JPH1197515A - Wafer-supporting turn table - Google Patents

Abstract

PROBLEM TO BE SOLVED: To avoid floating of a wafer from a table during rotation to easily and surely support the wafer by providing a presser for pressing the top face of the wafer toward the table with rotation of the table by a rotary mechanism. SOLUTION: As treating of a wafer W begins, a drive motor rotates the wafer-supporting turntable 30a mounting a wafer at a high speed with a pendulum 33b shifting in a direction a due to a centrifugal force. A pressing claw 33c of a presser 33 attached to the table 30a swings to press the top face of the wafer W to the table 30a enough to avoid floating the wafer or deviating its position, thus easily and surely supporting the wafer W with the table 30a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a CVD (Chemical Vap) for performing a process while rotating a wafer at a high speed.
The present invention relates to a rotary table for supporting a wafer used in an apparatus or the like.

[0002]

2. Description of the Related Art FIG. 4A is a schematic sectional view showing a CVD apparatus 10 for processing wafers one by one among conventional CVD apparatuses. The CVD apparatus 10 includes a reaction chamber 11 that is hermetically closed. An exhaust pump 12 for exhausting the inside of the chamber 11 and a gas introducing unit 13 for introducing a reaction gas into the chamber 11 are connected to the chamber 11. On the other hand, a table 14 is placed in the chamber 11 and is configured to be rotatable around the axis of the wafer W and is rotatably driven by a rotation mechanism 15.

In such a CVD apparatus 10, a wafer W to be processed is placed on a table 14 and a chamber 11 is hermetically closed. The inside of the chamber 11 is evacuated by the exhaust pump 12 and a reaction gas is introduced from the gas introduction unit 13. Then, the rotation mechanism 15 is operated to operate the table 1.
4 is rotated at a high speed to cause the reaction gas to act on the wafer W.

In order to prevent this, as shown in FIG. 4B, the inside of the table 14 is made to have a negative pressure with respect to the wafer surface by using an exhaust pump 16 or the like, so that the back surface of the wafer W is placed on the table 14. A method for adsorption is known.

[0005]

The table 14 using the above-described conventional method of preventing the floating of the wafer W has the following problems. That is, in the method in which the groove 14a is provided in the table 14, the reaction gas does not sufficiently act on the portion abutting on the groove 14a and the periphery thereof, so that a space for forming the element needs to be formed near the center of the wafer W. For this reason, there has been a problem that the material yield is reduced.

On the other hand, the method of vacuum-adsorbing the back surface of the wafer W requires another exhaust pump 16 in addition to the exhaust pump 12 for exhausting the inside of the chamber 11, which leads to an increase in the cost of the apparatus and the structure of the apparatus. Was complicated.

Further, when taking out the wafer W from the table 14, it is necessary to adjust the air pressure so that the pressure inside the table 14 is higher than the pressure inside the chamber 11. At this time, the chamber 11 is removed from inside the table 14.
There is also a problem that particles are generated due to the flow of the fluid inside.

Accordingly, an object of the present invention is to provide a wafer supporting rotary table capable of easily and surely supporting a wafer.

[0009]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems and achieve the object, according to the first aspect of the present invention, an outer peripheral portion of a disk-shaped wafer is positioned and mounted on an outer peripheral portion thereof. A table to rotate, a rotation mechanism for rotating the table,
A pressing portion provided on the outer peripheral edge of the table and pressing the upper surface of the wafer toward the table as the table is rotated by the rotating mechanism.

According to a second aspect of the present invention, in the first aspect, the pressing portion has one end disposed on the outer peripheral side of the table and the other end disposed above the wafer. An arm is provided, the center of which is swingably provided on the outer peripheral edge of the table, the pendulum is provided at the one end and swings with the rotation of the table, and is provided at the other end. Pressing claws for pressing the upper surface side of the wafer.

According to a third aspect of the present invention, in the first aspect of the invention, the outer peripheral edge of the table is provided such that the positioned wafer projects upward.

According to a fourth aspect of the present invention, there is provided a bottomed cylindrical table on which an outer peripheral portion of a disk-shaped wafer is positioned and placed on an outer peripheral edge of the opening, and a rotary for rotating the table. A mechanism and an exhaust blade provided at the bottom of the table and configured to exhaust the inside of the table as the table is rotated by the rotating mechanism are provided.

According to a fifth aspect of the present invention, in the fourth aspect, the outer peripheral edge of the table is provided so that the positioned wafer projects upward.

