JPH1195245A - Method for packaging liquid crystal display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To lower the connection resistance between the electrodes of a first substrate and the electrodes of a second substrate and to enhance the adhesive power of the first substrate with the second substrate in packaging of a liquid crystal display device. SOLUTION: At the time of connecting the first substrate 11 having the plural electrodes 15 and the second substrate 12 having the plural electrodes 16 via an anisotropic conductive film 14 contg. conductive particles, the anisotropic conductive film having a film thickness A satisfying the relation A-ϕ≈(B+C).(P-W)/P is used for the anisotropic conductive film 14 when the thickness of the electrodes 15 of the first substrate 11 is defined as B, the thickness of the electrodes 16 of the second substrate 12 as C, the diameter of the conductive particles incorporated in the anisotropic conductive film 14 as ϕ, the width of the electrodes 15 of the first substrate 11 and the width of the electrodes 16 of the second substrate 12 are W and the pitch of the electrodes 15 of the first substrate 11 and the pitch of the electrodes 16 of the second substrate 12 as P.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an anisotropic conductive film formed on a substrate having a plurality of electrodes formed at predetermined intervals.
The present invention relates to a method for mounting a liquid crystal display device connected via an (anisotropic conductive adhesive).

[0002]

2. Description of the Related Art Conventionally, for example, TCP is used for a liquid crystal display panel.
When connecting a (Tape Carrier Package), anisotropic conductive film (different) containing (dispersed) conductive particles in either the electrode part of TCP or the lead part of the transparent electrode of the liquid crystal panel. Anisotropic conductive adhesive) is preliminarily pressure-bonded, and thereafter, is further press-bonded under predetermined conditions to make connection.

[0003] Here, the condition of the temporary compression is usually set to a lower temperature and a shorter time at the time of heat sealing than the condition of the main compression. Further, the particle size of the conductive particles dispersed in the anisotropic conductive film (anisotropic conductive adhesive) tends to decrease with the demand for high-density mounting. A conductive particle having a particle diameter of about 1/10 or less of a width of an electrode to be mounted is used.

[0004]

By the way, the thickness of the TCP electrode tends to become thinner with the high-density mounting. The relationship between the particle size of the conductive particles and the thickness of the TCP electrode has become important. However, at present, there is no data that clearly indicates the relationship between the film thickness of the anisotropic conductive film and the particle size of the conductive particles.
The thickness of the TCP electrode tends to be thin,
The relationship between the thickness of the anisotropic conductive film, the particle size of the conductive particles, the thickness of the TCP electrode, and the like, which has not been particularly problematic, has not been established.

The present invention establishes a relationship between the film thickness of an anisotropic conductive film (anisotropic conductive adhesive), the particle size of conductive particles, and the thickness of the electrodes on the first and second substrates. Thereby, the connection resistance between the electrode of the first substrate and the electrode of the second substrate is reduced,
Further, it is another object of the present invention to provide a method for mounting a liquid crystal display device that can increase the adhesive strength between the first substrate and the second substrate.

[0006]

According to a first aspect of the present invention, there is provided a first substrate having a plurality of electrodes formed at predetermined intervals and a first substrate having a plurality of electrodes formed at predetermined intervals. When connecting to a second substrate having a plurality of electrodes through an anisotropic conductive film containing conductive particles, the thickness of the electrode of the first substrate is B, The thickness of the electrode of the second substrate is C, the diameter of the conductive particles contained in the anisotropic conductive film is φ, the thickness of the anisotropic conductive film is A, and the thickness of the first substrate is Electrode width, the second
The width of the electrodes on the substrate is W, the pitch of the electrodes on the first substrate and the pitch of the electrodes on the second substrate are P, respectively.
In this case, the anisotropic conductive film has A-φ に は (B + C) ·
A film having a film thickness A that satisfies the relationship (P−W) / P is used.

According to a second aspect of the present invention, there is provided a liquid crystal display panel having a plurality of transparent electrodes formed at predetermined intervals and a TCP having a plurality of electrode portions formed at predetermined intervals. When electrically connecting via an anisotropic conductive film containing conductive particles, the film thickness of the anisotropic conductive film is A, the diameter of the conductive particles is φ, and TCP
When the thickness of the electrode part is B, the width of the electrode part and the transparent electrode is W, and the pitch of the electrode part and the transparent electrode is P, the A-φ ≒ B · (P-
It is characterized in that a film having a film thickness A satisfying the relationship of W) / P is used.

