JPS4832475A - - Google Patents
Info
- Publication number
- JPS4832475A JPS4832475A JP8007872A JP8007872A JPS4832475A JP S4832475 A JPS4832475 A JP S4832475A JP 8007872 A JP8007872 A JP 8007872A JP 8007872 A JP8007872 A JP 8007872A JP S4832475 A JPS4832475 A JP S4832475A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US17553071A | 1971-08-27 | 1971-08-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4832475A true JPS4832475A (en:Method) | 1973-04-28 |
| JPS5120699B2 JPS5120699B2 (en:Method) | 1976-06-26 |
Family
ID=22640592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8007872A Expired JPS5120699B2 (en:Method) | 1971-08-27 | 1972-08-11 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS5120699B2 (en:Method) |
| CA (1) | CA978278A (en:Method) |
| IT (1) | IT964139B (en:Method) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5049663A (en:Method) * | 1973-09-05 | 1975-05-02 | ||
| JPS5341765A (en) * | 1976-09-28 | 1978-04-15 | Nippon Electric Co | Method of producing high density multilayer circuit board |
| JPS548976A (en) * | 1977-06-22 | 1979-01-23 | Nec Corp | Lsi package |
| JPS54135360A (en) * | 1978-04-13 | 1979-10-20 | Oki Electric Ind Co Ltd | Multiilayer ceramic board |
| JPS5598897A (en) * | 1979-01-23 | 1980-07-28 | Nippon Electric Co | Multilayer circuit board |
| JPS5759472U (en:Method) * | 1980-09-26 | 1982-04-08 | ||
| JPS5842263A (ja) * | 1981-09-04 | 1983-03-11 | Nec Corp | マルチチツプパツケ−ジ |
| JPS58199594A (ja) * | 1982-05-17 | 1983-11-19 | 日本電気株式会社 | 多層配線基板 |
| JPS61166144A (ja) * | 1985-01-18 | 1986-07-26 | Hitachi Chiyou Lsi Eng Kk | ペレット取付基板の製造方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1656612A (zh) * | 2002-05-23 | 2005-08-17 | 肖特股份公司 | 用于高频的玻璃材料 |
-
1972
- 1972-08-11 JP JP8007872A patent/JPS5120699B2/ja not_active Expired
- 1972-08-22 IT IT2836272A patent/IT964139B/it active
- 1972-08-24 CA CA 150295 patent/CA978278A/en not_active Expired
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5049663A (en:Method) * | 1973-09-05 | 1975-05-02 | ||
| JPS5341765A (en) * | 1976-09-28 | 1978-04-15 | Nippon Electric Co | Method of producing high density multilayer circuit board |
| JPS548976A (en) * | 1977-06-22 | 1979-01-23 | Nec Corp | Lsi package |
| JPS54135360A (en) * | 1978-04-13 | 1979-10-20 | Oki Electric Ind Co Ltd | Multiilayer ceramic board |
| JPS5598897A (en) * | 1979-01-23 | 1980-07-28 | Nippon Electric Co | Multilayer circuit board |
| JPS5759472U (en:Method) * | 1980-09-26 | 1982-04-08 | ||
| JPS5842263A (ja) * | 1981-09-04 | 1983-03-11 | Nec Corp | マルチチツプパツケ−ジ |
| JPS58199594A (ja) * | 1982-05-17 | 1983-11-19 | 日本電気株式会社 | 多層配線基板 |
| JPS61166144A (ja) * | 1985-01-18 | 1986-07-26 | Hitachi Chiyou Lsi Eng Kk | ペレット取付基板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| IT964139B (it) | 1974-01-21 |
| CA978278A (en) | 1975-11-18 |
| JPS5120699B2 (en:Method) | 1976-06-26 |