JPH1197931A - Oscillator - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase the degree of freedom of the wiring pattern design of an outside circuit board with which an oscillator is integrated, and to make the device thin by providing a terminal member having an electrode pattern for transmitting data from the outside part to an oscillating circuit part on the front upper face. SOLUTION: The front upper face of a terminal member 1 is used as a part mounting face with which an oscillating circuit part or a part such as an oscillator can be connected. First electrode patterns 41 are provided on the four corners of the front upper face of the terminal member 1, and second electrode patterns 43 are provided on the back face. A cap 3 is provided with chamfering parts 61 and notched parts 51 on the four corner parts. The chamfering parts 61 expose the first electrode patterns 41 on the front upper face of the terminal member 1. Probe pins 71 are brought into contact from the upper face with the first electrode patterns 41 exposed from the cap 3, and oscillation frequency correction data are written in the memory of the oscillating circuit part.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an oscillator, and more particularly to an oscillator having an oscillation frequency compensation circuit.

[0002]

2. Description of the Related Art FIG.
This will be described with reference to FIG. As shown in FIG. 8, an oscillation circuit component 21 including an oscillation circuit, a memory, an oscillation frequency compensation circuit, and a temperature detection circuit, and a vibrator 5 are mounted on the terminal member 1, and then the cap 3 is attached to the terminal member 1. This is a temperature-compensated oscillator that adjusts the oscillation frequency by writing data to the memory from the first electrode pattern 41 provided on the side surface of the terminal member 1.

As shown in FIG. 8, a terminal member 1 has a first electrode pattern 41 on a side surface of the terminal member 1 and has a metal lead 81. Although not shown in FIG. 8, a wiring pattern is formed on the component mounting surface of the terminal member 1 and inside the terminal member 1.
1, vibrator 5, first electrode pattern 41, metal lead 8
1 is arbitrarily connected electrically. The first electrode pattern 41 on the side surface of the terminal member 1 has a function of providing correction data from the outside to the memory of the oscillation circuit component 21, and is a terminal used for manufacturing an oscillator. Unused terminal.

On the other hand, a metal lead 81 is a terminal that is used even after it is completed as an oscillator, and has functions such as a power supply terminal, a frequency output terminal, and a frequency fine adjustment terminal. After completion of the oscillator, a metal lead 81 is provided so as to be in contact with the external circuit board so that it can be connected to an external circuit board on which the oscillator is mounted by soldering. The material of the terminal member 1 is made of ceramic or resin.

The oscillating circuit, the oscillating frequency compensating circuit, the temperature detecting circuit and the memory of the oscillating circuit component 21 are integrated into a semiconductor chip 33. And the semiconductor chip 3
3 is mounted on the component mounting surface of the terminal member 1 by a wire bonding method of wiring with a metal wire 35.
Then, the resin 37 is sealed between the semiconductor chip 33 and the metal wire 19 for the purpose of ensuring reliability. Further, the vibrator 5 and a part of the capacitor 31 of the oscillation circuit component 21 are mounted on the component mounting surface of the terminal member 1 by a soldering method.

[0006] The semiconductor chip 33 and the oscillator circuit component 21 such as the capacitor 31 which have been mounted on the component mounting surface of the terminal member 1 and the vibrator 5 are connected to each other by a wiring pattern (not shown). I have. Furthermore, the semiconductor chip 3
3 is connected to the first electrode pattern 41 on the side surface of the terminal member 1 through the wiring pattern. Further, the terminal member 1
The cap 3 that covers the first electrode pattern 41 is prepared so as not to cover the first electrode pattern 41. The cap 3 is attached to the side surface or the surface of the terminal member 1 so as to cover the component mounting surface of the terminal member 1. This terminal member 1
The connection between the head 3 and the cap 3 is performed by a soldering method or an adhesive.

Next, a method of adjusting the oscillation frequency of the oscillator based on the above configuration will be described. As shown in FIG. 8, the oscillator 5, the semiconductor chip 33, and the oscillating circuit component 21 such as the capacitor 31 are mounted on the component mounting surface of the terminal member 1.
A temperature test is performed in a temperature range from ℃ to +80 ℃.

