JP7151137B2 - dimming unit - Google Patents

Description

TECHNICAL FIELD The present invention relates to a light control unit including a light control sheet and a connection portion for connecting the light control sheet to a power supply.

The light control sheet includes a light control layer containing a liquid crystal composition and a pair of transparent electrode layers sandwiching the light control layer. When a driving voltage is applied to the pair of transparent electrode layers, the orientation state of liquid crystal molecules included in the light control layer changes, thereby changing the light transmittance of the light control sheet (see, for example, Patent Document 1). A light control unit is composed of such a light control sheet and a connection portion for connecting the transparent electrode layer to a power source.

An example of the structure of the light control unit will be described with reference to the drawings. As shown in FIG. 11, the light control unit 100 is attached to a transparent plate 200 such as a window glass. The light control sheet 110 includes a pair of electrode sheets 130A and 130B. A connection portion 160A is connected to the electrode sheet 130A, and a connection portion 160B is connected to the electrode sheet 130B. Specifically, as shown in FIG. 12, one electrode sheet 130A is a laminate of a transparent electrode layer 140A and a transparent support layer 150A. The transparent electrode layer 140A is in contact with one surface of the light control layer 120, and the transparent support layer 150A is attached to the transparent plate 200 via the adhesive layer 210. As shown in FIG. 160 A of connection parts are connected to the area|region exposed from the light control layer 120 and the other electrode sheet 130B in 140 A of transparent electrode layers. As shown in FIG. 13, the other electrode sheet 130B is a laminate of a transparent electrode layer 140B and a transparent support layer 150B, and the transparent electrode layer 140B is in contact with the other surface of the light control layer 120. As shown in FIG. The connecting portion 160B is connected to a region of the transparent electrode layer 140B exposed from the light control layer 120 and one of the electrode sheets 130A, and faces the transparent plate 200. As shown in FIG.

The connecting portions 160A and 160B include a conductive adhesive layer 161 bonded to the transparent electrode layers 140A and 140B and a conductive tape 162 bonded to the conductive adhesive layer 161. FIG. The conductive adhesive layer 161 is made of conductive paste such as silver paste. Conductive tape 162 is, for example, a copper tape. Connections 160A and 160B further include solder 163 located on the surface of conductive tape 162 and lead wires 164 connected to conductive tape 162 by solder 163 . The lead wire 164 is connected to a drive circuit that converts the voltage supplied from the power supply into a drive voltage, and the drive voltage is applied to the transparent electrode layers 140A and 140B through the connection portions 160A and 160B.

JP 2006-162823 A

By the way, when the light control unit 100 is transported or when the light control unit 100 is attached to the transparent plate 200, the lead wire 164 may swing with respect to the light control sheet 110, or the solder 163 and the transparent plate 200 may be separated from each other. impact is applied to the connection portion 160B. In the connecting portions 160A and 160B, the connecting portions between the conductive tape 162 and the lead wires 164 have a point-like bonding structure by the solder 163. Therefore, it cannot be said that the durability of the bonding is high against the shaking and impact described above. hard.
SUMMARY OF THE INVENTION An object of the present invention is to provide a light control unit capable of improving the reliability of bonding at a connection portion connected to a transparent electrode layer.

A light control unit that solves the above problems connects a light control sheet including a light control layer containing a liquid crystal composition, a first transparent electrode layer, and a second transparent electrode layer, and a power supply to the first transparent electrode layer. and a connection for The light control sheet includes a light control region and a wiring region. In the light control region, the first transparent electrode layer and the second transparent electrode layer sandwich the light control layer. , the first transparent electrode layer and the second transparent electrode layer sandwich the end portion of the connecting portion. The connecting portion includes a first adhesive layer bonded to the first transparent electrode layer in the wiring region, a second adhesive layer bonded to the second transparent electrode layer in the wiring region, and the first adhesive layer bonded to the second transparent electrode layer in the wiring region. a wiring member sandwiched between the adhesive layer and the second adhesive layer and joined to these adhesive layers. The first adhesive layer has conductivity, and the wiring member includes a wiring layer in contact with the first adhesive layer and the wiring member positioned between the first transparent electrode layer and the second transparent electrode layer. and an insulating resin layer supporting the layer.

