JPS49116961A - - Google Patents
Info
- Publication number
- JPS49116961A JPS49116961A JP48027070A JP2707073A JPS49116961A JP S49116961 A JPS49116961 A JP S49116961A JP 48027070 A JP48027070 A JP 48027070A JP 2707073 A JP2707073 A JP 2707073A JP S49116961 A JPS49116961 A JP S49116961A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
- H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
- H10W72/07553—Controlling the environment, e.g. atmosphere composition or temperature changes in shapes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/59—Bond pads specially adapted therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/922—Bond pads being integral with underlying chip-level interconnections
- H10W72/9226—Bond pads being integral with underlying chip-level interconnections with via interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/921—Structures or relative sizes of bond pads
- H10W72/923—Bond pads having multiple stacked layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/931—Shapes of bond pads
- H10W72/934—Cross-sectional shape, i.e. in side view
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Wire Bonding (AREA)
- Bipolar Transistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48027070A JPS5748854B2 (https=) | 1973-03-09 | 1973-03-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP48027070A JPS5748854B2 (https=) | 1973-03-09 | 1973-03-09 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56024306A Division JPS594853B2 (ja) | 1981-02-23 | 1981-02-23 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS49116961A true JPS49116961A (https=) | 1974-11-08 |
| JPS5748854B2 JPS5748854B2 (https=) | 1982-10-19 |
Family
ID=12210794
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP48027070A Expired JPS5748854B2 (https=) | 1973-03-09 | 1973-03-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5748854B2 (https=) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51114833A (en) * | 1975-04-02 | 1976-10-08 | Hitachi Ltd | Bubble memory device |
| JPS528785A (en) * | 1975-07-10 | 1977-01-22 | Citizen Watch Co Ltd | Semiconductor device electrode structure |
| JPS5226187A (en) * | 1975-08-22 | 1977-02-26 | Hitachi Ltd | Semiconductor unit |
| JPS5227389A (en) * | 1975-08-27 | 1977-03-01 | Hitachi Ltd | Semiconductor device containing multi-layer wiring |
| JPS56124247A (en) * | 1981-02-23 | 1981-09-29 | Hitachi Ltd | Semiconductor device |
| JPS56172028U (https=) * | 1980-05-22 | 1981-12-18 | ||
| JPS60182772A (ja) * | 1984-02-29 | 1985-09-18 | Rohm Co Ltd | 半導体装置 |
| JPS61102053U (https=) * | 1984-12-11 | 1986-06-28 | ||
| JPS61232637A (ja) * | 1985-04-09 | 1986-10-16 | Nec Corp | 半導体装置 |
| JPS6316471U (https=) * | 1986-07-18 | 1988-02-03 |
-
1973
- 1973-03-09 JP JP48027070A patent/JPS5748854B2/ja not_active Expired
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51114833A (en) * | 1975-04-02 | 1976-10-08 | Hitachi Ltd | Bubble memory device |
| JPS528785A (en) * | 1975-07-10 | 1977-01-22 | Citizen Watch Co Ltd | Semiconductor device electrode structure |
| JPS5226187A (en) * | 1975-08-22 | 1977-02-26 | Hitachi Ltd | Semiconductor unit |
| JPS5227389A (en) * | 1975-08-27 | 1977-03-01 | Hitachi Ltd | Semiconductor device containing multi-layer wiring |
| JPS56172028U (https=) * | 1980-05-22 | 1981-12-18 | ||
| JPS56124247A (en) * | 1981-02-23 | 1981-09-29 | Hitachi Ltd | Semiconductor device |
| JPS60182772A (ja) * | 1984-02-29 | 1985-09-18 | Rohm Co Ltd | 半導体装置 |
| JPS61102053U (https=) * | 1984-12-11 | 1986-06-28 | ||
| JPS61232637A (ja) * | 1985-04-09 | 1986-10-16 | Nec Corp | 半導体装置 |
| JPS6316471U (https=) * | 1986-07-18 | 1988-02-03 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5748854B2 (https=) | 1982-10-19 |