According to the temperature test, the oscillation frequency deviation of the oscillation circuit caused by the vibrator 5 to which the temperature has been changed is read as temperature deviation data using a measuring instrument such as a counter. The temperature deviation data obtained by this temperature test is converted into correction data for canceling the oscillation frequency deviation of the oscillation circuit due to a temperature change, and stored in a computer or the like.

After the temperature test is completed, the probe pins 71 are attached to the first electrode pattern 41 provided on the side surface of the terminal member 1.
From the side, and through this probe pin 71,
The correction data for canceling the oscillation frequency deviation is written in the memory of the semiconductor chip 33 of the oscillation circuit component 21. After writing the correction data, the contact of the probe pin 71 is removed. The first electrode pattern 41 is a terminal for writing correction data. And the probe pin 71
Is usually built into the data writing device.

The oscillator in which the correction data is written has almost zero fluctuation in the oscillation frequency with respect to the temperature change, and is completed as a highly accurate temperature-compensated oscillator.

As described above, the first electrode pattern 41 is provided on the side surface of the terminal member 1 to be used, and the correction data is written in the memory by making the probe pin 71 of the data writing device contact from the side. Therefore, the first electrode pattern 41 preferably has a large area in order to reliably contact the probe pins 71, and is not suitable for reducing the thickness of the oscillator.

FIG. 9 will be described as another prior art. The oscillator shown in FIG. 9 is provided with four first electrode patterns 41 and six second electrode patterns 43 on the back surface of the terminal member 1. The second electrode pattern 43 is a terminal that is used even after completed as an oscillator, has functions such as a power supply terminal, a frequency output terminal, and a frequency fine adjustment terminal, and corresponds to the above-described metal lead 81. is there. Second electrode pattern 4
3 is provided so as to be in contact with an external circuit board on which the oscillator is mounted, and is usually connected to the external circuit board by soldering.

The oscillator shown in FIG. 9 has a first electrode pattern 41.
Is provided on the back surface, so that the probe pin 71 of the data writing device can be contacted from the bottom surface. Therefore, even when the oscillator is made thinner, the area of the first electrode pattern 41 can be made larger than that of the oscillator shown in FIG.

However, like the second electrode pattern 43, the first electrode pattern 41 for writing correction data, which is a terminal not used after the manufacture, is provided on the back surface so as to be in contact with the external circuit board. The first electrode pattern 41 which is unnecessary when this oscillator is connected to an external circuit board
This is a factor that restricts the wiring pattern of the external circuit board and reduces the yield of soldering.

[0015]

In recent years, portable telephones and car telephones have become lighter and thinner and smaller, and the oscillators used in them have to be improved in performance, as well as thinner, surface mounted and lighter. ing.

In the structure of the oscillator as shown in FIG. 9, a data writing electrode pattern is provided on the back surface so as to be in contact with the external circuit board. Therefore, although there is no need to connect the external circuit board to the data writing electrode pattern, in order to avoid an electrical short,
It is necessary to escape the data writing electrode pattern and route the wiring pattern.

Therefore, when designing an external circuit board at high density, escape of the data writing electrode pattern and routing of the wiring pattern are obstacles to the degree of freedom in design.

Further, when the oscillator shown in FIG. 9 is mounted on an external circuit board by soldering or the like, adjacent solder flows to the data writing electrode pattern to be connected, resulting in a mounting defect of a bridge phenomenon. In some cases, electrical inconvenience may occur.

Normally, a data writing device is provided with as many oscillators as possible on a table of a data writing device so that data can be written to many oscillators in a short time to improve productivity. The pin is in contact with the data writing electrode pattern.

In the structure of the oscillator as shown in FIG. 8, a data writing electrode pattern is provided on the side surface of the terminal member 1. At the time of data writing, it is necessary to bring a probe pin or the like into contact with the data writing electrode pattern from the horizontal direction. That is, a space for a mechanism for bringing the probe pins into contact with the data writing electrode pattern in the horizontal direction is required.

