JPH1197299A - Method and device for aging chip-type capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for aging chip-type capacitor by which the aging process of a chip type capacitor can be carried out quickly and the manufacturing cost of the capacitor can be reduced by rationalizing the mounting work of the capacitor and a device used for the method. SOLUTION: In a chip-type capacitor aging device 11, which is constituted to simultaneously perform heating and aging treatment on many chip type capacitors, while the capacitors are held by means of jigs 55 in a heating furnace 13 and discharge the treated capacitors from the furnace 13, the unprocessed capacitors randomly housed in a hopper 17 are sent to a downstream-side dam 24 faced to the jigs 55 while the capacitors are spread in the widthwise direction and arranged in order along the dam 24, when the capacitors come into contact with the dam 24. A vacuum finger device 14 collectively transfers the capacitor group to the jigs 55.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for aging a chip capacitor.

[0002]

2. Description of the Related Art In a manufacturing process of an electrolytic capacitor, a so-called aging process of applying a voltage under heating is performed as a measure for stabilizing an element. In such an aging process of the chip-type capacitor, the chip-type capacitor 153 is manually attached to a gripper 152 having a leaf spring-like pressing portion 151 as shown in FIG. Then, the plurality of grippers 152 to which such chip-type capacitors 153 are mounted are set in a heating furnace (not shown), and the grippers 152 are used as fixed electrodes, and the movable electrodes in the heating furnace are brought into contact with the chip-type capacitors. Aging was performed by applying a voltage.

[0003]

In the aging process of the chip type capacitors, it is preferable from the viewpoint of work efficiency that batch processing of a certain number of chip type capacitors can be performed. However, conventionally, as described above, the gripper 152
For this purpose, chip-type capacitors were manually mounted. The work of mounting such a chip type capacitor is troublesome and time-consuming. For this reason, even if the processing capacity on the heating furnace side is large, it takes time to prepare the chip type capacitor, which leads to an increase in the cost of the aging process, which in turn increases the cost of the capacitor itself. The present invention has been made to solve such problems of the conventional technology. An object of the present invention is to provide a chip type capacitor aging method and a device capable of speeding up an element aging process and reducing costs in capacitor manufacture by rationalizing a chip type capacitor mounting operation.

[0004]

Means for Solving the Problems In order to solve the above problems, according to the invention of claim 1, while a plurality of chip type capacitors are held for a predetermined time by holding means in a heating furnace, the chip type capacitors are subjected to heat treatment. In addition, in the aging method of the chip-type capacitor which performs the aging treatment by applying the voltage and then discharges the chip-type capacitor which has been processed outside the heating furnace, an alignment step of arranging a plurality of chip-type capacitors before processing at predetermined intervals. And an arranging step of arranging the plurality of chip-type capacitors aligned to face the holding means, and a transfer step of collectively transferring the plurality of chip-type capacitors aligned and arranged facing the holding means to the holding means. The gist is to have In such a configuration, the chip capacitors before processing are aligned at predetermined intervals through an alignment step, and are arranged facing the holding means in the arrangement step. Thereafter, the plurality of aligned chip capacitors are heated collectively. Transfer it to the holding means in the furnace.

In the invention of claim 2, a plurality of chip-type capacitors are held by holding means in a heating furnace, and the chip-type capacitors are subjected to an aging process by applying a voltage together with a heating process, and the processing is performed. In an aging device for chip type capacitors that discharges the chip type capacitors outside the heating furnace, the aging device sends out a plurality of unprocessed chip type capacitors randomly stored in the storage portion while diffusing them in the width direction. Aligning means for arranging at a predetermined interval in the width direction on the downstream side, arranging means for arranging a plurality of the aligned chip-type capacitors facing the holding means, and collectively arranging the plurality of the aligned chip-type capacitors. And a delivery means for delivering to the holding means. In such a configuration, the plurality of unprocessed chip capacitors that are randomly stored in the storage unit are sent out while being diffused in the width direction, and are arranged at predetermined intervals in the width direction on the downstream side. Then, the plurality of chip-type capacitors arranged in a line are collectively delivered to the holding means in the heating furnace.

According to a third aspect of the present invention, in addition to the configuration of the second aspect of the present invention, the delivery unit simultaneously holds a plurality of chip capacitors arranged by the arrangement unit at a first position. The gist of the present invention is to transfer to a holding means in the heating furnace at a second position which is rotationally displaced from the first position. In such a configuration, in addition to the effect of the invention of claim 2, a plurality of chip-type capacitors arranged and arranged are collectively gripped at the first position, and the transfer means is rotationally displaced, and the inside of the heating furnace is moved at the second position. Hand over to the holding means. In the invention of claim 4, claim 2 or 3
In addition to the configuration of the invention, the processing of the chip-type capacitor is performed while the holding means is moved around in the heating furnace, and the discharge port also serves as an introduction port when holding the chip-type capacitor in the holding means. Wherein the holding of the chip-type capacitor is released and the chip-type capacitor is discharged out of the furnace. In such a configuration, in addition to the function of the invention of claim 2 or 3, the chip-type capacitor goes around the heating furnace, returns to the original position introduced into the heating furnace, and returns from the outlet serving also as the inlet after the treatment. Discharge the chip capacitor.

[0007]

According to the first and second aspects of the present invention, a preparatory operation for setting the chip capacitors in the heating furnace becomes unnecessary, and a large number of chip capacitors can be set in the heating furnace at one time. The cost in the aging process is greatly reduced, and the production of chip type capacitors is greatly improved. According to a third aspect of the present invention, in addition to the effect of the second aspect, the transfer means receives a plurality of chip-type capacitors collectively by the holding means simply by changing the position by rotating from the first position to the second position. Because you can pass
The size of the transfer means is reduced, and the structure of the entire apparatus is simple, so that the size can be reduced. Further, in the invention of claim 4, in addition to the effects of the invention of claim 2 or 3, the heating furnace can be downsized and the structure becomes simple because the inlet of the chip type capacitor also serves as the outlet.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, specific embodiments of a method and an apparatus for aging a chip-type capacitor according to the present invention will be described with reference to FIGS. In the following description, the term “left and right” refers to the left-right direction in FIGS. 2, 15 and 21, and the term “back and forth” refers to the vertical direction in FIGS. 2, 15 and 21.

