|
US3512582A
(en)
*
|
1968-07-15 |
1970-05-19 |
Ibm |
Immersion cooling system for modularly packaged components
|
|
US3626080A
(en)
*
|
1969-12-10 |
1971-12-07 |
Allis Chalmers Mfg Co |
Means for circulating liquid coolants
|
|
US3738421A
(en)
*
|
1971-06-11 |
1973-06-12 |
R Moore |
Heatronic capacitor
|
|
GB1359540A
(en)
*
|
1971-10-29 |
1974-07-10 |
British Titan Ltd |
Heating a gas
|
|
US3933198A
(en)
*
|
1973-03-16 |
1976-01-20 |
Hitachi, Ltd. |
Heat transfer device
|
|
DE2526499C2
(de)
*
|
1975-06-13 |
1983-03-10 |
Linde Ag, 6200 Wiesbaden |
Verfahren zur !bertragung von Wärme von Umgebungsluft auf ein Arbeitsmittel
|
|
US4366807A
(en)
*
|
1979-02-07 |
1983-01-04 |
Sunworks, Inc. |
Natural circulation solar heat collection and storage system
|
|
EP0151155A1
(en)
*
|
1983-07-22 |
1985-08-14 |
The Commonwealth Of Australia |
Gas bubble removal from cavity cooling liquid
|
|
US5004973A
(en)
*
|
1989-07-13 |
1991-04-02 |
Thermal Management, Inc. |
Method and apparatus for maintaining electrically operating device temperatures
|
|
US5099908A
(en)
*
|
1989-07-13 |
1992-03-31 |
Thermal Management, Inc. |
Method and apparatus for maintaining electrically operating device temperatures
|
|
US5297621A
(en)
*
|
1989-07-13 |
1994-03-29 |
American Electronic Analysis |
Method and apparatus for maintaining electrically operating device temperatures
|
|
US5131233A
(en)
*
|
1991-03-08 |
1992-07-21 |
Cray Computer Corporation |
Gas-liquid forced turbulence cooling
|
|
US5740018A
(en)
*
|
1996-02-29 |
1998-04-14 |
The United States Of America As Represented By The Secretary Of The Navy |
Environmentally controlled circuit pack and cabinet
|
|
US5947111A
(en)
*
|
1998-04-30 |
1999-09-07 |
Hudson Products Corporation |
Apparatus for the controlled heating of process fluids
|
|
DE10257309A1
(de)
*
|
2002-11-30 |
2004-06-09 |
Gast, Karl Heinz, Dipl.-Ing. (FH) |
Verfahren und Einrichtungen zum Frostschutz in Heizungsanlagen
|
|
US6976528B1
(en)
|
2003-02-18 |
2005-12-20 |
Isothermal Systems Research, Inc. |
Spray cooling system for extreme environments
|
|
US7150109B2
(en)
*
|
2003-08-25 |
2006-12-19 |
Isothermal Systems Research, Inc. |
Dry-wet thermal management system
|
|
US7043933B1
(en)
|
2003-08-26 |
2006-05-16 |
Isothermal Systems Research, Inc. |
Spray coolant reservoir system
|
|
US7180741B1
(en)
|
2003-08-26 |
2007-02-20 |
Isothermal Systems Research, Inc. |
Spray cool system with a dry access chamber
|
|
GB2432460B8
(en)
|
2005-11-17 |
2010-08-18 |
Iceotope Ltd |
Computer apparatus
|
|
WO2007075599A2
(en)
*
|
2005-12-19 |
2007-07-05 |
Honeywell International, Inc. |
Multi-fluid coolant system
|
|
US7403392B2
(en)
*
|
2006-05-16 |
2008-07-22 |
Hardcore Computer, Inc. |
Liquid submersion cooling system
|
|
US20080017355A1
(en)
*
|
2006-05-16 |
2008-01-24 |
Hardcore Computer, Inc. |
Case for a liquid submersion cooled electronic device
|
|
US7841385B2
(en)
|
2006-06-26 |
2010-11-30 |
International Business Machines Corporation |
Dual-chamber fluid pump for a multi-fluid electronics cooling system and method
|
|
US7787248B2
(en)
*
|
2006-06-26 |
2010-08-31 |
International Business Machines Corporation |
Multi-fluid cooling system, cooled electronics module, and methods of fabrication thereof