According to a third aspect of the present invention, there is provided a first substrate having a plurality of electrodes formed at a predetermined interval and a second substrate having a plurality of electrodes formed at a predetermined interval. Are connected to each other via an anisotropic conductive film, a groove or a hole is provided in an electrode of at least one of the first substrate and the second substrate.

Further, according to the present invention, a liquid crystal display panel having a plurality of transparent electrodes formed at predetermined intervals is different from a TCP having a plurality of electrodes formed at predetermined intervals. A mounting method of a liquid crystal display device electrically connected through an isotropic conductive film, wherein a groove or a hole is provided on the TCP electrode or the TCP substrate.

[0010]

Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 are views for explaining an example of a mounting method (heat sealing connection method) of the liquid crystal display device according to the present invention. FIG. 1 is a diagram showing a state before heat sealing, and FIG. 2 is a diagram showing a state after heat sealing.

Referring to FIGS. 1 and 2, in the heat seal connection method of the present invention, a first substrate 11 having a plurality of electrodes 15 formed at a predetermined interval is formed at a predetermined interval. A second substrate 12 having a plurality of electrodes 16 and an anisotropic conductive film containing (dispersed) conductive particles;
When connecting via the (anisotropic conductive adhesive) 14, the thickness of the electrode portion (for example, copper foil electrode portion) 15 of the first substrate 11 is set to B
And an electrode portion (for example, a copper foil electrode portion) 1 of the second substrate 12
6, the diameter of the conductive particles contained in the anisotropic conductive film 14 is φ, the thickness of the anisotropic conductive film 14 is A, the width of the electrodes 15 and 16 is W, When the pitch of the layers 15 and 16 is P, the anisotropic conductive film 14 is characterized in that it has a film thickness A that satisfies the following relationship. That is, it is characterized by combining the parameters so as to satisfy the following equation.

[0012]

[Equation 1] A−φ ≒ (B + C) · (P−W) / P

As described above, by setting the relationship between the film thickness of the anisotropic conductive film, the diameter of the conductive particles, and the thickness of the electrode under predetermined conditions, the electrode 15 of the first substrate 11 and the second substrate It is possible to electrically and physically connect the twelve electrodes 16 with high reliability. That is, the connection resistance between the electrode 15 of the first substrate 11 and the electrode 16 of the second substrate 12 can be reduced, and the adhesive force between the first substrate 11 and the second substrate 12 can be increased. Become.

More specifically, as a determination that the above equation holds,
0.8 × (B + C) · (P−W) /P≦A−φ≦1.2×
When (B + C) · (P−W) / P is satisfied, the effect of the present invention is obtained.
(The above effect) can be further increased.

In the example of FIGS. 1 and 2, the first substrate 1
The first and second substrates 12 are FPCs (Flexible
Printed Circuit (flexible printed circuit board), and these substrates 11 and 12 are connected by heat sealing. More specifically, in the examples of FIGS. 1 and 2, the first substrate 11 and the second substrate 12 are each configured as a liquid crystal display panel having transparent electrodes 15 and 16 formed at predetermined intervals. ing.

Next, the method of heat seal connection in the examples of FIGS. 1 and 2 will be described more specifically. In the example of FIG. 1, heat sealing (thermocompression bonding) is performed such that the first and second two substrates (FPC) 11 and 12 are bonded via the anisotropic conductive film 14. As a result, the state shown in FIG. 2 is obtained. FIG.
FIG. 4 is an enlarged view of the anisotropic conductive film before heat sealing, and FIG.
FIG. That is, FIGS. 3 and 4 show the state of the conductive particles 1 before and after heat sealing.