On the other hand, in the structure of the oscillator as shown in FIG. 9, a probe pin or the like is brought into contact with a data writing electrode pattern in a vertical direction when writing data. The mechanism for bringing the probe pins into contact can be realized in a space that is smaller in the case of contacting in the vertical direction than in the case of contacting in the vertical direction. Therefore, the structure of the oscillator as shown in FIG. 9 causes a disadvantage when a large number of oscillators are arranged on the table of the data writing device.

Further, the oscillator tends to be thin, and accordingly, the terminal member 1 is also desired to be thin. When the terminal member 1 becomes thin, the electrode pattern for data writing becomes considerably thin in the structure of the oscillator as shown in FIG. 8, and it is difficult to reliably contact the probe pins and the like during data writing.

That is, it is necessary to increase the thickness of the terminal member 1 in order to make reliable contact, and the prior art has a disadvantage that the thickness of the oscillator is increased.

[Purpose of the Invention] An object of the present invention is to reduce the thickness of a cellular phone or the like, expand the degree of freedom in designing a wiring pattern when designing an external circuit board on which an oscillator is to be mounted at a high density, and improve the oscillator. It is an object of the present invention to provide an oscillator that does not cause a mounting defect when soldering to an external circuit board and can be made thin.

Another object of the present invention is to provide, in a short time,
An object of the present invention is to provide an oscillator that writes data to a large number of oscillators and corresponds to an improvement in productivity.

[0026]

To achieve the above object, the structure of an oscillator according to the present invention employs the following means.

The structure of the oscillator according to the present invention comprises an oscillator, an oscillation circuit for oscillating the oscillator, a memory, an oscillation circuit component having an oscillation frequency compensation circuit, and a cap for covering the oscillation circuit component. A terminal member having an electrode pattern for transmitting data from the outside to the oscillation circuit component on an upper surface thereof.

The cap in the oscillator of the present invention is
And a first electrode pattern for transmitting data from the outside to the oscillation circuit component is provided on the front upper surface of the terminal member exposed from the second notch portion.

In the oscillator according to the present invention, the cap of the oscillator according to the present invention has a chamfered portion at a corner portion, and transmits data from the outside to the oscillation circuit component on the upper surface of the terminal member exposed from the chamfered portion. Has the first electrode pattern on the upper surface.

The cap of the oscillator according to the present invention has a chamfered portion at a corner and a first member for positioning the cap on the terminal member.
A first electrode pattern for transmitting data from the outside to the oscillation circuit component is provided on the front upper surface of the terminal member exposed from the chamfered portion.

The cap of the oscillator according to the present invention has a round edge at a corner, and a first portion for transmitting data from the outside to the oscillation circuit component on the upper surface of the terminal member exposed from the round edge. An electrode pattern is provided on the upper surface.

The cap of the oscillator according to the present invention has a rounded edge at a corner and a first cutout for positioning the cap on the terminal member, and is provided on the upper surface of the terminal member exposed from the rounded edge. A first electrode pattern for transmitting data from the outside to the oscillation circuit component is provided on the upper surface.

The material of the terminal member in the oscillator according to the present invention is at least partly made of ceramics, glass ceramics or glass, and is rectangular or square.

[Operation] In the oscillator of the present invention, an electrode pattern for transmitting data from the outside to the oscillation circuit component is provided on the upper surface of the terminal member and is not provided on the back surface so as to be in contact with the external circuit board. When designing the pattern of the external circuit board, there is no need to escape the data writing electrode pattern and route the wiring pattern. In other words, the wiring pattern can be routed to the space of the mounting area of the oscillator on the external circuit board,
The wiring pattern of the external circuit board can be designed with high density.

Also, when mounting on an external circuit board by soldering or the like, a first electrode pattern for transmitting data from the outside to the oscillation circuit component is provided on the front surface of the terminal member,
It is not provided on the back surface so as to be in contact with the external circuit board. For this reason, when soldering to an external circuit board, a mounting defect such as a bridge is not caused.

The first electrode pattern for transmitting data from the outside to the oscillation circuit component is provided on the front surface of the terminal member exposed from the notch of the cap. Data can be written in the last step.

The first electrode pattern for transmitting data from the outside to the oscillation circuit component has a chamfer at the corner of the cap and is provided on the upper surface of the terminal member exposed from the chamfer. In the oscillator assembling process, data can be written in the final process after capping.

