JPS49124975A - - Google Patents
Info
- Publication number
- JPS49124975A JPS49124975A JP48036759A JP3675973A JPS49124975A JP S49124975 A JPS49124975 A JP S49124975A JP 48036759 A JP48036759 A JP 48036759A JP 3675973 A JP3675973 A JP 3675973A JP S49124975 A JPS49124975 A JP S49124975A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48036759A JPS49124975A (enExample) | 1973-04-02 | 1973-04-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48036759A JPS49124975A (enExample) | 1973-04-02 | 1973-04-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS49124975A true JPS49124975A (enExample) | 1974-11-29 |
Family
ID=12478665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48036759A Pending JPS49124975A (enExample) | 1973-04-02 | 1973-04-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS49124975A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5437574A (en) * | 1977-08-29 | 1979-03-20 | Nec Home Electronics Ltd | Fabrication method of semiconductor pellet |
| JPS5754336A (en) * | 1980-09-19 | 1982-03-31 | Fujitsu Ltd | Preparation of semiconductor device |
| JPS59105327A (ja) * | 1982-12-08 | 1984-06-18 | Toshiba Corp | 半導体素子の半田付け方法 |
| JPS62155523A (ja) * | 1985-12-27 | 1987-07-10 | Nec Corp | 半導体装置の製造方法 |
-
1973
- 1973-04-02 JP JP48036759A patent/JPS49124975A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5437574A (en) * | 1977-08-29 | 1979-03-20 | Nec Home Electronics Ltd | Fabrication method of semiconductor pellet |
| JPS5754336A (en) * | 1980-09-19 | 1982-03-31 | Fujitsu Ltd | Preparation of semiconductor device |
| JPS59105327A (ja) * | 1982-12-08 | 1984-06-18 | Toshiba Corp | 半導体素子の半田付け方法 |
| JPS62155523A (ja) * | 1985-12-27 | 1987-07-10 | Nec Corp | 半導体装置の製造方法 |