JPS4831456B1 - - Google Patents

Info

Publication number
JPS4831456B1
JPS4831456B1 JP45018399A JP1839970A JPS4831456B1 JP S4831456 B1 JPS4831456 B1 JP S4831456B1 JP 45018399 A JP45018399 A JP 45018399A JP 1839970 A JP1839970 A JP 1839970A JP S4831456 B1 JPS4831456 B1 JP S4831456B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP45018399A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP45018399A priority Critical patent/JPS4831456B1/ja
Priority to US109385A priority patent/US3658663A/en
Publication of JPS4831456B1 publication Critical patent/JPS4831456B1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP45018399A 1970-03-03 1970-03-03 Pending JPS4831456B1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP45018399A JPS4831456B1 (fr) 1970-03-03 1970-03-03
US109385A US3658663A (en) 1970-03-03 1971-01-25 Method for effecting partial metal plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP45018399A JPS4831456B1 (fr) 1970-03-03 1970-03-03

Publications (1)

Publication Number Publication Date
JPS4831456B1 true JPS4831456B1 (fr) 1973-09-29

Family

ID=11970600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP45018399A Pending JPS4831456B1 (fr) 1970-03-03 1970-03-03

Country Status (2)

Country Link
US (1) US3658663A (fr)
JP (1) JPS4831456B1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5332271U (fr) * 1976-08-27 1978-03-20

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4042480A (en) * 1973-10-04 1977-08-16 Noz Francis X Apparatus for selectively applying a metal coating to the metallic parts of elements which pass through an insulator
NL7316245A (nl) * 1973-10-04 1975-04-08 Galentan Ag Werkwijze voor het selectief aanbrengen van een llaag op de door een isolerend lichaam ge- e metaaldelen van electrische bouwelementen.
US3897323A (en) * 1974-08-05 1975-07-29 Motorola Inc Apparatus for selective plating
NL7810808A (nl) * 1978-10-31 1980-05-02 Philips Nv Inrichting en werkwijze voor het vervaardigen van kathodes.
EP0107931B1 (fr) * 1982-10-05 1989-01-18 S.G. Owen (Northampton) Limited Plaquage sélectif
US4454009A (en) * 1983-05-17 1984-06-12 S.G. Owen Limited Method of, and a machine for, electroplating
US4500394A (en) * 1984-05-16 1985-02-19 At&T Technologies, Inc. Contacting a surface for plating thereon
US5516416A (en) * 1994-12-14 1996-05-14 International Business Machines Corporation Apparatus and method for electroplating pin grid array packaging modules
US7244677B2 (en) 1998-02-04 2007-07-17 Semitool. Inc. Method for filling recessed micro-structures with metallization in the production of a microelectronic device
US7160427B2 (en) * 2004-07-19 2007-01-09 Pratt & Whitney Canada Corp. In situ plating of electrical connector contacts
US7354336B1 (en) 2006-10-12 2008-04-08 Pratt & Whitney Canada Corp. Abrading tool and method for refurbishing electrical connector pin contacts
US7448121B1 (en) * 2007-04-17 2008-11-11 Jin Xiang Kai Industry Co., Ltd. Metal hand tool and method for manufacturing the same
JP5465168B2 (ja) 2010-12-27 2014-04-09 日本発條株式会社 粘性液体供給ノズルへの潤滑性メッキ層の形成方法及び粘性液体供給ノズル

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US148409A (en) * 1874-03-10 Improvement in devices for plating screws
US258214A (en) * 1882-05-23 X x x x x x
US1970459A (en) * 1932-05-26 1934-08-14 John N Kelly Plating rack
GB423442A (en) * 1933-08-01 1935-02-01 Henderik Van Der Horst Improvements relating to the electro-deposition of metal on the extremities of pen-nibs
US2115403A (en) * 1936-03-19 1938-04-26 American Enka Corp Repairing spinnerets
US3007855A (en) * 1958-12-29 1961-11-07 Bell Telephone Labor Inc Rhodium plating
US3043767A (en) * 1959-05-12 1962-07-10 Alton E Tobey Electroplating apparatus
NL294698A (fr) * 1962-06-29
US3223599A (en) * 1963-04-15 1965-12-14 Beckman Instruments Inc Holding plate for electroplating a detonator plug

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5332271U (fr) * 1976-08-27 1978-03-20

Also Published As

Publication number Publication date
US3658663A (en) 1972-04-25

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