(Embodiment 1) Embodiment 1 will be described with reference to FIGS. As shown in FIG. 1, an aging device 11 for a chip-type capacitor (hereinafter, referred to as an aging device 11) includes a capacitor supply device 12 as an alignment means, a heating furnace 13, and a vacuum finger device 14 as a delivery means. . First, the capacitor supply device 12 will be described.

As shown in FIGS. 1 to 3, a capacitor supply device 12 includes a hopper 1 for storing a chip type capacitor 15.
7, a first chute 19, a magazine 20, and a second
And a cover 22 that covers the upper surfaces of the first and second chute portions 19 and 21 and the magazine 20. In the hopper 17, a rotary blade 17a serving as a sending means for sending the chip type capacitor 15 to the downstream side is provided. Rotary blade 17a is hopper 1
7 is rotated by a motor 18 disposed below. The first chute portion 19 is composed of twelve rows of chutes s extending in the width direction, and is formed so that the downstream side is lowered. In the first chute 19, the chip type capacitors 15 sent forward from the hopper 17 are distributed almost equally to the respective chutes s.

As shown in FIG. 3, a distributing device 23 is provided in the magazine 20 for each of the chutes s in the 12 rows of the first chute section 19. The magazine 20 temporarily stops the chip type capacitor 15 sent from the first chute portion 19 and distributes the chip type capacitor 15 to the further second chute portion 21 by the distribution device 23. . The second chute portion 21 is composed of 120 rows of chutes s extending in the width direction and on a horizontal plane, and is formed so that the downstream side is inclined downward. These shoots s groups are divided every ten rows.
For each of the 12 rows of shoots s of the first chute section 19, the shoots s of the second chute section 21 are allocated in order of 10 rows. Then, the chip type capacitors 15 sent from the respective chutes s of the first chute section 19 are distributed by the distribution device 23 of the magazine 20 to the second chute s.
Are equally distributed to the 10 rows of chutes s of the chutes 21. The chip-type capacitor 15 sent to the second chute portion 21 flows downstream due to its inclination. At the front end (downstream side) of the second chute 21, there is formed a weir 24 as a positioning means extending straight in the left-right direction for damping the chip type capacitor 15. The upper end of the second chute 21 is open so that the chip type capacitor 15 in contact with the weir 24 is exposed.

The heating furnace 13 is provided in front of the condenser supply device 12. The heating furnace 13 is the housing 3
0 and a drum 31 housed in a housing 30. The outer shape of the housing 30 is formed by a pair of substantially disk-shaped side plates 32 disposed to face each other on the left and right sides, and a band plate 33 connected to the both side plates 32 formed along the circumference of the both side plates 32. The housing 30 is fixed while being mounted on a base 35. A heat insulating material (not shown) is attached to the inner surface of the housing 30 to prevent heat from escaping to the outside. The housing 30 has an opening at a rear portion facing the capacitor supply device 12 side, and an exposed portion 36 is formed. A discharge gutter 37 extending obliquely downward to the rear side of the base 35 is formed below the exposed portion 36. The discharge gutter 37 extends in the left-right direction corresponding to the width of the strip 33 of the drum 31. At the lower end of the discharge gutter 37, a storage box 38 for receiving the discharged processed chip type capacitor 15 is provided.

As shown in FIG. 4, a partition wall 40 for partitioning the internal space of the housing 30 is formed in the housing 30 along the strip 33. A pair of hot air circulation devices 41 and 42 are disposed near the upper and lower ends 40 a and 40 b of the partition wall 40 and at upper and lower positions of the housing 30. A blower fan 43 is provided inside the hot air circulation devices 41 and 42.
And a heater 44, so that hot air circulates between the inner peripheral side and the outer peripheral side of the partition wall 40.

More specifically, as shown in FIG. 4, a blowing fan 43
Is disposed, and a heater 44 is disposed on the rear side. The upper end 40 a of the partition 40 is located near the middle between the blower fan 43 and the heater 44. In the hot air circulation device 42 at the lower position, a blower fan 43 is provided on the rear side, and a heater 44 is provided on the front side. And
The lower end 40 b of the partition 40 is located near the middle between the blower fan 43 and the heater 44. The air blown from each blower fan 43 passes through the heater 44 and is emitted as hot air. In such a configuration, the hot air discharged from the hot air circulation device 41 at the upper position passes through the inner peripheral side of the partition wall 40 and reaches the hot air circulation device 42 at the lower position. On the contrary, the hot air discharged from the hot air circulation device 42 at the lower position passes through the outer peripheral side of the partition wall 40 and reaches the hot air circulation device 41 at the upper position. Therefore, the hot air circulates on the inner peripheral side and the outer peripheral side with the partition wall 40 interposed therebetween, and heats the chip condenser 15 set on the outer periphery of the drum 31. A cooling device 45 is provided behind the hot air circulation device 41 at the upper position. Inside the cooling device 45, a blower fan 46 for cooling the chip type capacitor 15 which has been subjected to the heat treatment is disposed.

