-28 | Sheldahl, Inc. | Surface mounted components on flex circuits |
| US5247423A (en) * | 1992-05-26 | 1993-09-21 | Motorola, Inc. | Stacking three dimensional leadless multi-chip module and method for making the same |
| JPH06302751A (ja) * | 1993-04-12 | 1994-10-28 | Fujitsu Ltd | 電子部品およびその接続方法 |
| US20040132888A1 (en) * | 2002-12-16 | 2004-07-08 | Ube Industries, Ltd. | Electronic device packaging and curable resin composition |
-
1969
- 1969-03-03 US US803903A patent/US3550766A/en not_active Expired - Lifetime
- 1969-10-21 GB GB1238569D patent/GB1238569A/en not_active Expired
- 1969-11-20 FR FR6940026A patent/FR2033678A5/fr not_active Expired
- 1969-11-21 NL NL6917610A patent/NL6917610A/xx unknown
-
1970
- 1970-02-06 JP JP45011069A patent/JPS4913112B1/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56126419U (enExample) * | 1979-12-24 | 1981-09-26 |
Also Published As
| Publication number | Publication date |
|---|---|
| US3550766A (en) | 1970-12-29 |
| DE1958175B2 (de) | 1972-10-05 |
| FR2033678A5 (enExample) | 1970-12-04 |
| NL6917610A (enExample) | 1970-09-07 |
| DE1958175A1 (de) | 1970-09-10 |
| GB1238569A (enExample) | 1971-07-07 |