|
|
US8011421B2
(en)
*
|
2006-12-12 |
2011-09-06 |
Honeywell International Inc. |
System and method that dissipate heat from an electronic device
|
|
JP4657226B2
(ja)
*
|
2007-02-01 |
2011-03-23 |
トヨタ自動車株式会社 |
蓄熱装置
|
|
US20080283221A1
(en)
*
|
2007-05-15 |
2008-11-20 |
Christian Blicher Terp |
Direct Air Contact Liquid Cooling System Heat Exchanger Assembly
|
|
DK2321849T3
(da)
*
|
2008-08-11 |
2022-01-31 |
Green Revolution Cooling Inc |
Horisontalt computerserverstativ nedsænket i væske og systemer og fremgangsmåder til afkøling af et sådant serverstativ
|
|
US8636052B2
(en)
*
|
2009-09-08 |
2014-01-28 |
International Business Machines Corporation |
Dual-fluid heat exchanger
|
|
US9832913B2
(en)
|
2011-06-27 |
2017-11-28 |
Ebullient, Inc. |
Method of operating a cooling apparatus to provide stable two-phase flow
|
|
US9854714B2
(en)
|
2011-06-27 |
2017-12-26 |
Ebullient, Inc. |
Method of absorbing sensible and latent heat with series-connected heat sinks
|
|
US9854715B2
(en)
|
2011-06-27 |
2017-12-26 |
Ebullient, Inc. |
Flexible two-phase cooling system
|
|
US9901013B2
(en)
|
2011-06-27 |
2018-02-20 |
Ebullient, Inc. |
Method of cooling series-connected heat sink modules
|
|
US9848509B2
(en)
|
2011-06-27 |
2017-12-19 |
Ebullient, Inc. |
Heat sink module
|
|
US9901008B2
(en)
|
2014-10-27 |
2018-02-20 |
Ebullient, Inc. |
Redundant heat sink module
|
|
RU2645721C2
(ru)
*
|
2012-12-14 |
2018-02-28 |
МИДАС ГРИН ТЕКНОЛОДЖИ, ЭлЭлСи |
Система охлаждения путем погружения электрических приборов в жидкость
|
|
US9144179B2
(en)
*
|
2013-02-01 |
2015-09-22 |
Dell Products, L.P. |
System and method for powering multiple electronic devices operating within an immersion cooling vessel
|
|
US9313920B2
(en)
*
|
2013-10-21 |
2016-04-12 |
International Business Machines Corporation |
Direct coolant contact vapor condensing
|
|
US20150243428A1
(en)
*
|
2014-02-21 |
2015-08-27 |
Varentec, Inc. |
Methods and systems of field upgradeable transformers
|
|
US9699939B2
(en)
|
2014-06-24 |
2017-07-04 |
David Lane Smith |
System and method for fluid cooling of electronic devices installed in a sealed enclosure
|
|
US11191186B2
(en)
|
2014-06-24 |
2021-11-30 |
David Lane Smith |
System and method for fluid cooling of electronic devices installed in an enclosure
|
|
US9408332B2
(en)
|
2014-06-24 |
2016-08-02 |
David Lane Smith |
System and method for fluid cooling of electronic devices installed in a sealed enclosure
|
|
US9258926B2
(en)
*
|
2014-06-24 |
2016-02-09 |
David Lane Smith |
System and method for fluid cooling of electronic devices installed in a sealed enclosure
|
|
US9560789B2
(en)
|
2014-06-24 |
2017-01-31 |
David Lane Smith |
System and method for fluid cooling of electronic devices installed in a sealed enclosure
|
|
US11744041B2
(en)
|
2014-06-24 |
2023-08-29 |
David Lane Smith |
System and method for fluid cooling of electronic devices installed in an enclosure
|
|
AU2015339755A1
(en)
*
|
2014-10-27 |
2017-06-15 |
Ebullient, Llc |
Method of providing stable pump operation in a two-phase cooling system
|
|
US20160120059A1
(en)
|
2014-10-27 |
2016-04-28 |
Ebullient, Llc |
Two-phase cooling system
|
|
US9852963B2
(en)
|
2014-10-27 |