As shown in FIG. 2, the drum 31 is
8 and a pair of jig mounting wheels 49 mounted on the rotating shaft 48. A rotary shaft 48 of the drum 31 is rotatably supported by a pair of side plates 32 of the housing 30 via a bearing 50. A first gear 51 is mounted near the right bearing 50 of the rotating shaft 48. First
Gear 51 is a motor 52 provided in the base 35.
And transmits the rotational force of the motor 52 to the drum 31. A rotary disk 56 is fixed to the rotary shaft 48 near the left bearing 50. A fixed disk 57 fixed to the side plate 32 of the housing 30 is provided outside the rotating disk 56. Electrodes (not shown) of the fixed disk 57 are supplied with power from an external power supply unit 80 (see FIG. 8). First and second current collecting brushes 58, 59 are mounted on the rotating disk 56, and both current collecting brushes 58, 59 are always in contact with both positive and negative electrodes of the fixed disk 57, respectively. . Therefore,
The rotating disk 56 rotates while the current collecting brushes 58 and 5 rotate.
9, the power is always supplied from the electrode of the fixed disk 57.

The pair of right and left jig mounting wheels 49 are provided.
And a plurality of jigs 55
Are mounted at equal intervals in the circumferential direction of the drum 31 (FIG. 1). Hereinafter, in the description of the jig 55, the vertical direction in FIGS. As shown in FIGS.
5 includes left and right jig bodies 60a, 60b and levers 61A,
61B and holders 62A and 62B. As shown in FIG. 7, the left and right jig main bodies 60a and 60b are disposed to face the left and right jig mounting wheels 49, respectively.
An engagement groove 64 is formed at the lower end of each jig body 60a, 60b, and the jig body 60a, 60b engages the engagement groove 64 with a positioning pin 65 on the jig mounting wheel 49 side. In this state, it is fixed to the wheel 49 by bolts 66. A pair of levers 61A, 61B are provided on each of the jig bodies 60a, 60b. A pair of levers 61A and 61B opposed to each other in the front-rear direction are rotatably attached by pins 67, respectively. A coil spring 69 is mounted near the lower ends of both levers 61A and 61B, and biases the lower ends of both levers 61 in a direction to attract each other. A roller 70 is mounted in the middle of both levers 61A and 61B.

As shown in FIG. 5 to FIG.
A jig opening / closing cam 71 is mounted at the center of a and 60b. The cam 71 has a deformed propeller shape and is rotatably supported by a cam shaft 72.
The cam 71 overcomes the urging force of the coil spring 69, abuts against the roller 70 of the levers 61A, 61B, and pushes the levers 61A, 61B outward from each other. ) And the second turning position (the state shown in FIG. 5) in which the levers 61A and 61B approach each other due to the urging force of the coil spring 69. A substrate holder 74 extending in the left-right direction is fixed to the left and right jig mounting wheels 49 by bolts (not shown). A substrate 75 is mounted on the substrate holder 74.

As shown in FIG. 7, the holders 62A, 62A
2B, a front holder 62A (right side in FIGS. 5 and 6) is a pair of left and right front levers 61A.
Meanwhile, the rear holder 62B (the left side in FIGS. 5 and 6) is suspended between a pair of rear levers 61B disposed on the left and right. Both holders 62A and 62B are provided with the substrate 7
5, the levers 61A,
It is operated with opening and closing of 61B. Both holders 62
A and 62B can hold the chip-type capacitor 15 when the cam 71 is in the first rotation position.

At the upper end of the rear holder 62B, 120 common electrodes 77 for applying a voltage to the chip type capacitor 15 are fixed at predetermined intervals. The common electrode 77 is electrically connected to the first current collecting brush 58. On the other hand, 120 individual electrodes 78 are arranged on the front holder 62A at predetermined intervals corresponding to the positions of the common electrodes 77. The individual electrode 78 is formed of a leaf spring, and clamps the chip type capacitor 15 at the first rotation position of the levers 61A and 61B while urging the chip type capacitor 15 toward the common electrode 77 side. The individual electrode 78 is electrically connected to the second current collecting brush 59. These common electrodes 77
And the individual electrode 78 is connected to the 120 of the second chute 21.
It is arranged directly opposite the chute s in the row.

As shown in FIGS. 5 to 7, holders 62A,
A heat insulating cloth 80 is provided on the upper surface of the holder 62B.
It is arranged so that it covers. The heat insulating cloth 80 protects the inside of the disposition position, that is, the inside of the jig 55 and the inside of the drum 31 from transmitting heat, and is made of a material having heat insulating properties, airtightness and heat resistance. In such a jig 55, the end of the cam shaft 72 is
5 just arrives at the supply position where the supply of the chip type capacitor 15 from the capacitor supply device 12 is received, the drive shaft 79 a protruding into the housing 31 from the cam shaft drive device 79 disposed in the base 35. Are engaged (FIG. 2). Then, the cam shaft 72 of the jig 55 is rotated, so that the holders 62A and 62B in the expanded state of FIG. 5 are changed to the closed state of the holders 62A and 62B in FIG. Similarly, when the jig 55 goes around the inside of the housing 31 and reaches the exposed portion 36, the cam shaft 72 is rotated by the cam shaft driving device (not shown), and the jig 55 is turned from the state of FIG. In the state of 5, the chip type capacitor 15 is discharged. 5 and 6 of this embodiment show the jig 55 from the left side. Therefore, only the jig body 60a and the left lever 61A are shown, but in the jig 55 from the right side not shown, the right jig body 60b and the right lever 61B are symmetrical to FIGS. 5 and 6. It is manifested.