Referring to FIGS. 3 and 4, a portion of the conductive particles 1 of the anisotropic conductive film (anisotropic conductive adhesive) is sandwiched between the electrode portions 15 and 16 by heat sealing. The anisotropic conductive film (anisotropic conductive adhesive) 14 sandwiched between the opposing electrode portions 15 and 16 is partially covered by the adhesive (including conductive particles). Move towards the part you do not want. At this time, when the thickness A of the anisotropic conductive film (anisotropic conductive adhesive) 14 and the diameter φ of the conductive particles 1 satisfy the relationship of Formula 1, when heat sealing is performed, the electrode portions 15 and 16 facing each other are heated. The existing conductive particles 1 are crushed without applying excessive pressure, and an electrical connection is obtained between the electrode portions 15 and 16 via the conductive particles 1. In addition, since the portions (non-electrode portions) where the electrode portions 15 and 16 are not present are almost filled with the adhesive (including the conductive particles 1), the electrode portions and the non-electrode portions are bonded together, and the connection is physically strong. Will be done. In the non-electrode portion, the conductive particles 1 in the adhesive 14 are not crushed,
It remains in the adhesive state and therefore this part is not conductive.

As described above, by satisfying the relationship of the expression 1, the conductive particles 1 ensure the conduction between the facing electrodes 15 and 16 at the time of heat sealing (electrode 1).
(The connection resistance between the electrodes 5 and 16 can be reduced) and a portion where the electrode portions 15 and 16 are not present (non-electrode portion)
Is substantially filled with the adhesive 14 (including the conductive particles 1), so that the adhesive strength between the two substrates 11 and 12 can be increased (see FIG. 4). That is, by setting the anisotropic conductive film (anisotropic conductive adhesive) 14 to a predetermined film thickness A, the connection resistance between the first substrate 11 and the second substrate 12 is reduced and the adhesive force is maximized. can do.

The anisotropic conductive film (anisotropic conductive adhesive) 1
In the case where the film thickness A of No. 4 does not satisfy Equation 1 (for example, when the film thickness A is too large), the diameter of the conductive particles 1 is equal to or larger than the diameter φ of the conductive particles 1 between the facing electrodes 15 and 16 during heat sealing. Of adhesive (including conductive particles) tends to remain. This is because the facing electrodes 15,
The adhesive is extruded from the space between the electrodes 15 and 16 to a portion where the electrodes 15 and 16 do not exist. However, before the conductive particles are conducted between the opposing electrodes 15 and 16 (the amount of adhesive necessary for conduction is extruded and Before the distance between the electrodes 15 and 16 becomes close to about φ), the portion where the electrodes 15 and 16 are not present is filled with the adhesive. Under these conditions, the electrodes 15, 1
In order to make an electrical connection between the six, pressure is applied more than necessary. By increasing the pressure in this way,
In some cases, it is possible to make the distance between the facing electrodes 15 and 16 close to φ, but in this case,
12 will increase stress.

Therefore, the anisotropic conductive film (anisotropic conductive adhesive)
The film thickness A of No. 14 needs to satisfy Equation 1.

In the example shown in FIGS. 1 and 2, the first substrate 1
Although both the first substrate 12 and the second substrate 12 are FPCs, one of the first substrate 11 and the second substrate 12 may be a TCP. Alternatively, both the first substrate 11 and the second substrate 12 may be TCP. That is, both the first substrate 11 and the second substrate 12 are FP
The present invention can be applied to the case of C or any one of the TCPs, or any of the TCPs. In any case, the effect of the present invention (the The effect of reducing the connection resistance between the first substrate 11 and the second substrate 12 and maximizing the adhesive force between the first substrate 11 and the second substrate 12 can be obtained.

FIGS. 5 and 6 are diagrams for explaining an example of a heat sealing connection method when the first substrate 11 is a liquid crystal panel substrate and the second substrate 12 is TCP. FIG. 5 shows a state before heat sealing, and FIG.
FIG. 3 is a diagram showing a state after heat sealing.

That is, in the examples of FIGS. 5 and 6, a liquid crystal display panel 11 having a plurality of transparent electrodes (ITO) 15 formed at predetermined intervals and a plurality of electrode portions formed at predetermined intervals are provided. 16 is electrically connected to the TCP 12 via the anisotropic conductive film 14 containing conductive particles.

That is, a transparent electrode (ITO) 15 is formed on the substrate 11 of the liquid crystal display panel, and a portion of the ITO 15 extended to outside the panel display area on the substrate 11 of the liquid crystal display panel is Through the anisotropic conductive film 14,
The electrodes 16 of the TCP 12 are connected.