The first electrode pattern for transmitting data from the outside to the oscillation circuit component has a round edge at the corner of the cap and is provided on the front upper surface of the terminal member exposed from the round edge. Thus, in the oscillator assembling process, data can be written in the final process after capping.

The first electrode pattern for transmitting data from the outside to the oscillation circuit component has a concave edge at the corner of the cap and is provided on the upper surface of the terminal member exposed from the concave edge. Thus, in the oscillator assembling process, data can be written in the final process after capping.

Further, the cap has a chamfered portion, a rounded edge, or a concave edge at a corner thereof, and the terminal member exposed from the chamfered portion, the rounded edge, or the concave edge oscillates from the outside. A first electrode pattern for sending data to the circuit component is provided, and in addition, the cap has a first notch for positioning the terminal member, so that the cap can be accurately and easily assembled, and after the cap is attached. In the last step, data can be written.

As described above, since data can be written in the final step, the amount of change caused by the assembling step can be corrected, and a highly accurate oscillator can be obtained.

Since at least a part of the material of the terminal member is made of ceramics, glass ceramics, or glass, the oscillator has excellent electrical characteristics and is a highly accurate and highly reliable oscillator. Therefore, the external shape of the terminal member is stabilized, productivity is improved, and further, the accuracy of the shape of the oscillator is improved and cost is reduced.

The oscillator according to the present invention, when writing data,
A probe pin or the like can be vertically contacted with the first electrode pattern for transmitting data provided on the upper surface of the terminal member. Therefore, since the probe pins of the data writing device move up and down, a mechanism for bringing the probe pins into contact can be realized in a small space, and a large number of oscillators can be arranged on the table of the data writing device, so that a short time is required. Thus, an oscillator having a structure capable of writing data to many oscillators and having excellent mass productivity is provided.

Further, since the thickness of the oscillator is reduced, the area of the data writing electrode pattern does not decrease even if the terminal member is thinned. it can.

[0045]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The preferred embodiments of the structure of the oscillator according to the present invention will be described below with reference to the drawings. In the oscillator of the present invention, an oscillation circuit component 21 including an oscillation circuit, a memory, an oscillation frequency compensation circuit, and a detection circuit, and a vibrator 5 are mounted on the terminal member 1, and then the cap 3 is attached to the terminal member 1.
This is a data writing type oscillator that adjusts the oscillation frequency by writing correction data into a memory from a first electrode pattern 41 provided on the terminal member 1 and adjusting the oscillation frequency. The detection circuit detects an element that affects the frequency such as temperature. A typical data write type oscillator that detects temperature and adjusts the frequency with correction data is a temperature compensated oscillator.

FIG. 1 is a perspective view showing the structure of an oscillator according to the present invention, and FIG. 2 is a plan view of the oscillator according to the present invention excluding a cap. FIG. 3 is a bottom view of the oscillator according to the present invention. FIGS. 4, 5, 6, and 7 are plan views showing the cap of the oscillator according to the present invention. First, a description will be given with reference to these drawings.

First, as shown in FIGS. 1, 2 and 3, ceramics, glass ceramics,
The terminal member 1 made of an insulator such as glass or glass epoxy resin has a substantially square shape and a plate shape except for corner portions. The corners may be chamfered or rounded.

The upper surface of the terminal member 1 is connected to components such as the oscillator circuit component 21 and the vibrator 5 to form a component mounting surface.
First electrode patterns 41 are provided at four corners on the upper surface of the terminal member 1, and second electrode patterns 43 are provided on the back surface. The upper surface of the terminal member 1 is a component mounting surface, and a wiring pattern (not shown in FIG. 11) is formed inside the terminal member 1, and the oscillation circuit component 21 and the vibrator 5 And the first electrode pattern 41 and the second electrode pattern 43 are arbitrarily electrically connected. The vibrator 5 is a surface-mount thin vibrator.

The oscillation circuit component 21 comprises a semiconductor chip 33 and a capacitor 31. The semiconductor chip 33 integrates an oscillating circuit, an oscillating frequency compensating circuit, a detecting circuit, a memory, and the like, thereby forming the semiconductor integrated circuit device into one chip.