Next, the electrical configuration of the jig 55 will be described with reference to FIG. Each jig 55 is divided into a first station m and a second station n. No. 1 in the first station m. Sixty application circuits for aging the 1 to 60 chip capacitors 15 are arranged in parallel. Similarly, in the second station n, No. Sixty application circuits for aging the chip capacitors 61 to 120 are arranged in parallel. No. The chip capacitors 15 of 1 to 120 are the shoots s of the second shoot section 21.
It corresponds to a number. First station m and second station
Is connected to the station n by a relay cord 81. Each application circuit is provided with a common electrode 77, an individual electrode 78, and a resistor R for generating a circuit current.
Chip type capacitor 1 sandwiched between both electrodes 77 and 78
5 is sandwiched between circuits, and a voltage is applied to perform an aging process. The electric current supplied from the power supply unit 80 is sent to the electrodes (not shown) of the fixed disk 57 and is transmitted from the first and second current collecting brushes 58 and 59 of the rotating disk 56 to the relay cord 82.
Is distributed to each circuit via

Next, the vacuum finger device 14 will be described. As shown in FIG. 1, FIG. 2 and FIG.
And the heating furnace 13. The vacuum finger device 14 has a pair of left and right frames 85 and a rotation shaft 86 rotatably supported between the two frames 85. A pair of cams 89 are mounted on both ends of a rotating shaft 86 protruding outward from both frames 85 so as to be integrally rotatable with the rotating shaft 86. A cylinder 87 is arranged on the side of the left frame 85. A piston rod 88 extending upward from the cylinder 87 is pivotally mounted on a left cam 89 fixed to an end of the rotation shaft 86 (FIG. 9). As a result, when the cylinder 87 is driven and the piston rod 88 moves up and down, the cam 89 rotates by following this elevating movement,
The rotation shaft 86 is rotated. A stopper 90 protrudes from the outer surface of the left frame 85 on the side of the cam 89. In FIG. 10, when the cam 89 rotates clockwise, it abuts against the stopper 90 and further rotation is prevented.

As shown in FIG. 9, holders 91 are mounted at the center of the rotating shaft 86 and at three positions near the left and right frames 85, and can be integrally rotated with the rotating shaft 86. Holder 9
Numeral 1 has a bent portion 91a whose front end is bent at a right angle. A vacuum nozzle 92 and a nozzle cylinder 93 are disposed on the bent portion 91a via a spacer 99. The vacuum nozzle 92 is fixed to a small holder 96 mounted on the LM guide 95 via a slider 94 so as to be able to advance and retreat. The vacuum nozzle 92 is connected to the second chute 2.
One hundred 120 chutes s are arranged in a row in a row corresponding to 120 chutes s. Each vacuum nozzle 92 is connected to an external vacuum pump 97 (see FIGS. 1 and 2).
The tip of the piston rod 98 of the nozzle cylinder 93 is connected to the small holder 96. As a result, when the nozzle cylinder 93 is driven, each vacuum nozzle 92 moves forward and backward along with the slider 94 along the LM guide 95.

Next, the first embodiment configured as described above
The operation of the aging device 11 will be described. The aging device 11 according to the first embodiment is controlled by a control device (not shown). The chip-type capacitors 15 sent downstream from the hopper 17 are firstly distributed in 12 rows by the first chute 19, and stay in the magazine 20. Then, the chip type capacitors 15 in each row are evenly distributed to the divided sections of the second chute section 21, that is, the chute s in 10 rows by the distribution device 23 in the magazine 20. As a result, one of the second chute portions 21
A chip type capacitor 1 is almost evenly distributed over 20 rows of chutes s.
5 are dispensed. The chip-type capacitors 15 on the second chute portion 21 are sequentially sent to the downstream side, and the leading chip-type capacitors 15 are in contact with the weir 24 and are arranged in a horizontal line. The process until the chip type capacitors 15 are sent out from the hopper 17 and abut on the weir 24 to be aligned in a horizontal line corresponds to an alignment process and an alignment process.

Then, the leading chip type capacitors 15 arranged along the weir 24 are sucked by the vacuum finger device 14. As shown in FIG. 11, the vacuum nozzle 92 is disposed above the first chip type capacitor 15 on the second chute 21. This state is defined as the origin position. At this origin position, as shown in FIG. 12, the nozzle cylinder 93 is driven, and the vacuum nozzle 92 advances downward along the LM guide 95 and stops immediately before the chip-type capacitor 15. Then, the vacuum pump 97 is driven to suck the chip-type condenser 15 into the vacuum nozzle 92. With the completion of the suction, the vacuum nozzle 92 retreats, and returns to the state shown in FIG.
At the tip of the vacuum nozzle 92, a chip type capacitor 15 is provided.
Is sucked). The case where the holder 91 is at the position shown in FIGS. 11 and 12 corresponds to the first position described in the claims.

Next, the cylinder 87 of the vacuum finger device 14 is driven to rotate the rotation shaft 86 via the piston rod 88 and the cam 89. In FIG. 13, when the holder 91 rotates substantially 90 degrees counterclockwise around the rotation shaft 86, the cam 89 contacts the stopper 90 and the rotation of the rotation shaft 86 is prevented. In this state, the tip of the vacuum nozzle 92 faces the exposed portion 36 of the heating furnace 13.

Next, as shown in FIG. 14, the nozzle cylinder 93 is driven, and the vacuum nozzle 92 advances along the LM guide 95 to transfer the chip type capacitor 15 to the jig 55. More specifically, as shown in FIG.
The state where the front and rear holders 62A and 62B are expanded (the cam 7
The vacuum nozzle 92 advanced in the direction of the jig 55 in a state where 1 is at the second rotation position) moves the chip type capacitor 15 at the tip thereof to the substrate 75 between the holders 62A and 62B.
Contact the tip. In this position, the camshaft 72 mounted on the jig 55 is rotated by the camshaft driving device 79, and the cam 71 is brought to the second rotation position (the state shown in FIG. 6). That is, the chip type capacitor 15 is held between the holders 62A and 62B.