According to the above configuration, the joint portion between each adhesive layer and the wiring member has a planar spread. Therefore, the reliability of bonding at the connecting portion is enhanced compared to a configuration in which the connecting portion includes a point-like bonding structure using solder and lead wires. Furthermore, since both surfaces of the wiring member are fixed to the light control sheet via the adhesive layer, the wiring member is firmly fixed to the light control sheet.

In the light control unit, the wiring layer is a first wiring layer, the second adhesive layer has conductivity, and the wiring member is opposite to the first wiring layer with respect to the insulating resin layer. A second wiring layer contacting the second adhesive layer may be provided on the side.

According to the above configuration, the wiring member is electrically connected to the first transparent electrode layer on one side and electrically connected to the second transparent electrode layer on the other side. As described above, when viewed from the direction facing the surface of the light control sheet, the connection portion is electrically connected to the first transparent electrode layer and the second transparent electrode layer in one wiring region, so that the transparent electrode layer is transparent. It is possible to reduce the ratio of the wiring area in the light control sheet and the area occupied by the connection part, compared to the form in which the connection part for connection to the power supply and the wiring area are provided for each electrode layer. be.

In the light control unit described above, the second adhesive layer may be an insulating adhesive layer.
According to the above configuration, the wiring member is electrically connected only to the first transparent electrode layer and fixed to both the first transparent electrode layer and the second conductive adhesive layer. Therefore, the wiring member can be firmly fixed to the light control sheet, compared to a configuration in which the wiring member is fixed on one side only to the electrically connected transparent electrode layer.

In the light control unit, the connection portion is a first connection portion, and the light control unit includes a second connection portion for connecting the second transparent electrode layer and a power source. The wiring area is a first wiring area, the light control sheet includes a second wiring area, and the first transparent electrode layer and the second transparent electrode layer are connected to each other in the second wiring area. pinch the ends of the The second connecting portion includes an insulating adhesive layer bonded to the first transparent electrode layer in the second wiring region, and a conductive adhesive layer bonded to the second transparent electrode layer in the second wiring region. and a second wiring member sandwiched between and joined to the insulating adhesive layer and the conductive adhesive layer, wherein the second wiring member is a wiring in contact with the conductive adhesive layer. and an insulating resin layer that supports the wiring layer.

According to the above configuration, the second wiring member is electrically connected only to the second transparent electrode layer and fixed to both the first transparent electrode layer and the second conductive adhesive layer. Therefore, although the connection part for connecting the transparent electrode layer and the power source is provided for each transparent electrode layer, the wiring member is firmly fixed to the light control sheet at each connection part.

In the above-described light control unit, the connection portion includes a laminate of the wiring member, the first adhesive layer, and the second adhesive layer, and the A sealing portion may be provided for filling a gap with the light modulating layer located in the light modulating region.

According to the above configuration, it is possible to protect the joint portions between the adhesive layers and the wiring members and the joint portions between the adhesive layers and the transparent electrode layers from contamination and the like, thereby suppressing deterioration in the joint performance of the respective members. Moreover, since contact between the first transparent electrode layer and the second transparent electrode layer is suppressed, short circuit can be suppressed.
In the light control unit, the wiring layer in contact with the first adhesive layer may have a flat film shape at a portion in contact with the first adhesive layer.

According to the above configuration, it is possible to reduce the load required to form the pattern, compared to the configuration in which the wiring layer has the pattern in the portion in contact with the first adhesive layer. Also, the resistance value of the wiring layer can be kept low.
In the light control unit described above, the wiring layer in contact with the first adhesive layer may have a conductor pattern in a portion in contact with the first adhesive layer.