More specifically, the electrode 16 of the TCP 12
It is configured as a copper foil electrode part. That is, TCP1
In No. 2, a copper foil is stuck with an adhesive on a film serving as a base, and this is configured as an electrode 16. For example, in the TCP 12 in which the pitch of the copper foil electrodes 16 is about 0.2 mm, the thickness of the copper foil electrodes 16 can be about 30 μm. However, TCP21 is 70μ
When the thickness is about m, the thickness of the copper foil electrode 16 is about 20 μm. In this case, the thickness of the anisotropic conductive film 14 used for mounting is important.

That is, the film thickness of the anisotropic conductive film (anisotropic conductive adhesive) 14 is A, and the diameter of the conductive particles is φ
The thickness of the electrode portion (copper foil) 16 of the TCP 12 is B, the width of the electrode portion 16 and the width of the transparent electrode 15 are W, respectively,
When the pitch of the transparent electrodes 15 is P, the anisotropic conductive film 1
4 is preferably a film having a film thickness A that satisfies the relationship of A−φ ≒ B · (P−W) / P.

[0027]

[Equation 2] A−φ ≒ B · (P−W) / P

Specifically, it is determined that the above equation is satisfied.
8 × B · (P−W) /P≦A−φ≦1.2×B (P−W) /
When P is satisfied, the transparent electrode of the liquid crystal display panel substrate and TC
It becomes possible to electrically and physically connect the P electrode with high reliability.

That is, by satisfying the above equation, the electrical connection between the transparent electrode 15 of the liquid crystal display panel substrate 11 and the electrode 16 of the TCP 12 becomes possible without applying unnecessary pressure. Sex is greatly enhanced. Accordingly, in a liquid crystal display panel in which the substrate 11 is, for example, a plastic film, the occurrence of cracks in the ITO 15 can be reduced.

For example, when the thickness B of the electrode (copper foil) 16 of the TCP 12 is 20 μm and the particle diameter (diameter) φ of the conductive particles contained in the anisotropic conductive film 14 is 5 μm, In order to satisfy the condition, the thickness A of the anisotropic conductive film 14 is 15
It is preferable to use one having a size of about μm. That is, if the thickness A is much larger than 15 μm is used as the anisotropic conductive film 14, the adhesive (including the conductive particles) is filled in a portion where no electrode portion exists. In addition, the adhesive is left between the opposing electrodes 15 and 16 with a thickness greater than the diameter φ of the conductive particles, and the connection resistance between the opposing electrodes 15 and 16 increases.
Conversely, if the thickness of the anisotropic conductive film 14 is much smaller than 15 μm, the opposite electrode 1
Although the connection resistance between the electrodes 5 and 16 can be reduced, a portion where no electrode portion exists is not filled with the adhesive, so that the connection strength is weakened. Therefore, it is preferable to use the anisotropic conductive film 14 having a thickness A of about 15 μm.

FIGS. 7, 8 and 9 are views for explaining a modification of the mounting method (heat sealing connection method) of the liquid crystal display device according to the present invention. 7 is a side view before heat sealing, and FIG. 8 is a plan view of the surface of the first substrate 11 in FIG. 7 on the electrode 15 side. FIG. 9 is a diagram showing a state after heat sealing.

7, 8 and 9, the first substrate 11 having a plurality of electrodes 15 formed at predetermined intervals is shown.
When the second substrate 12 having a plurality of electrodes 16 formed at a predetermined interval is connected via an anisotropic conductive film 14, the electrode 15 of the first substrate 11 or the second substrate 12 is connected to the second substrate 12. A groove 33 is formed in the electrode 16 of the substrate 12 as shown in FIG. In addition, instead of the groove 33, or
A hole may be provided together with the groove 33.

As described above, the electrodes 15 on the first substrate 11,
Alternatively, when the groove 16 or the hole is provided in the electrode 16 of the second substrate 12, the film thickness A of the anisotropic conductive film 14 that satisfies the following expression can be used instead of the expression 1. .

[0034]

[Equation 3] A−φ> (B + C) · (P−W) / P

In the examples of FIGS. 7, 8 and 9, for example, the first substrate 11 is a TCP, the electrode 15 of the first substrate 11 is a copper foil electrode, and the second substrate 12 is a liquid crystal. In the case of a display panel substrate and the electrode 16 of the second substrate 12 is a transparent electrode, the electrode portion (copper foil) 1 of the first substrate (TCP) 11
By providing the groove 33 or the hole in FIG. 5 as shown in FIG. 8, excess adhesive can escape to the groove 33 or the hole.
Can be made wider than in the case of the configuration of FIGS. 1 and 2 (the restriction on the film thickness A can be relaxed),
Connection can be established with higher reliability (can be implemented). That is, the connection resistance between the first substrate 11 and the second substrate 12 can be reduced and the adhesive strength can be maximized.