Then, the vacuum pump 97 stops, and the suction of the vacuum nozzle 92 to the chip type condenser 15 is released. With the release of suction, the vacuum nozzle 92 retreats and returns to the state of FIG. 13 (however, there is no chip-type capacitor 15 at the tip of the vacuum nozzle 92). The case where the holder 91 is at the position shown in FIGS. 13 and 14 corresponds to the second position described in the claims. Then, in preparation for the delivery of the chip-type capacitor 15 to the next jig 55, the holder 91 is again rotated clockwise substantially 90 degrees around the rotation shaft 86 to the original position (the position in FIG. 11).
To return to. Hereinafter, the chip type capacitor 15 is delivered to the jig 55 by repeating these operations. The process of sucking the leading chip-type capacitor 15 on the second chute portion 21 by the vacuum nozzle 92 and delivering the chip-type capacitor 15 to the jig 55 corresponds to a delivery step.

The chip-type condenser 15 delivered to the jig 55 circulates in the heating furnace 13 as the drum 31 rotates. A heating process is performed in the heating furnace 13 and a voltage is applied from the common electrode 77 and the individual electrode 78 to perform an aging process. The jig 55 holding the processed chip-type capacitor 15 is cooled by the cooling device 45 at a position substantially around the circumference (FIG. 2), and then exposed again.
Leads to. Then, the cam 7 is driven by a cam shaft driving device (not shown).
The one cam shaft 72 is rotated, and both levers 61A and 61B are in the first rotation position (the state of FIG. 5). Then, both holders 62A and 62B are expanded, and the processed chip type capacitor 15 falls, flows through the discharge gutter 37, and enters the storage box 38.
Is stored in.

With this configuration, the first embodiment has the following advantages. The chip type capacitor 15 stored in the hopper 17 of the capacitor supply device 12
The chip capacitors 15 at the top of each chute s are almost evenly distributed to the 20 rows of chute s, and finally the top chip capacitors 15 of the chute s abut on the weir 4 and are aligned in a horizontal row. Then, since the 120 chip capacitors 15 can be delivered to the jig 55 at once by the vacuum finger device 14,
It is possible to apply heat treatment and aging treatment to a large number of chip capacitors 15 at one time. Therefore, the manufacturing cost of the chip capacitor 15 is greatly reduced. The chip type capacitors 15 randomly stored in the hopper 17 are sent to the downstream side to be aligned in a horizontal line with the second chute 21. And the vacuum finger device 14
The chip-type capacitor 15 is transferred to the jig 55 in the heating furnace. During this time, a large amount of chip-type capacitors 15 can be set on the jig 55 without any manual operation, so that labor costs can be reduced and stable work can be performed because no manual operation is required.

The vacuum finger device 14 is disposed between the condenser supply device 12 and the heating furnace 13.
Capacitor supply is achieved by simply rotating the holder 91 between the original position (the position shown in FIG. 11) and a position (position shown in FIG. 13) substantially 90 degrees from the original position (the position shown in FIG. 13). Chip type capacitor 1 from device 12 to heating furnace 13
5 can be delivered. Therefore, the delivery mechanism of the chip type capacitor 15 can be simple and small,
The structure of the entire device is also simplified. The jig 55 is disposed on the outer periphery of the drum 31.
The jig 55 rotates around with the rotation of.
Since the exposed portion 36 is used as an inlet and an outlet, the size of the apparatus can be reduced.

(Embodiment 2) FIGS. 4 to 10 and 13
Embodiment 2 will be described with reference to FIG. In the description, a description of the same configuration as that of the first embodiment will be omitted. In the second embodiment, a configuration different from the first embodiment will be mainly described. As shown in FIG. 15, the aging device 11 includes a capacitor supply device 112 serving as an alignment unit.
, A heating furnace 13, and a vacuum finger device 14 as a delivery means. Since the description of the heating furnace 13 and the vacuum finger device 14 is the same as that of the first embodiment, the same reference numerals as those of the first embodiment are used in the drawings and the description thereof will be omitted.

As shown in FIG. 15, the capacitor supply device 112 includes a hopper 17 for storing the chip type capacitor 15.
, A chute 114, a pocket holder 115, and an insertion device 116. As shown in FIG. 20, the chute portions 114 are formed in two rows, and the chip type capacitors 15 in the hopper 17 are sent out downstream through the chute portion 114 as a passage and delivered to the insertion device 116.

The insertion device 116 is offset from the hopper 17. Post 11 of insertion device 116
A housing 118 is supported on the upper part of the housing 7. FIG.
As shown in (1), a first cylinder 120 for moving the first piston rod 119 forward and backward (Y direction) is provided in the housing 118. First piston rod 1
A pair of vacuum nozzles 122 are attached to the front end of the lower part 19 via a frame 121 in a downward direction. Both nozzles 1
Numeral 22 sucks the chip-type capacitor 15 at the head of the chute 114 by a vacuum pump (not shown). As shown in FIG. 20, a second cylinder 126 for moving the second piston rod 125 up and down (X direction) is provided in the housing 118. Second
The first cylinder 120 is fixed to the tip (lower end) of the piston rod 125. As a result, by driving the first and second cylinders 120 and 126, the vacuum nozzle 122 can move up and down and up and down three-dimensionally. A rotary encoder 124 is provided on the side of the housing 118, and detects the number of times the chip type capacitor 15 has been transferred to the pocket holder 115 of the vacuum nozzle 122.

A pocket holder 115 is provided in front of the insertion device 116. As shown in FIGS. 15 to 17, the pocket holder 115 is a long rectangular plate, and has a two-layer structure of an upper plate 128 and a lower plate 130. The upper plate 128 has a pocket 127 formed of a concave portion that is opened upward. The lower plate 130 is formed with 120 passages 129 for sucking the chip type capacitors 15 loaded in the pockets 127. The pocket holder 115 is placed on the holder 131 with the pocket 127 facing upward. Chip type capacitor 15 is pocket 1
27, the passage 1 of the lower plate 130 is loaded.
It is sucked to the holder 115 side by a vacuum pump (not shown) through the passage 29 of the holder 29 and the holder 132. The holder 131 can be smoothly moved in the left-right direction on the LM guide 134 via the slider 133.
31 is driven by a servomotor 135. Incidentally, photoelectric sensors 137 and 13 for detecting the origin position of the pocket holder 115 and the position directly facing the heating furnace 13.
8 is provided in the base 35.