As a result of taking the above measures, the following operation occurs. That is, according to the first aspect of the present invention, the wafer is pressed against the table side by the pressing portion that presses the upper surface side of the wafer toward the table side with the rotation of the table by the rotation mechanism, so that the wafer does not float during rotation.
Also, there is no wafer displacement (can prevent lateral displacement due to centrifugal force).

According to the second aspect of the present invention, the pendulum moves outward due to the centrifugal force generated with the rotation of the table, whereby the pressing claw presses the wafer. Can be pressed against the wafer.

According to the third aspect of the invention, since the outer peripheral edge of the table is provided so that the positioned wafer projects upward, the airflow on the wafer is not disturbed at the outer peripheral portion.

According to the fourth aspect of the present invention, since the exhaust blade for exhausting the inside of the table with the rotation of the table by the rotation mechanism is provided, the wafer W can be sucked to the table without using any special device. Can be.

In the invention described in claim 5, the outer peripheral edge of the table is provided so that the positioned wafer projects upward, so that the airflow on the wafer is not disturbed at the outer peripheral portion.

[0019]

FIG. 1 shows a CV in which a rotary table 30 for supporting a wafer according to a first embodiment of the present invention is incorporated.
FIG. 2 is a sectional view showing the configuration of the D apparatus 20, and FIG. 2 is a view showing a main part of the rotary table for supporting the wafer.

The CVD apparatus 20 has a reaction chamber 21 which is airtightly constructed. A reaction gas introduction port 22 for introducing a reaction gas is provided on the ceiling side of the reaction chamber 21, and an opening / closing door 23 for taking a wafer W in and out of a load lock chamber (not shown) is provided on a side surface side. On the other hand, an exhaust port 24 is provided in the reaction chamber 21 and is connected to an exhaust pump 25.

A rotary table 30 for supporting a wafer is arranged in the reaction chamber 21. The rotary table 30 for supporting a wafer is formed in a bottomed cylindrical shape with its opening 31 facing upward, and its axis C is oriented vertically. The outer peripheral portion Wa of the wafer W is provided inside the peripheral portion 31a of the opening 31.
Is formed. In addition, the periphery 3
A pressing portion 33 is provided on the upper portion 1a. When the wafer W is placed on the flange 32, the peripheral portion 31a
Are formed in such a size as to protrude above the peripheral portion 31a.

The pressing portion 33 includes an arm 33a swingably attached to the peripheral portion 31a, a pendulum 33b attached to the outer end of the arm 33a, and a pressing claw 33c attached to the inner end. Have.

The wafer supporting rotary table 30 is driven to rotate about an axis C by a rotary drive motor 34 via a shaft 35. In addition, 36 in FIG. 1 has shown the sealing part.

In the CVD apparatus 20 configured as described above, the processing of the wafer W is performed as follows. That is,
The evacuation pump 25 is operated to evacuate the reaction chamber 21 to maintain a constant pressure, and a reaction gas is introduced from the reaction gas inlet 22 to start the processing of the wafer W. Then, the rotary drive motor 34 rotates the wafer supporting rotary table 30 on which the wafer W is mounted at a high speed. At this time, the pendulum 33b moves in the direction of the arrow α in FIG.
Accordingly, the pressing claw 33c swings and presses the upper surface of the wafer W. As a result, the wafer W is pressed against the rotary table 30 for supporting the wafer, so that the wafer W does not float and the displacement can be prevented.

On the other hand, since the upper surface of the wafer W protrudes above the peripheral portion 31a, the reaction gas is not disturbed at the outer peripheral portion of the wafer W. For this reason, the reaction gas can be uniformly spread over the entire surface of the wafer W and uniform processing can be performed.

As described above, in the wafer supporting rotary table 30 according to the first embodiment, the wafer W can be easily formed.
And it can support reliably.

FIG. 3 shows a CVD apparatus 20A incorporating a rotary table for supporting a wafer according to a second embodiment of the present invention.
It is sectional drawing which shows a structure of. 3, the same reference numerals are given to the same functional portions as those in FIG. 1, and the description thereof will be omitted.

In the second embodiment, a wafer supporting rotary table 40 is provided in place of the wafer supporting rotary table 30 described above. The wafer supporting rotary table 40 is formed in a bottomed cylindrical shape with its opening 41 facing upward, and its axis C is oriented vertically. A flange 42 on which the outer peripheral portion Wa of the wafer W is placed is formed inside the peripheral portion 41 a of the opening 41. On the other hand, an opening H is provided in the bottom portion 43, and an exhaust blade 44 that rotates with the rotation of the wafer supporting rotary table 40 is provided in the opening H. It should be noted that the peripheral portion 41 a
2, the wafer W is formed in such a size that the wafer W protrudes above the peripheral edge portion 41a.