Further, the first electrode pattern 41 of the terminal member 1 has a function of externally applying correction data to the memory of the semiconductor chip 33 of the oscillation circuit component 21. This terminal is not used after it has been completed.

On the other hand, the second electrode pattern 43 is a terminal that is used even after completed as an oscillator, and has functions such as a power supply terminal, a frequency output terminal, and a frequency fine adjustment terminal. After completion of the oscillator, the second electrode pattern 43 is provided so as to be in contact with the external circuit board so that the oscillator can be connected to an external circuit board on which the oscillator is mounted.

The semiconductor chip 33 of the oscillation circuit component 21 is
The terminal member 1 is mounted on the component mounting surface by a wire bonding method of wiring with a metal wire 35 such as a gold wire or an aluminum wire. Then, the resin 37 is sealed between the semiconductor chip 33 and the metal wire 19 for the purpose of ensuring reliability. Further, the oscillator 5 and the capacitor 31 of the oscillation circuit component 21
Are mounted on the component mounting surface on the top surface of the terminal member 1 by a soldering method or the like.

The cap 3 is made by plastically deforming a metal plate, and covers the oscillation circuit components on the upper surface of the terminal member 1.
The cap 3 shown in FIGS. 1 and 4 is provided with a chamfered portion 61 and a cutout portion 51 at four corners, and is easily and accurately positioned at the corner of the terminal member 1. And
The cap 3 is attached to the side surface or the surface of the terminal member 1 by using a solder or an adhesive or by fitting the cap 3 and the terminal member 1 together. The chamfered portion 61 of the cap 3 exposes the first electrode pattern 41 on the upper surface of the terminal member 1.

As shown in FIG. 5, the cap 3 may be provided with a second notch 53 to expose the first electrode pattern 41 on the upper surface of the terminal member 1. By forming the cap 3 in this shape, the cap 3 can be easily formed without a drawing step.

As shown in FIG. 6, the cap 3 may be provided with round edges 63 at the four corners to expose the first electrode pattern 41 on the upper surface of the terminal member 1. By forming the cap 3 in this shape, the space for incorporating the vibrator 5 and the oscillation component 21 is increased.

As shown in FIG. 7, the cap 3 may be provided with concave edges 65 at four corners to expose the first electrode pattern 41 on the upper surface of the terminal member 1. By forming the cap 3 in this shape, the area of the first electrode pattern 41 on the upper surface of the terminal member 1 increases.

The material of the cap 3 may be ceramics or resin having conductivity. The conductivity in this case may be determined by mixing conductive powder with ceramics or resin when forming the cap 3, forming a metal film on the formed cap 3, applying a conductive film to the formed cap 3, Apply the paint on the surface.

[Method of Adjusting Oscillation Frequency] Next, a method of adjusting the oscillation frequency of the oscillator based on the above configuration will be described.
As shown in FIGS. 1 and 2, the oscillator 5, the semiconductor chip 33, and the oscillation circuit component 21 such as the capacitor 31 are mounted on the component mounting surface on the front surface of the terminal member 1, and the cap 3 is attached. In this state, a temperature test is performed in a temperature range of, for example, −40 ° C. to + 80 ° C.

By this temperature test, the oscillation frequency deviation of the oscillation circuit caused by the vibrator 5 having the temperature change is read as temperature deviation data using a measuring instrument such as a counter. The temperature deviation data obtained by this temperature test is converted into correction data for canceling the oscillation frequency deviation of the oscillation circuit due to a temperature change, and stored in a computer or the like.

After the temperature test is completed, the probe pins 71 are securely brought into contact with the first electrode patterns 41 provided on the upper surface of the terminal member 1 so as to be exposed from the cap from the upper surface. And the oscillation circuit component 21
In the memory of the semiconductor chip 33, correction data for canceling the oscillation frequency deviation described above is written. After writing the correction data, the contact of the probe pin 71 is removed.
The probe pins 71 are usually incorporated in a data writing device.

The oscillator in which the correction data is written has almost no variation in the oscillation frequency with respect to the temperature change, and is completed as a highly accurate temperature-compensated oscillator.