According to the above configuration, the first adhesive layer is bonded to the wiring member so as to be partially in contact with the resin between the metals. As a result, the bonding strength between the first adhesive layer and the wiring member is increased compared to the case where the first adhesive layer is bonded to a uniform metal surface, so the reliability of the bonding at the connection portion is further increased. .

In the light control unit, the wiring member bonded to the first adhesive layer and the second adhesive layer is a flexible printed circuit board, and the first adhesive layer is an anisotropic conductive film or an anisotropic conductive paste. , an isotropic conductive film, or an isotropic conductive paste.

According to the above configuration, a wiring member suitable for use in the connecting portion is realized. In addition, sufficient bonding reliability can be obtained at the connecting portion even in a low-temperature environment, a high-temperature environment, or a high-humidity environment.

ADVANTAGE OF THE INVENTION According to this invention, the reliability of joining in the connection part of a light control unit can be improved.

The figure which shows the planar structure of a light control unit about 1st Embodiment of a light control unit. The figure which shows the cross-sectional structure along the II-II line of FIG. FIG. 4 is a diagram showing an example of a planar structure of a wiring layer in the light control unit of the first embodiment; FIG. 4 is a diagram showing an example of a conductor pattern included in a wiring layer in the light control unit according to the first embodiment; The figure which shows an example of the conductor pattern which a wiring layer has in the light control unit of one Embodiment. The figure which shows an example of the conductor pattern which a wiring layer has in the light control unit of one Embodiment. The figure which shows the planar structure of a light control unit about 2nd Embodiment of a light control unit. The figure which shows the cross-sectional structure along the XIII-XIII line of FIG. The figure which shows the cross-sectional structure along the IX-IX line of FIG. The figure which shows the cross-sectional structure along the XX line of FIG. The figure which shows the planar structure of a light control unit about the conventional light control unit. The figure which shows the cross-sectional structure in the XII-XII line of FIG. The figure which shows the cross-sectional structure in the XIII-XIII line of FIG.

(First embodiment)
A first embodiment of the light control unit will be described with reference to FIGS. 1 to 6. FIG.

[Configuration of light control unit]
As shown in FIG. 1 , the light control unit 10 includes a light control sheet 20 and a connection portion 30 . The light control unit 10 is attached to the transparent plate 50 and used. The transparent plate 50 is a transparent plate-shaped member made of glass, resin, or the like. The transparent plate 50 may be, for example, a building material such as a windowpane, a partition, or a glass wall, or may be a vehicle member such as an automobile windowpane.

When viewed from the direction facing the surface of the light control sheet 20, the light control sheet 20 has a substantially rectangular shape and includes a light control area Si and a wiring area SD. A connection portion 30 is connected to the wiring region SD. The wiring area SD is positioned at the end of the light control sheet 20 along one side of the light control sheet 20 . The one side on which the wiring area SD is arranged may be any side, and may be set according to the arrangement of the transparent plate 50 and the drive circuit. Further, the wiring region SD may be arranged at a position including the central portion of the one side, or may be arranged at a position including the end portion of the one side.

When viewed from the direction facing the surface of the light control sheet 20, the portion other than the wiring region SD is the light control region Si. For example, as shown in FIG. 1, when the wiring region SD is arranged at a position including the central portion of the one side, the wiring region SD is surrounded by the dimming region Si except for the portion where the one side is positioned.
The connection portion 30 extends from the wiring area SD to the outside of the light control sheet 20 and is connected to the drive circuit.

FIG. 2 is a cross-sectional view taken along line II-II in FIG.
As shown in FIG. 2, the light control sheet 20 includes a light control layer 21, a first electrode sheet 22A, and a second electrode sheet 22B. 22 A of 1st electrode sheets are comprised from 23 A of 1st transparent electrode layers, and 24 A of 1st transparent support layers which support 23 A of 1st transparent electrode layers. The surface of the first transparent support layer 24A opposite to the surface in contact with the first transparent electrode layer 23A is attached to the transparent plate 50 via the adhesive layer 51 . The second electrode sheet 22B is composed of a second transparent electrode layer 23B and a second transparent support layer 24B that supports the second transparent electrode layer 23B.

