FR2033678A5 - - Google Patents

Info

Publication number
FR2033678A5
FR2033678A5 FR6940026A FR6940026A FR2033678A5 FR 2033678 A5 FR2033678 A5 FR 2033678A5 FR 6940026 A FR6940026 A FR 6940026A FR 6940026 A FR6940026 A FR 6940026A FR 2033678 A5 FR2033678 A5 FR 2033678A5
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR6940026A
Other languages
French (fr)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Boeing North American Inc
Original Assignee
North American Rockwell Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by North American Rockwell Corp filed Critical North American Rockwell Corp
Application granted granted Critical
Publication of FR2033678A5 publication Critical patent/FR2033678A5/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/13—Containers comprising a conductive base serving as an interconnection
    • H10W76/134—Containers comprising a conductive base serving as an interconnection having other interconnections parallel to the conductive base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12188—All metal or with adjacent metals having marginal feature for indexing or weakened portion for severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/1234—Honeycomb, or with grain orientation or elongated elements in defined angular relationship in respective components [e.g., parallel, inter- secting, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12361—All metal or with adjacent metals having aperture or cut
FR6940026A 1969-03-03 1969-11-20 Expired FR2033678A5 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US80390369A 1969-03-03 1969-03-03

Publications (1)

Publication Number Publication Date
FR2033678A5 true FR2033678A5 (enExample) 1970-12-04

Family

ID=25187731

Family Applications (1)

Application Number Title Priority Date Filing Date
FR6940026A Expired FR2033678A5 (enExample) 1969-03-03 1969-11-20

Country Status (5)

Country Link
US (1) US3550766A (enExample)
JP (1) JPS4913112B1 (enExample)
FR (1) FR2033678A5 (enExample)
GB (1) GB1238569A (enExample)
NL (1) NL6917610A (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2486307A1 (fr) * 1980-07-02 1982-01-08 Fairchild Camera Instr Co Embase du genre boitier ou support pour microplaquette a semi-conducteurs
FR2498814A1 (fr) * 1981-01-26 1982-07-30 Burroughs Corp Boitier pour circuit integre, moyen pour le montage et procede de fabrication
FR2538961A1 (fr) * 1982-12-30 1984-07-06 Europ Composants Electron Embase pour circuit integre
FR2704114A1 (fr) * 1993-04-12 1994-10-21 Fujitsu Ltd Structure de boîtier pour dispositif électronique du type à montage en surface et procédé de montage d'une telle structure sur une plaquette à câblage imprimée.
EP0862217A3 (en) * 1992-05-26 1999-12-15 Motorola, Inc. Semiconductor device and semiconductor multi-chip module

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3665592A (en) * 1970-03-18 1972-05-30 Vernitron Corp Ceramic package for an integrated circuit
US3795492A (en) * 1970-10-09 1974-03-05 Motorola Inc Lanced and relieved lead strips
GB1514595A (en) * 1975-03-03 1978-06-14 Hughes Aircraft Co Package for hermetically sealing electronic circuits
JPS56126419U (enExample) * 1979-12-24 1981-09-26
US4291815B1 (en) * 1980-02-19 1998-09-29 Semiconductor Packaging Materi Ceramic lid assembly for hermetic sealing of a semiconductor chip
US4296456A (en) * 1980-06-02 1981-10-20 Burroughs Corporation Electronic package for high density integrated circuits
US4483441A (en) * 1981-03-26 1984-11-20 Tokyo Shibaura Denki Kabushiki Kaisha Flat-type semiconductor device and packing thereof
DE3379882D1 (en) * 1982-03-02 1989-06-22 Siemens Ag Film carrier for an electrical conductor pattern
US4663664A (en) * 1983-10-31 1987-05-05 R. F. Monolithics, Inc. Electronic ticket method and apparatus for television signal scrambling and descrambling
US4768077A (en) * 1986-02-20 1988-08-30 Aegis, Inc. Lead frame having non-conductive tie-bar for use in integrated circuit packages
US4815595A (en) * 1986-12-03 1989-03-28 Sgs-Thomson Microelectronics, Inc. Uniform leadframe carrier
US5111935A (en) * 1986-12-03 1992-05-12 Sgs-Thomson Microelectronics, Inc. Universal leadframe carrier
JPH0625976Y2 (ja) * 1987-04-21 1994-07-06 テルモ株式会社 電子回路用基板接続体
US5063432A (en) * 1989-05-22 1991-11-05 Advanced Micro Devices, Inc. Integrated circuit lead assembly structure with first and second lead patterns spaced apart in parallel planes with a part of each lead in one lead pattern perpendicular to a part of each lead in the other lead pattern
US5133118A (en) * 1991-08-06 1992-07-28 Sheldahl, Inc. Surface mounted components on flex circuits
US20040132888A1 (en) * 2002-12-16 2004-07-08 Ube Industries, Ltd. Electronic device packaging and curable resin composition

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2486307A1 (fr) * 1980-07-02 1982-01-08 Fairchild Camera Instr Co Embase du genre boitier ou support pour microplaquette a semi-conducteurs
FR2498814A1 (fr) * 1981-01-26 1982-07-30 Burroughs Corp Boitier pour circuit integre, moyen pour le montage et procede de fabrication
US4641176A (en) * 1981-01-26 1987-02-03 Burroughs Corporation Semiconductor package with contact springs
FR2538961A1 (fr) * 1982-12-30 1984-07-06 Europ Composants Electron Embase pour circuit integre
EP0113292A1 (fr) * 1982-12-30 1984-07-11 Xeram Embase pour circuit intégré
EP0862217A3 (en) * 1992-05-26 1999-12-15 Motorola, Inc. Semiconductor device and semiconductor multi-chip module
FR2704114A1 (fr) * 1993-04-12 1994-10-21 Fujitsu Ltd Structure de boîtier pour dispositif électronique du type à montage en surface et procédé de montage d'une telle structure sur une plaquette à câblage imprimée.

Also Published As

Publication number Publication date
US3550766A (en) 1970-12-29
DE1958175B2 (de) 1972-10-05
NL6917610A (enExample) 1970-09-07
DE1958175A1 (de) 1970-09-10
GB1238569A (enExample) 1971-07-07
JPS4913112B1 (enExample) 1974-03-29

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Legal Events

Date Code Title Description
ST Notification of lapse