JPS49114362A - - Google Patents
Info
- Publication number
- JPS49114362A JPS49114362A JP2321273A JP2321273A JPS49114362A JP S49114362 A JPS49114362 A JP S49114362A JP 2321273 A JP2321273 A JP 2321273A JP 2321273 A JP2321273 A JP 2321273A JP S49114362 A JPS49114362 A JP S49114362A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2321273A JPS49114362A (en) | 1973-02-28 | 1973-02-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2321273A JPS49114362A (en) | 1973-02-28 | 1973-02-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS49114362A true JPS49114362A (en) | 1974-10-31 |
Family
ID=12104342
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2321273A Pending JPS49114362A (en) | 1973-02-28 | 1973-02-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS49114362A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5931252U (en) * | 1982-08-23 | 1984-02-27 | 三洋電機株式会社 | Amorphous optical semiconductor device |
| JPS6098649A (en) * | 1983-11-02 | 1985-06-01 | Hitachi Ltd | Semiconductor device |
| JPS63177475A (en) * | 1987-08-15 | 1988-07-21 | Shunpei Yamazaki | Manufacture of photoelectric semiconductor device |
| WO2003098702A1 (en) * | 2002-05-15 | 2003-11-27 | Matsushita Electric Industrial Co., Ltd. | Optical detector, optical head device, optical information processing device, and optical information processing method |
-
1973
- 1973-02-28 JP JP2321273A patent/JPS49114362A/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5931252U (en) * | 1982-08-23 | 1984-02-27 | 三洋電機株式会社 | Amorphous optical semiconductor device |
| JPS6098649A (en) * | 1983-11-02 | 1985-06-01 | Hitachi Ltd | Semiconductor device |
| JPS63177475A (en) * | 1987-08-15 | 1988-07-21 | Shunpei Yamazaki | Manufacture of photoelectric semiconductor device |
| WO2003098702A1 (en) * | 2002-05-15 | 2003-11-27 | Matsushita Electric Industrial Co., Ltd. | Optical detector, optical head device, optical information processing device, and optical information processing method |
| US7154838B2 (en) | 2002-05-15 | 2006-12-26 | Matsushita Electric Industrial Co., Ltd. | Optical detector, optical head device, optical information processing device, and optical information processing method |