JPS49124975A - - Google Patents

Info

Publication number
JPS49124975A
JPS49124975A JP3675973A JP3675973A JPS49124975A JP S49124975 A JPS49124975 A JP S49124975A JP 3675973 A JP3675973 A JP 3675973A JP 3675973 A JP3675973 A JP 3675973A JP S49124975 A JPS49124975 A JP S49124975A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3675973A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3675973A priority Critical patent/JPS49124975A/ja
Publication of JPS49124975A publication Critical patent/JPS49124975A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
JP3675973A 1973-04-02 1973-04-02 Pending JPS49124975A (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3675973A JPS49124975A (enrdf_load_stackoverflow) 1973-04-02 1973-04-02

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3675973A JPS49124975A (enrdf_load_stackoverflow) 1973-04-02 1973-04-02

Publications (1)

Publication Number Publication Date
JPS49124975A true JPS49124975A (enrdf_load_stackoverflow) 1974-11-29

Family

ID=12478665

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3675973A Pending JPS49124975A (enrdf_load_stackoverflow) 1973-04-02 1973-04-02

Country Status (1)

Country Link
JP (1) JPS49124975A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5437574A (en) * 1977-08-29 1979-03-20 Nec Home Electronics Ltd Fabrication method of semiconductor pellet
JPS5754336A (ja) * 1980-09-19 1982-03-31 Fujitsu Ltd Handotaisochinoseizohoho
JPS59105327A (ja) * 1982-12-08 1984-06-18 Toshiba Corp 半導体素子の半田付け方法
JPS62155523A (ja) * 1985-12-27 1987-07-10 Nec Corp 半導体装置の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5437574A (en) * 1977-08-29 1979-03-20 Nec Home Electronics Ltd Fabrication method of semiconductor pellet
JPS5754336A (ja) * 1980-09-19 1982-03-31 Fujitsu Ltd Handotaisochinoseizohoho
JPS59105327A (ja) * 1982-12-08 1984-06-18 Toshiba Corp 半導体素子の半田付け方法
JPS62155523A (ja) * 1985-12-27 1987-07-10 Nec Corp 半導体装置の製造方法

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