Next, the second embodiment configured as described above
The operation of the aging device 11 will be described. The aging device 11 of the present embodiment is controlled by a control device (not shown). The chip type condenser 15 in the hopper 17 is sent downstream through the chute 114 and is transferred to the pocket holder 115 side by a pair of vacuum nozzles 122 of the insertion device 116. As shown in FIGS. 19 and 20, the chip type capacitor 15 at the head of the chute 114 at the origin position is connected to a pair of vacuum nozzles 12.
When two nozzles are simultaneously sucked by the nozzle 2, the vacuum nozzle 122 is raised in the X direction. At the same time, the vacuum nozzle 122 is advanced in the Y direction and lowered again in the X direction. As a result, the chip capacitor 15 is moved to a position above the pocket 127 of the pocket holder 115 (the position indicated by the dashed line in FIG. 19).

The pocket 127 of the pocket holder 115 is in a suction state by a vacuum pump (not shown), and the suction of the vacuum nozzle 122 with respect to the chip type capacitor 15 is released. Is loaded inside. Thereafter, the vacuum nozzle 122 is driven in the reverse direction and returns to the home position, and the rotary encoder 124 detects the reciprocation of the vacuum nozzle 122 (reciprocation of the first piston rod 119), and based on the detection result, the servo motor 135 is a pocket holder 115
Is moved rightward (toward the heating furnace 13) by one pitch. The vacuum nozzle 122 that has returned to the origin position repeats the operation of transferring the chip-type capacitor 15 to the pocket holder 115 side by side again, and when the transfer operation has been completed 60 times, the pocket 127 of the pocket holder 115 is completed.
120 chip-type capacitors 15 are arranged in a horizontal line. The chip type capacitor 1
Until 5 is aligned, it corresponds to the alignment step. Next, the pocket holder 115 is immediately moved rightward (toward the heating furnace 13) to face the heating furnace 13. 12 pockets at the same time
The suction to the chip type capacitor 15 in 7 is released. Until the pocket holder 115 in which the chip-type capacitors 15 are aligned is directly opposed to the heating furnace 13, this corresponds to an arrangement step.

Next, the chip type capacitors 15 arranged in the pocket 127 of the pocket holder 115 are sucked by the vacuum finger device 14. As shown in FIG. 21, the vacuum nozzle 92 is connected to the pocket holder 11.
5 above. This state is defined as the origin position. As shown in FIG. 22, the nozzle cylinder 93 is driven, and the vacuum nozzle 92 advances downward along the LM guide 95 and stops immediately before the chip capacitor 15. Then, the vacuum pump 97 is driven to suck the chip-type condenser 15 into the vacuum nozzle 92.
Upon completion of the suction, the vacuum nozzle 92 retreats, and returns to the state of FIG. 21 (however, the tip-type condenser 15 is suctioned at the tip of the vacuum nozzle 92).
The case where the holder 91 is at the position shown in FIGS. 21 and 22 corresponds to the first position described in the claims.

Next, the cylinder 87 of the vacuum finger device 14 is driven to rotate the rotation shaft 86 via the piston rod 88 and the cam 89. In FIG. 13, when the holder 91 rotates substantially 90 degrees counterclockwise around the rotation shaft 86, the cam 89 contacts the stopper 90 and the rotation of the rotation shaft 86 is prevented. In this state, the tip of the vacuum nozzle 92 faces the exposed portion 36 of the heating furnace 13.

Next, as shown in FIG. 14, the nozzle cylinder 93 is driven, and the vacuum nozzle 92 advances along the LM guide 95 to transfer the chip type capacitor 15 to the jig 55. This transfer operation is the same as in the first embodiment, and a description thereof will be omitted. When the delivery is completed, the state returns to the state of FIG. 13 (however, there is no chip-type capacitor 15 at the tip of the vacuum nozzle 92). The case where the holder 91 is at the position shown in FIGS. 13 and 14 corresponds to the second position described in the claims. Then, in preparation for the delivery of the chip type capacitor 15 to the next jig 55, the holder 91 is again rotated clockwise approximately 90 degrees around the rotation shaft 86 to return to the original position (the position in FIG. 11). .
Hereinafter, the chip type capacitor 15 is delivered to the jig 55 by repeating these operations. The vacuum nozzle 92 sucks the first chip type capacitor 15 on the second chute portion 21, and the chip type capacitor 1 is sucked.
The process up to delivery of 5 to the jig 55 corresponds to a delivery process. Further, the subsequent operation of the chip type capacitor 15 transferred to the jig 55 is also the same as that of the first embodiment, and therefore will not be described.

With the above configuration, the second embodiment has the following effects. In the capacitor supply device 112, the insertion device 116 securely arranges and arranges the pockets 115 in the pockets 127 of the pocket holder 115, and the pocket holder 115 is directly opposed to the heating furnace 13 to receive 120 chip capacitors 15 at once at the jig 55. Since it is possible to pass the heat treatment, it is possible to apply heat treatment and aging treatment to a large amount of chip type capacitors 15 at a time. Therefore, the manufacturing cost of the chip capacitor 15 is greatly reduced. When the chip type capacitor 15 is transferred from the insertion device 116 to the pocket holder 115 side, the capacitor 15 is sucked from the pocket 127 side, so that the capacitor 15 can be surely loaded into the pocket 127. In addition, the effects of and in the first embodiment are similarly obtained in the second embodiment.