The characteristics of the present invention can be best exhibited when the material of the terminal member 1 is at least partially made of ceramics, glass ceramics, or glass and is rectangular or square. When the terminal member 1 is made of ceramics, glass ceramics, or glass, an oscillator having excellent frequency characteristics and having stable frequency characteristics with respect to the surrounding environment such as humidity can be obtained. In addition, by making the terminal member 1 rectangular or square with ceramics, glass ceramics, or glass, the terminal member 1 can be easily manufactured in multiple pieces and has excellent shape accuracy, and can be inexpensive. The present invention provides a cap member 3 on a terminal member 1 having excellent frequency characteristics, and provides an inexpensive oscillator excellent in characteristics and easy to manufacture.

In some cases, the first electrode pattern 41
Are not the four places at the four corners of the top surface of the terminal member 1,
An arbitrary number may be provided at any of the four corners on the upper surface of the terminal member 1.

Further, if there is an unused corner not used as the first electrode pattern 41 at the four corners of the upper surface of the terminal member 1, the cap 3 is used at the unused corner.
May be connected to the upper surface of the terminal member 1 with solder or an adhesive.

In some cases, the semiconductor chip 33 may be mounted by a face-down bonding method such as flip chip mounting instead of wire bonding.

The semiconductor chip 33 may be mounted by a face-down bonding method such as flip-chip mounting instead of wire bonding.

[0067]

As is apparent from the above description, in the oscillator of the present invention, an electrode pattern for transmitting data from the outside to the oscillating circuit component is provided on the upper surface of the terminal member so as to be in contact with the external circuit board. Not provided on the back side. For this reason,
When designing the pattern of the external circuit board, there is no need to escape the data writing electrode pattern and route the wiring pattern. That is, the wiring pattern can be routed to the space of the mounting area of the oscillator of the external circuit board, and the wiring pattern of the external circuit board can be designed with high density.

Also, when mounting on an external circuit board by soldering or the like, an electrode pattern for sending data from the outside to the oscillation circuit component is provided on the upper surface of the terminal member, and the back surface is so contacted with the external circuit board. Not provided. Therefore, the oscillator according to the present invention does not cause a mounting failure such as a bridge when soldering to an external circuit board.

Further, in the oscillator according to the present invention, the data writing electrode pattern for transmitting data from the outside to the oscillation circuit component is provided on the front upper surface of the terminal member exposed from the second cutout portion of the cap. . As a result, in the oscillator assembling process, in the final process after capping,
Data can be written.

Further, in the oscillator according to the present invention, the data writing electrode pattern for transmitting data from the outside to the oscillation circuit component has a chamfered portion at a corner of the cap, and a terminal member exposed from the chamfered portion. It is provided on the upper surface. Thus, in the oscillator assembling process, data can be written in the final process after capping.

Further, in the oscillator according to the present invention, the electrode pattern for data writing for transmitting data from the outside to the oscillation circuit component has a round edge at the corner of the cap, and a terminal member exposed from the round edge. It is provided on the upper surface. Thus, in the oscillator assembling process, data can be written in the final process after capping.

Further, in the oscillator according to the present invention, the data writing electrode pattern for sending data from the outside to the oscillation circuit component has a concave edge at the corner of the cap, and the terminal member is exposed from the concave edge. It is provided on the upper surface. Thus, in the oscillator assembling process, data can be written in the final process after capping.

Further, the oscillator according to the present invention has a chamfer, a round edge, or a concave edge at a corner of the cap.
A data writing electrode pattern for sending data from the outside to the oscillation circuit component is provided on the upper surface of the terminal member exposed from the rounded edge or the concave edge, and in addition to this, the cap is a notch for positioning the terminal member. Having. Therefore, assembly of the cap can be accurately and easily realized, and data can be written in the final step after the cap is attached.

The material of the terminal member of the oscillator according to the present invention is as follows.
Since at least a part is made of ceramics, glass ceramics, or glass, the oscillator has excellent electrical characteristics and high precision and high reliability.In addition, the terminal shape is rectangular or square, so the terminal member has an external shape Is stable, the productivity is improved, and the shape accuracy of the oscillator is improved and the cost is reduced.