For example, the first substrate 11 is a TCP, the electrode 15 of the first substrate 11 is a copper foil electrode, the second substrate 12 is a liquid crystal display panel substrate,
When the electrode 16 of the substrate 12 is a transparent electrode, the conditional expression of the expression 3 of the first substrate (TCP) 11 can be approximated by the following expression (expression 4).

[0037]

[Equation 4] A−φ> B · (P−W) / P

In FIG. 8, the copper foil electrode 15 has grooves 3 formed therein.
When forming the groove 3, the depth of the groove 33 is preferably set to be equal to or less than the diameter of the conductive particles in order to avoid disconnection of the electrode 15. In other words, the greater the depth of the groove 33, the greater the effect described above. However, when the groove 33 is formed in a copper foil, there is a limitation in securing conductive particles that contribute to the connection. The width of the groove and the gap between the adjacent grooves do not significantly affect the effects of the present invention. Therefore, a sufficient effect can be obtained by appropriately forming the grooves.

That is, in the case of the relationship of Equations 3 and 4 (when the film thickness A of the anisotropic conductive film is larger than the relationship of Equations 1 and 2), the anisotropic conductive film (adhesion Agent) accumulates, the distance between the opposing electrodes 15 and 16 becomes larger than the diameter φ of the conductive particles, and conduction may not be established between the electrodes 15 and 16. Therefore, by forming the groove 33 as shown in FIG. 8, even when the film thickness A of the anisotropic conductive film becomes thicker than the relationship of the equations (1) and (2), an extra adhesive is introduced into the groove 33. This allows the opposing electrodes 15, 16
The distance between the electrodes 15 and 16 can be reduced, and the electrodes 15 and 16 can be electrically connected via conductive particles.

That is, the transparent electrode of the liquid crystal display panel and T
By connecting CP, a groove or hole is formed at a predetermined position,
By providing extra adhesive escape, adhesive strength is maximized with low connection resistance.

In the examples of FIGS. 7 to 9, the liquid crystal display panel having a plurality of transparent electrodes (ITO) formed at predetermined intervals and the TCP having a plurality of electrodes formed at predetermined intervals are shown. Although the grooves or holes are formed on the electrodes of the TCP when they are electrically connected via the anisotropic conductive film 14, the grooves or holes may be formed on the TCP substrate.

In the examples of FIGS. 7 to 9, for example, the first
Substrate 11 is a TCP, and the electrode 15 of the first substrate 11
Is a copper foil electrode, the second substrate 12 is a liquid crystal display panel substrate, and the electrode 16 of the second substrate 12 is a transparent electrode, but the first substrate 11 and its electrodes 15,
The second substrate 12 and its electrode 16 may be arbitrary. In this case, a groove or a hole is formed in at least one of the first substrate and the second substrate to provide a predetermined interval. When connecting a first substrate having a plurality of electrodes formed at a predetermined interval and a second substrate having a plurality of electrodes formed at a predetermined interval through an anisotropic conductive film, The anisotropic conductive film can be guided to the groove or the hole, whereby the distance between the opposing electrodes 15 and 16 can be reduced, and the electrodes 15 and 16 can be conducted through the conductive particles. it can.

[0043]

As described above, according to the first aspect of the present invention, a first substrate having a plurality of electrodes formed at a predetermined interval and a plurality of electrodes formed at a predetermined interval are provided. When connecting to the second substrate having the electrode of the above through an anisotropic conductive film containing conductive particles, the thickness of the electrode of the first substrate is B, and the electrode of the second substrate is , The diameter of the conductive particles contained in the anisotropic conductive film is φ, the film thickness of the anisotropic conductive film is A, the electrode width of the first substrate, the second substrate Is W, the pitch of the electrodes on the first substrate, and the pitch of the electrodes on the second substrate are P, respectively, the anisotropic conductive film has A-φ ≒ (B + C).
Since a film having a film thickness A that satisfies the relationship (P−W) / P is used (the relationship between the film thickness of the anisotropic conductive film, the conductive particle diameter, and the electrode thickness is set to a predetermined condition. Accordingly, it is possible to electrically and physically connect the electrodes of the first substrate and the electrodes of the second substrate with high reliability.
That is, the connection resistance between the electrode of the first substrate and the electrode of the second substrate can be reduced, and the adhesive force between the first substrate and the second substrate can be increased.