(Embodiment 3) FIGS. 4 to 10, FIG.
Embodiment 3 will be described with reference to FIGS. 14, 16 to 18, and 21 to 25. In the description, the description of the same configuration as the first and second embodiments will be omitted. In the third embodiment, a configuration different from the first and second embodiments will be mainly described. As shown in FIG. 23, the aging device 11 includes a condenser supply device 142 as an alignment unit, a heating furnace 13, and a vacuum finger device 14 as a delivery unit. Heating furnace 13
Since the description of the vacuum finger device 14 is the same as that of the first embodiment, the same reference numerals as those in the first embodiment are used in the drawings and the description thereof will be omitted.

As shown in FIG. 23, the capacitor supply device 142 includes a hopper 17 for storing the chip type capacitor 15.
, A chute 143, a pocket holder 115, and an insertion table 144. The chip type condenser 15 in the hopper 17 is sent to the downstream side through the chute 143 as a passage. As shown in FIG. 24, the chip type capacitor 15 at the front end of the chute portion 143 is arranged on the insertion table 144. The insertion table 144 is made to perform a predetermined intermittent rotation by an index mechanism 145 below the table 144. On the insertion table 144, four vacuum nozzles 146 that rotate integrally with the insertion table 144 are arranged supported by a holder (not shown). Each vacuum nozzle 146 is disposed on the insertion table 144 so as to be displaced by 90 degrees with respect to each other, and is moved up and down by a lifting mechanism (not shown). A pocket holder 115 is provided above and in front of the insertion table 144 so as to intersect with the table 144.
Are arranged. Since the pocket holder 115 has the same configuration as that of the second embodiment, the description is omitted. FIG.
As shown in FIGS. 4 and 25, the vacuum nozzle 146 performs the suction operation of the chip type capacitor 15 at the position A, and rotates clockwise in FIG. 25 to deliver the capacitor 15 to the pocket holder 115 at the position C. . The insertion table 14 is provided in the index mechanism 145.
4 is provided with a rotary encoder 148 for detecting the amount of rotation.

Next, the third embodiment configured as described above
The operation of the aging device 11 will be described. The aging device 11 of the present embodiment is controlled by a control device (not shown). The chip-type condenser 15 in the hopper 17 is sent to the downstream side through the chute portion 143, and is sucked by the vacuum nozzle 146 in which the leading chip-type condenser 15 is lowered at the position A as shown in FIG. Vacuum nozzle 14 adsorbing condenser 15
6 rises again and moves to the position B according to the intermittent rotation of the insertion table 144. On the other hand, the vacuum nozzle 146 located at the position D moves to the position A and performs the suction operation of the next chip type capacitor 15.

The vacuum nozzle 146 further moved from the position B to the position C descends and releases suction. Then, the chip type capacitor 15 becomes the pocket holder 115.
Is sucked into the pocket 127 and is loaded into the pocket 127. When the intermittent rotation of the insertion table 144 is detected by the rotary encoder 148, the servo motor 135 moves the pocket holder 115 rightward (toward the heating furnace 13) by one pitch based on the result. Then, the operation of transferring the chip type capacitor 15 to the pocket holder 115 side by side with the intermittent rotation of the insertion table 144 is repeated one after another, and when the transfer operation of 120 times is completed, the chip type capacitors 15 are horizontally aligned in the pocket 127 of the pocket holder 115. The capacitors 15 are aligned. The process until the chip capacitors 15 are aligned with the pocket holder 115 corresponds to an alignment process. Next, the pocket holder 11
5 is immediately moved to the right (toward the heating furnace 13) to face the heating furnace 13. At the same time, the suction for the chip type capacitor 15 in the pocket 127 is released. In the third embodiment, the process until the pocket holder 115 faces the heating furnace 13 corresponds to the disposing step. Subsequent operations are the same as in the second embodiment, and will not be described.

With such a configuration, the following effects are obtained in the third embodiment. In the capacitor supply device 142, the insertion table 144 ensures that the pocket holders 115 are aligned with the pockets 127 of the pocket holder 115, and the pocket holder 115 is directly opposed to the heating furnace 13.
5 can be transferred to the jig 55, so that a large amount of chip type capacitors 15 can be subjected to heat treatment and aging at one time. Therefore, the manufacturing cost of the chip capacitor 15 is greatly reduced. The insertion table 144 can transfer the chip-type capacitor 15 to the pocket holder 115 without taking up space, so that the overall size of the device 11 can be reduced. Further, unlike the delivery of the chip type capacitor 15 to the pocket holder 115 by the reciprocating motion as in the second embodiment, the delivery is performed by the rotation motion, so that the speed of the delivery operation can be relatively easily performed. . In addition, the effects of and in the first embodiment are similarly obtained in the third embodiment.

The present invention can be embodied with the following modifications. In the capacitor supply device 12 of the first embodiment, the first chute portion 19 and the second chute portion 21 are divided, and the magazine 20 is interposed therebetween to distribute the chip type capacitors 15 to the second chute portion 21. Was configured to be. However, it does not matter if the chip type capacitors 15 can be arranged on the downstream side even if they are not separated in this way. In the first embodiment, the number of shoots s of the second chute unit 21 is 120, but the number of shoots is not limited to 120. Further, the chip type capacitors 15 arranged at the ends of the 120 rows of chutes s do not have to be arranged in a horizontal row, and may not be arranged in a straight line. Further, the interval between the chip capacitors 15 may not be constant. In short, it is only necessary that the lines are arranged according to a certain rule so that they can be collectively adsorbed by the vacuum finger device 14. A plurality of chip-type capacitors 15 may be aligned using a robot instead of the capacitor supply device 12.