In the oscillator according to the present invention, the data writing electrode pattern is provided on the upper surface of the terminal member.
At the time of data writing, a probe pin or the like can be brought into contact with the data writing electrode pattern from the vertical direction. Therefore, the mechanism for contacting the probe pins of the data writing device can be realized in a small space, and a large number of oscillators can be arranged on the table of the data writing device.
It provides an oscillator with a structure that can write data and has excellent mass productivity.

A technique for reducing the thickness of the terminal member 1 to reduce the thickness of the oscillator is a common practice. In order to make the oscillator thinner, even if the terminal member is thinned, the area of the electrode pattern for data writing does not decrease, so that the probe pins and the like can be surely contacted at the time of data writing.

As described above, according to the present invention, it is possible to easily satisfy the demand for a data write type oscillator required from a portable telephone or the like.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an oscillator according to an embodiment of the present invention.

FIG. 2 is a plan view showing an oscillator according to the embodiment of the present invention.

FIG. 3 is a bottom view showing the oscillator according to the embodiment of the present invention.

FIG. 4 is a plan view showing a cap of the oscillator according to the embodiment of the present invention.

FIG. 5 is a plan view showing a cap of the oscillator according to the embodiment of the present invention.

FIG. 6 is a plan view showing a cap of the oscillator according to the embodiment of the present invention.

FIG. 7 is a plan view showing a cap of the oscillator according to the embodiment of the present invention.

FIG. 8 is a perspective view showing an oscillator according to the related art.

FIG. 9 is a cross-sectional view showing an oscillator according to another related art.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Terminal member 3 Cap 5 Oscillator 5 Semiconductor chip 21 Oscillation circuit component 31 Capacitor 33 Semiconductor chip 35 Gold wire 37 Resin 41 First electrode pattern 43 Second electrode pattern 51 First cutout 53 Second cut Notch 61 Chamfer 63 Round edge 65 Concave edge 71 Probe pin 81 Metal lead

Claims (9)

[Claims] An oscillator circuit includes an oscillator, an oscillator circuit for oscillating the oscillator, a memory, an oscillator circuit component having an oscillation frequency compensation circuit, and a cap for covering the oscillator circuit component. An oscillator comprising: a terminal member having, on an upper surface thereof, a first electrode pattern for transmitting data to a component. The cap has a second notch, and an electrode pattern for transmitting data from the outside to the oscillation circuit component is formed on the top surface of the terminal member exposed from the second notch. 2. The device according to claim 1, wherein the front surface is provided on the upper surface.
The oscillator as described. 3. The cap has a chamfered portion at a corner, and an electrode pattern for transmitting data from an external device to the oscillation circuit component is formed on the upper surface of the terminal member exposed from the chamfered portion. The oscillator according to claim 1, further comprising: 4. The cap has a chamfered portion at a corner and a first notch for positioning the cap on the terminal member, and an external oscillator circuit is provided on the upper surface of the terminal member exposed from the chamfered portion. 2. The oscillator according to claim 1, further comprising a first electrode pattern for transmitting data to the component on the upper surface. 5. The cap has a rounded edge at a corner, and a first electrode pattern for transmitting data from the outside to the oscillation circuit component is formed on the upper surface of the terminal member exposed from the rounded edge. 2. The oscillator according to claim 1, wherein the oscillator is provided on an upper surface. 6. The cap has a rounded edge at a corner and a notch for positioning the cap on the terminal member. 2. The oscillator according to claim 1, further comprising a first electrode pattern for transmitting data on an upper surface. 7. The cap has a concave edge at a corner, and a first electrode pattern for externally sending data to an oscillation circuit component is formed on an upper surface of a terminal member exposed from the concave edge. 2. The oscillator according to claim 1, wherein the oscillator is provided on an upper surface. 8. The cap has a concave edge portion at a corner and a notch for positioning the cap on the terminal member. 2. The oscillator according to claim 1, further comprising a first electrode pattern for transmitting data on an upper surface. 9. The oscillator according to claim 3, wherein at least a part of the material of the terminal member is made of ceramics, glass ceramics, or glass, and is rectangular or square.