According to the second aspect of the present invention, when mounting the TCP on the liquid crystal panel substrate, the thickness of the anisotropic conductive film, the diameter of the conductive particles, and the thickness of the TCP electrode are set to predetermined conditions. In this way, the transparent electrode of the liquid crystal display panel substrate and the TCP
Electrically and physically with high reliability.

According to the third aspect of the present invention, when mounting substrates having a plurality of electrodes separated by a predetermined distance, grooves or holes are provided on the electrodes of the substrate. An escape of the adhesive is formed, and the electrical and physical connection between the electrodes can be made with high reliability.

According to the fourth aspect of the present invention, when mounting the TCP on the liquid crystal display panel substrate, a groove or a hole is formed in the TCP electrode or the TCP substrate. Is formed, and electrical and physical connection between the transparent electrode of the liquid crystal display panel substrate and the TCP electrode can be achieved with high reliability.

[Brief description of the drawings]

FIG. 1 is a diagram for explaining an example of a mounting method of a liquid crystal display device according to the present invention.

FIG. 2 is a diagram for explaining an example of a mounting method of the liquid crystal display device according to the present invention.

FIG. 3 is an enlarged view of an anisotropic conductive film before heat sealing.

FIG. 4 is an enlarged view of the anisotropic conductive film after heat sealing.

FIG. 5 is a view for explaining another example of the mounting method of the liquid crystal display device according to the present invention.

FIG. 6 is a view for explaining another example of the mounting method of the liquid crystal display device according to the present invention.

FIG. 7 is a diagram for explaining another example of the mounting method of the liquid crystal display device according to the present invention.

FIG. 8 is a diagram for explaining another example of the mounting method of the liquid crystal display device according to the present invention.

FIG. 9 is a view for explaining another example of the mounting method of the liquid crystal display device according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 1st board | substrate 12 2nd board | substrate 14 Anisotropic conductive film 15 Electrode part 16 Electrode part 33 Groove

Claims (4)

[Claims] A first substrate having a plurality of electrodes formed at a predetermined interval and a second substrate having a plurality of electrodes formed at a predetermined interval; When the connection is made via the anisotropic conductive film, the thickness of the electrode on the first substrate is B, the thickness of the electrode on the second substrate is C, and the electrodes are contained in the anisotropic conductive film. The diameter of the conductive particles is φ, the film thickness of the anisotropic conductive film is A, the width of the electrode on the first substrate and the width of the electrode on the second substrate are W, When the pitch of the electrodes of the substrate and the pitch of the electrodes of the second substrate are P, respectively,
A method for mounting a liquid crystal display device, wherein a film having a film thickness A satisfying a relationship of A-φ ≒ (B + C) · (P−W) / P is used as the anisotropic conductive film. 2. A liquid crystal display panel having a plurality of transparent electrodes formed at predetermined intervals and a TCP having a plurality of electrode portions formed at predetermined intervals contain conductive particles. When electrically connected via an anisotropic conductive film, the thickness of the anisotropic conductive film is A, the diameter of the conductive particles is φ, the thickness of the electrode portion of the TCP is B, When the width of the electrode part and the transparent electrode is W, and the pitch of the electrode part and the transparent electrode is P, the relationship of A-φ ≒ B · (P−W) / P is established for the anisotropic conductive film. A method for mounting a liquid crystal display device, wherein a film having a film thickness A that satisfies the above is used. 3. An anisotropic conductive film comprising: a first substrate having a plurality of electrodes formed at predetermined intervals; and a second substrate having a plurality of electrodes formed at predetermined intervals. A method for mounting a liquid crystal display device, wherein a groove or a hole is provided in an electrode of at least one of a first substrate and a second substrate when the connection is established via the first substrate and the second substrate. 4. A liquid crystal display panel having a plurality of transparent electrodes formed at predetermined intervals and a TCP having a plurality of electrodes formed at predetermined intervals are electrically connected via an anisotropic conductive film. A method of mounting a liquid crystal display device, wherein a groove or a hole is provided on an electrode of the TCP or a TCP substrate.