2017-12-26 |
Ebullient, Inc. |
Microprocessor assembly adapted for fluid cooling
|
|
US20160116218A1
(en)
|
2014-10-27 |
2016-04-28 |
Ebullient, Llc |
Heat exchanger with helical passageways
|
|
US10184699B2
(en)
|
2014-10-27 |
2019-01-22 |
Ebullient, Inc. |
Fluid distribution unit for two-phase cooling system
|
|
WO2016157397A1
(ja)
*
|
2015-03-30 |
2016-10-06 |
株式会社ＥｘａＳｃａｌｅｒ |
電子機器の冷却システム
|
|
WO2016157396A1
(ja)
*
|
2015-03-30 |
2016-10-06 |
株式会社ＥｘａＳｃａｌｅｒ |
電子機器の冷却システム
|
|
US20180363993A1
(en)
*
|
2015-11-11 |
2018-12-20 |
Motoaki saito |
Cooling system for electronic device
|
|
US10674641B2
(en)
*
|
2016-04-04 |
2020-06-02 |
Hamilton Sundstrand Corporation |
Immersion cooling systems and methods
|
|
GB2549946A
(en)
|
2016-05-03 |
2017-11-08 |
Bitfury Group Ltd |
Immersion cooling
|
|
CN111918527B
(zh)
*
|
2017-07-17 |
2024-05-17 |
华为技术有限公司 |
液冷装置和包括液冷装置的服务器
|
|
KR102639521B1
(ko)
|
2017-09-06 |
2024-02-22 |
아이서톱 그룹 리미티드 |
액침 냉각용 방열판, 방열판 배열체 및 모듈
|
|
JP6866816B2
(ja)
*
|
2017-09-26 |
2021-04-28 |
富士通株式会社 |
液浸サーバ
|
|
CN107912000A
(zh)
*
|
2017-11-29 |
2018-04-13 |
北京百度网讯科技有限公司 |
冷却系统
|
|
CN107995829A
(zh)
*
|
2017-11-29 |
2018-05-04 |
北京百度网讯科技有限公司 |
冷却系统
|
|
US10356950B2
(en)
*
|
2017-12-18 |
2019-07-16 |
Ge Aviation Systems, Llc |
Avionics heat exchanger
|
|
CN107894823A
(zh)
*
|
2017-12-21 |
2018-04-10 |
曙光节能技术（北京）股份有限公司 |
浸没式液冷散热装置及方法
|
|
US11317536B2
(en)
*
|
2017-12-26 |
2022-04-26 |
Sugon Dataenergy(Beijing) Co., Ltd |
High-efficiency phase-change condenser of a supercomputer
|
|
JP7180130B2
(ja)
*
|
2018-06-07 |
2022-11-30 |
富士通株式会社 |
液浸槽
|
|
US11359865B2
(en)
|
2018-07-23 |
2022-06-14 |
Green Revolution Cooling, Inc. |
Dual Cooling Tower Time Share Water Treatment System
|
|
US11032941B2
(en)
*
|
2019-03-28 |
2021-06-08 |
Intel Corporation |
Modular thermal energy management designs for data center computing
|
|
US11116113B2
(en)
*
|
2019-04-08 |
2021-09-07 |
Google Llc |
Cooling electronic devices in a data center
|
|
US10916818B2
(en)
*
|
2019-06-21 |
2021-02-09 |
Baidu Usa Llc |
Self-activating thermal management system for battery pack
|
|
US10761577B1
(en)
|
2019-08-29 |
2020-09-01 |
Google Llc |
Liquid soluble gas sealed cooling system
|
|
US10925188B1
(en)
*
|
2019-11-11 |
2021-02-16 |
Microsoft Technology Licensing, Llc |
Self-contained immersion cooling server assemblies
|
|
CN212341825U
(zh)
*
|
2020-06-29 |
2021-01-12 |
建准电机工业股份有限公司 |
浸没式冷却系统及具有该浸没式冷却系统的电子装置
|
|
USD982145S1
(en)
|
2020-10-19 |
2023-03-28 |
Green Revolution Cooling, Inc. |
Cooling system enclosure
|
|
USD998770S1
(en)
|
2020-10-19 |
2023-09-12 |
Green Revolution Cooling, Inc. |
Cooling system enclosure
|
|
US11805624B2
(en)
|
2021-09-17 |
2023-10-31 |
Green Revolution Cooling, Inc. |
Coolant shroud
|
|
US11608217B1
(en)
|
2022-01-01 |
2023-03-21 |
Liquidstack Holding B.V. |
Automated closure for hermetically sealing an immersion cooling tank during a hot swap of equipment therein
|
|
US11925946B2
(en)
|
2022-03-28 |
2024-03-12 |
Green Revolution Cooling, Inc. |
Fluid delivery wand
|
|
US12089368B2
(en)
|
2022-09-14 |
2024-09-10 |
Green Revolution Cooling, Inc. |
System and method for cooling computing devices using a primary circuit dielectric cooling fluid
|
