JPS49126694U - - Google Patents

Info

Publication number
JPS49126694U
JPS49126694U JP1973023536U JP2353673U JPS49126694U JP S49126694 U JPS49126694 U JP S49126694U JP 1973023536 U JP1973023536 U JP 1973023536U JP 2353673 U JP2353673 U JP 2353673U JP S49126694 U JPS49126694 U JP S49126694U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1973023536U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1973023536U priority Critical patent/JPS49126694U/ja
Publication of JPS49126694U publication Critical patent/JPS49126694U/ja
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
JP1973023536U 1973-02-26 1973-02-26 Pending JPS49126694U (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1973023536U JPS49126694U (zh) 1973-02-26 1973-02-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1973023536U JPS49126694U (zh) 1973-02-26 1973-02-26

Publications (1)

Publication Number Publication Date
JPS49126694U true JPS49126694U (zh) 1974-10-30

Family

ID=28118699

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1973023536U Pending JPS49126694U (zh) 1973-02-26 1973-02-26

Country Status (1)

Country Link
JP (1) JPS49126694U (zh)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010036196A (ja) * 2008-07-31 2010-02-18 Seishin Shoji Kk レーザスクライブ方法および装置
WO2011013449A1 (ja) * 2009-07-29 2011-02-03 西進商事株式会社 レーザースクライブ加工方法
TWI409121B (zh) * 2010-01-25 2013-09-21 Seishin Trading Co Ltd Method and device for mine clearance
JP2015024426A (ja) * 2013-07-26 2015-02-05 エンシュウ株式会社 レーザ熱処理装置

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010036196A (ja) * 2008-07-31 2010-02-18 Seishin Shoji Kk レーザスクライブ方法および装置
WO2011013449A1 (ja) * 2009-07-29 2011-02-03 西進商事株式会社 レーザースクライブ加工方法
JP2011025304A (ja) * 2009-07-29 2011-02-10 Seishin Shoji Kk レーザースクライブ加工方法
JP4651731B2 (ja) * 2009-07-29 2011-03-16 西進商事株式会社 レーザースクライブ加工方法
CN102470482A (zh) * 2009-07-29 2012-05-23 西进商事株式会社 激光切割加工方法
KR101167236B1 (ko) * 2009-07-29 2012-07-23 세이신 쇼지 가부시키가이샤 레이저 스크라이브 가공 방법
TWI391203B (zh) * 2009-07-29 2013-04-01 Seishin Trading Co Ltd Method of processing of laser marking
CN102470482B (zh) * 2009-07-29 2015-02-18 西进商事株式会社 激光切割加工方法
TWI409121B (zh) * 2010-01-25 2013-09-21 Seishin Trading Co Ltd Method and device for mine clearance
JP2015024426A (ja) * 2013-07-26 2015-02-05 エンシュウ株式会社 レーザ熱処理装置

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