In the thus configured CVD apparatus 20A, the processing of the wafer W is performed as follows. That is,
The evacuation pump 25 is operated to evacuate the reaction chamber 21 to maintain a constant pressure, and a reaction gas is introduced from the reaction gas inlet 22 to start the processing of the wafer W. Then, the rotary drive motor 34 rotates the wafer supporting rotary table 40 on which the wafer W is mounted at a high speed. At this time, with the rotation of the wafer supporting rotary table 40, an airflow is generated from the inside of the wafer supporting rotary table 40 to the outside by the exhaust blades 44, and the internal pressure decreases. Since the upper surface of the wafer W in FIG. 3 does not change in air pressure, the wafer W is pressed against the wafer supporting rotary table 40 side. Therefore, the wafer W does not float, and the displacement can be prevented.

On the other hand, since the upper surface of the wafer W protrudes above the peripheral portion 41a, the reaction gas is not disturbed at the outer peripheral portion of the wafer W. For this reason, the reaction gas can be uniformly spread over the entire surface of the wafer W and uniform processing can be performed.

As described above, the wafer supporting rotary table 40 according to the second embodiment allows the wafer W to be easily
And it can support reliably.

It should be noted that the present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made without departing from the spirit of the present invention.

[0033]

As a result of taking the above-described measures, the following effects are produced. That is, according to the first aspect of the present invention, the wafer is pressed against the table side by the pressing portion that presses the upper surface side of the wafer toward the table side with the rotation of the table by the rotation mechanism, so that the wafer may rise during rotation. And the displacement can be prevented.

According to the second aspect of the present invention, the pendulum moves outward due to the centrifugal force generated with the rotation of the table, and the pressing claw presses the wafer. Thus, the wafer can be reliably pressed.

According to the third aspect of the present invention, the outer peripheral edge of the table is provided so that the positioned wafer projects upward, so that the air flow on the wafer is not disturbed at the outer peripheral portion. .

According to the fourth aspect of the present invention, since the exhaust blade for exhausting the inside of the table by the rotation mechanism with the rotation of the table is provided, the wafer W is sucked to the table without using any special device. Can be done.

According to the fifth aspect of the present invention, since the outer peripheral portion of the table is provided so that the positioned wafer projects upward, the air flow on the wafer is not disturbed at the outer peripheral portion. .

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a configuration of a CVD apparatus in which a rotary table for supporting a wafer according to a first embodiment of the present invention is incorporated.

FIG. 2 is a diagram showing a main part of the rotary table for supporting the wafer.

FIG. 3 is a sectional view showing a configuration of a CVD apparatus in which a wafer supporting rotary table according to a second embodiment of the present invention is incorporated.

FIG. 4 is a view showing a configuration of a CVD apparatus in which a conventional rotary table for supporting a wafer is incorporated.

[Explanation of symbols]

 20, 20A: CVD apparatus 30, 40: Rotating table for supporting wafer 31: Opening 31a: Peripheral part 33: Pressing part 33a: Arm 33b: Pendulum 33c: Pressing claw 34: Rotating drive motor 44: Exhaust blade

Claims (5)

[Claims] 1. A table on which an outer peripheral portion of a disk-shaped wafer is positioned and mounted on an outer peripheral edge thereof, a rotating mechanism for rotating the table, and a rotating mechanism provided on the outer peripheral edge of the table, And a pressing portion for pressing the upper surface of the wafer toward the table as the table is rotated by a mechanism. 2. The pressing portion has one end disposed on the outer peripheral side of the table, the other end disposed above the wafer, and the central portion swingably mounted on the outer peripheral edge of the table. An arm provided, a pendulum provided at the one end and swinging with the rotation of the table, and a pressing claw provided at the other end and pressing the upper surface of the wafer. Rotating table for supporting wafers. 3. A projection is formed on the outer peripheral edge of the table so as to protrude upward by a predetermined height, and the height is set lower than the outer peripheral edge of the wafer mounted on the table. The rotary table for supporting a wafer according to claim 1, wherein 4. A bottomed cylindrical table for positioning and mounting an outer peripheral portion of a disc-shaped wafer on an outer peripheral edge of the opening, a rotating mechanism for rotating the table, and A rotating table for supporting a wafer, comprising: an exhaust blade provided to exhaust the inside of the table as the table rotates by the rotating mechanism. 5. The wafer supporting rotary table according to claim 4, wherein the outer peripheral edge of the table is provided so that the positioned wafer projects upward.