In each of the above embodiments, the delivery and discharge of the chip type capacitor 15 are performed from the exposed portion 36 which is both the inlet and the outlet. However, they may be provided separately. In the first embodiment, the weir 24 at the tip of the second chute 21 faces the jig 55, and the chip type capacitor 15
Are brought into contact with the weir 24 to be aligned and arranged at the same time. However, another arranging means may be used, for example, the chip type capacitors 15 arranged in contact with the weir 24 may be arranged facing the jig 55 by another arranging means. In each of the above embodiments, the chip type capacitor 15 is arranged on the outer periphery of the drum 31, and the drum 31 rotates in the heating furnace 13 to heat the outer periphery of the drum 31. However, a heating furnace provided with a jig 55 that can hold the chip-type condenser 15 without using a drum rotating type as described above can be applied. Each of the above vacuum nozzles 9
Instead of 2, 122 and 146, the chip type capacitor 15 may be sandwiched between a suction cup or a finger. -The chute part 114 of Embodiment 2 may be three or more rows, or may be a single row. -The number of the vacuum nozzles 146 in the third embodiment may be five or more, or may be three or less. In the second and third embodiments, the pockets 127 of the pocket holder 115 are arranged in one horizontal row, but may be two or more rows. Also, it is not necessary to align them exactly in a straight line. In addition, the present invention can be freely implemented without departing from the gist of the present invention.

[0049]

[Brief description of the drawings]

FIG. 1 is a schematic side view of an aging device according to a first embodiment of the present invention.

FIG. 2 is a plan view of the first embodiment.

FIG. 3 is an explanatory diagram illustrating an outline of a capacitor supply device according to the first embodiment.

FIG. 4 is an explanatory diagram illustrating a drum according to each embodiment.

FIG. 5 is a side view of the jig of each embodiment.

FIG. 6 is a side view of the jig of each embodiment.

FIG. 7 is a front view of the jig of each embodiment.

FIG. 8 is a block diagram illustrating a power supply state to a jig according to each embodiment.

FIG. 9 is a front view of the vacuum finger device of each embodiment.

FIG. 10 is a side view of the vacuum finger device of each embodiment.

FIG. 11 is a side view of a main part of the vacuum finger device according to the first embodiment.

FIG. 12 is a side view of a main part of the vacuum finger device according to the second embodiment.

FIG. 13 is a side view of a main part of the vacuum finger device of each embodiment.

FIG. 14 is a side view of a main part of the vacuum finger device of each embodiment.

FIG. 15 is a plan view of the second embodiment.

FIG. 16 is a partial side view illustrating the pocket holders of the second and third embodiments.

FIG. 17 is a partial plan view of the pocket holder according to the second and third embodiments.

FIG. 18 is a partial side sectional view of the pocket holder according to the second and third embodiments.

FIG. 19 is a schematic side view illustrating the insertion device according to the second embodiment.

FIG. 20 is a schematic front view illustrating the insertion device according to the second embodiment.

FIG. 21 is a side view of a main part of the vacuum finger device according to the second and third embodiments.

FIG. 22 is a side view of a main part of the vacuum finger device according to the second and third embodiments.

FIG. 23 is a plan view of the third embodiment.

FIG. 24 is a schematic side view illustrating an insertion table according to the third embodiment.

FIG. 25 is a schematic plan view illustrating an insertion table according to the third embodiment.

FIG. 26 is a perspective view illustrating a conventional jig.

[Explanation of symbols]

11: Aging device, 12, 112, 142: Arrangement means, condenser supply device as alignment means, 13: Heating furnace,
14 ... Vacuum finger device as delivery means, 15
.., A chip-type capacitor, 21... A second chute portion serving as an arrangement means, 36.
55: a jig as a holding means, 114: a chute portion as a positioning means, 115: a pocket holder as a positioning means, 116: an insertion device as a positioning means, 143: a chute portion as a positioning means, 144: an insertion table as a positioning means .

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[Procedure amendment]

[Submission date] January 29, 1998

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Claims

[Correction method] Added

[Correction contents]

[Claims]

Claims (4)

[Claims] An aging process by applying a voltage and applying a voltage to the chip-type capacitors while holding the plurality of chip-type capacitors by a holding means in a heating furnace for a predetermined time, and thereafter performing the processing outside the heating furnace. An aging method for a chip-type capacitor for discharging the chip-type capacitor, comprising: an alignment step of aligning a plurality of chip-type capacitors before processing at a predetermined interval; An aging method for a chip-type capacitor, comprising: an arranging step of arranging; and a delivery step of collectively transferring a plurality of chip-type capacitors arranged and arranged facing the holding means to the holding means. 2. A plurality of chip-type capacitors are held by holding means in a heating furnace, and the chip-type capacitors are subjected to an aging treatment by applying a voltage and a voltage to the chip-type capacitors. Aging device for a chip-type capacitor that discharges a plurality of chip-type capacitors that are randomly stored in a storage unit and that are unprocessed while being diffused in the width direction and sends out a predetermined amount in the width direction on the downstream side. Aligning means for arranging the plurality of chip-type capacitors arranged at the same interval, arranging means for arranging the plurality of chip-type capacitors arranged to face the holding means, and receiving the plurality of chip-type capacitors arranged at the same time collectively by the holding means. A chip-type capacitor aging device, comprising: 3. The delivery means holds a plurality of chip-type capacitors arranged and arranged by the arrangement means at a first position and collects the chip capacitors at a second position rotated and displaced from a first position. 3. The aging device for a chip type capacitor according to claim 2, wherein the aging device is transferred to a holding unit in a heating furnace. 4. The holding means performs processing of the chip-type capacitor while moving around the inside of the heating furnace, and discharges the chip-type capacitor at an outlet which also serves as an inlet when the holding means holds the chip-type capacitor. 4. The aging device for chip type capacitors according to claim 2, wherein the holding is released and the chip type capacitors are discharged outside the furnace.