JPS49119832A - - Google Patents

Info

Publication number
JPS49119832A
JPS49119832A JP48026269A JP2626973A JPS49119832A JP S49119832 A JPS49119832 A JP S49119832A JP 48026269 A JP48026269 A JP 48026269A JP 2626973 A JP2626973 A JP 2626973A JP S49119832 A JPS49119832 A JP S49119832A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP48026269A
Other languages
Japanese (ja)
Other versions
JPS5531181B2 (fr
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to BE793769D priority Critical patent/BE793769A/fr
Priority to US00218485A priority patent/US3736157A/en
Priority to FR7300464A priority patent/FR2168317B1/fr
Priority to DE2301639A priority patent/DE2301639A1/de
Priority to CA161,510A priority patent/CA989103A/en
Priority to ZA730351A priority patent/ZA73351B/xx
Priority to AU51161/73A priority patent/AU478644B2/en
Application filed filed Critical
Priority to JP2626973A priority patent/JPS5531181B2/ja
Publication of JPS49119832A publication Critical patent/JPS49119832A/ja
Publication of JPS5531181B2 publication Critical patent/JPS5531181B2/ja
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/48—Coating with alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP2626973A 1972-01-17 1973-03-07 Expired JPS5531181B2 (fr)

Priority Applications (8)

Application Number Priority Date Filing Date Title
BE793769D BE793769A (fr) 1972-01-17 Solution et procede pour former un depot de cuivre et d'etain sans utilisation de courant electrique
US00218485A US3736157A (en) 1972-01-17 1972-01-17 Electroless copper tin plating solution and process
FR7300464A FR2168317B1 (fr) 1972-01-17 1973-01-08
DE2301639A DE2301639A1 (de) 1972-01-17 1973-01-13 Loesung fuer die stromlose abscheidung von kupfer-zinn-schichten auf metalloberflaechen
CA161,510A CA989103A (en) 1972-01-17 1973-01-17 Electroless copper tin plating solution and process
ZA730351A ZA73351B (en) 1972-01-17 1973-01-17 Electroless copper tin plating solution and process
AU51161/73A AU478644B2 (en) 1972-01-17 1973-01-17 Electroless copper tin plating solution and process
JP2626973A JPS5531181B2 (fr) 1972-01-17 1973-03-07

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US21848572A 1972-01-17 1972-01-17
JP2626973A JPS5531181B2 (fr) 1972-01-17 1973-03-07

Publications (2)

Publication Number Publication Date
JPS49119832A true JPS49119832A (fr) 1974-11-15
JPS5531181B2 JPS5531181B2 (fr) 1980-08-16

Family

ID=26364024

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2626973A Expired JPS5531181B2 (fr) 1972-01-17 1973-03-07

Country Status (7)

Country Link
US (1) US3736157A (fr)
JP (1) JPS5531181B2 (fr)
BE (1) BE793769A (fr)
CA (1) CA989103A (fr)
DE (1) DE2301639A1 (fr)
FR (1) FR2168317B1 (fr)
ZA (1) ZA73351B (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3993491A (en) * 1973-12-07 1976-11-23 Surface Technology, Inc. Electroless plating
JPS59108953U (ja) * 1982-12-27 1984-07-23 富士通株式会社 読取台
JPS60140158U (ja) * 1984-02-28 1985-09-17 富士通株式会社 読取り台
JPS6244356U (fr) * 1985-08-30 1987-03-17
US5196053A (en) * 1991-11-27 1993-03-23 Mcgean-Rohco, Inc. Complexing agent for displacement tin plating

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1248419B (de) * 1964-08-17 1967-08-24 Collardin Gmbh Gerhard Tauchbad fuer die stromlose Abscheidung von Kupfer-Zinn-Schichten
DE1287394B (de) * 1965-09-09 1969-01-16 Collardin Gmbh Gerhard Verfahren zur stromlosen Abscheidung von Kupfer-Zinn-Schichten
DE1621291B2 (de) * 1967-08-05 1971-02-11 Metallgesellschaft Ag Verfahren zur stromlosen Herstellung eines Kupferueberzuges auf Eisen und Eisenlegierungen

Also Published As

Publication number Publication date
FR2168317A1 (fr) 1973-08-31
ZA73351B (en) 1973-11-28
CA989103A (en) 1976-05-18
DE2301639A1 (de) 1973-07-26
AU5116173A (en) 1974-07-18
US3736157A (en) 1973-05-29
FR2168317B1 (fr) 1976-04-09
JPS5531181B2 (fr) 1980-08-16
BE793769A (fr) 1973-05-02

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