JPS49110292A - - Google Patents

Info

Publication number
JPS49110292A
JPS49110292A JP2014873A JP2014873A JPS49110292A JP S49110292 A JPS49110292 A JP S49110292A JP 2014873 A JP2014873 A JP 2014873A JP 2014873 A JP2014873 A JP 2014873A JP S49110292 A JPS49110292 A JP S49110292A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014873A
Other languages
Japanese (ja)
Other versions
JPS5634865B2 (pt
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2014873A priority Critical patent/JPS5634865B2/ja
Publication of JPS49110292A publication Critical patent/JPS49110292A/ja
Publication of JPS5634865B2 publication Critical patent/JPS5634865B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Led Device Packages (AREA)
  • Led Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2014873A 1973-02-21 1973-02-21 Expired JPS5634865B2 (pt)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014873A JPS5634865B2 (pt) 1973-02-21 1973-02-21

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014873A JPS5634865B2 (pt) 1973-02-21 1973-02-21

Publications (2)

Publication Number Publication Date
JPS49110292A true JPS49110292A (pt) 1974-10-21
JPS5634865B2 JPS5634865B2 (pt) 1981-08-13

Family

ID=12019054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014873A Expired JPS5634865B2 (pt) 1973-02-21 1973-02-21

Country Status (1)

Country Link
JP (1) JPS5634865B2 (pt)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6370589U (pt) * 1986-10-27 1988-05-12
JP2005191446A (ja) * 2003-12-26 2005-07-14 Sanyo Electric Co Ltd 発光素子用パッケージ及びこれを具えた発光デバイス
JP2005191445A (ja) * 2003-12-26 2005-07-14 Sanyo Electric Co Ltd 発光素子用パッケージ及びその製造方法
WO2010067701A1 (ja) * 2008-12-12 2010-06-17 三洋電機株式会社 発光装置、発光装置モジュールおよび発光装置の製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114450259A (zh) 2019-09-26 2022-05-06 富士色素株式会社 复合氧化物粉末、复合氧化物粉末的制造方法、固体电解质体的制造方法以及锂离子二次电池的制造方法
JP7478414B2 (ja) 2020-03-02 2024-05-07 国立研究開発法人産業技術総合研究所 非晶質複合金属酸化物、ガーネット型リチウム複合金属酸化物、焼結体、固体電解質層、電気化学デバイス用電極、電気化学デバイス

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826867U (pt) * 1971-08-04 1973-03-31
JPS4827767U (pt) * 1971-08-05 1973-04-04

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826867U (pt) * 1971-08-04 1973-03-31
JPS4827767U (pt) * 1971-08-05 1973-04-04

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6370589U (pt) * 1986-10-27 1988-05-12
JP2005191446A (ja) * 2003-12-26 2005-07-14 Sanyo Electric Co Ltd 発光素子用パッケージ及びこれを具えた発光デバイス
JP2005191445A (ja) * 2003-12-26 2005-07-14 Sanyo Electric Co Ltd 発光素子用パッケージ及びその製造方法
WO2010067701A1 (ja) * 2008-12-12 2010-06-17 三洋電機株式会社 発光装置、発光装置モジュールおよび発光装置の製造方法
JPWO2010067701A1 (ja) * 2008-12-12 2012-05-17 三洋電機株式会社 発光装置、発光装置モジュールおよび発光装置の製造方法

Also Published As

Publication number Publication date
JPS5634865B2 (pt) 1981-08-13

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