In the light control region Si, the light control layer 21 is sandwiched between the first electrode sheet 22A and the second electrode sheet 22B. Specifically, the light control layer 21 is located between the first transparent electrode layer 23A and the second transparent electrode layer 23B facing each other. Thus, the light control region Si is a region where the light control layer 21 is located.

The light control layer 21 contains a liquid crystal composition. The light control layer 21 is made of, for example, polymer network liquid crystal (PNLC), polymer dispersed liquid crystal (PDLC), capsule nematic liquid crystal (NCAP: Nematic Curvilinear Aligned Phase), or the like. Configured. For example, a polymer network type liquid crystal has a polymer network having a three-dimensional mesh shape, and holds liquid crystal molecules in the voids of the polymer network. The liquid crystal molecules included in the light control layer 21 have, for example, positive dielectric anisotropy, and the dielectric constant in the long axis direction of the liquid crystal molecules is larger than the dielectric constant in the short axis direction of the liquid crystal molecules. Liquid crystal molecules are, for example, Schiff base, azo, azoxy, biphenyl, terphenyl, benzoate, tolan, pyrimidine, cyclohexanecarboxylate, phenylcyclohexane, and dioxane liquid crystal molecules. be.

Each of the first transparent electrode layer 23A and the second transparent electrode layer 23B is a conductive transparent layer. Materials constituting the transparent electrode layers 23A and 23B include, for example, indium tin oxide (ITO), fluorine-doped tin oxide (FTO), tin oxide, zinc oxide, carbon nanotubes (CNT), poly(3,4-ethylenediethylene). oxythiophene) (PEDOT), and the like.

Each of the first transparent support layer 24A and the second transparent support layer 24B is a transparent substrate. As the transparent support layers 24A and 24B, for example, a glass substrate, a silicon substrate, or a high-performance substrate made of polyethylene, polystyrene, polyethylene terephthalate, polyvinyl alcohol, polycarbonate, polyvinyl chloride, polyimide, polysulfone, cycloolefin polymer, triacetyl cellulose, or the like can be used. A molecular film is used.

The adhesive layer 51 is transparent and may be composed of an adhesive that requires hardening when bonding objects, or may be composed of an adhesive that does not require hardening when bonding objects. For example, the adhesive layer 51 is made of an adhesive such as acrylic resin or epoxy resin.

When no driving voltage is applied to the transparent electrode layers 23A and 23B, the orientation of the long axis direction of the liquid crystal molecules is irregular. Therefore, the light incident on the light control layer 21 is scattered, and the light control region Si appears cloudy. That is, when no driving voltage is applied to the light control layer 21, the light control region Si is opaque. On the other hand, when a driving voltage is applied between the first transparent electrode layer 23A and the second transparent electrode layer 23B through the connecting portion 30, the liquid crystal molecules are oriented so that the long axis direction of the liquid crystal molecules is aligned with the transparent electrode layers 23A and 23B. The direction along the direction of the electric field between As a result, light can easily pass through the light control layer 21, and the light control region Si becomes transparent.

In the wiring area SD, the first electrode sheet 22A and the second electrode sheet 22B are present, but the light control layer 21 is not present. Specifically, the first electrode sheet 22A continuously extends from the dimming area Si to the wiring area SD. The second electrode sheet 22B also extends continuously from the dimming area Si to the wiring area SD. In other words, each of the first electrode sheet 22A and the second electrode sheet 22B includes a region corresponding to the dimming region Si and a region adjacent to this region and corresponding to the wiring region SD.

On the other hand, the light control layer 21 is located only in the light control region Si between the light control region Si and the wiring region SD. In other words, the wiring area SD is an area of the light control sheet 20 from which the light control layer 21 has been removed. In the wiring region SD, the end portion of the connection portion 30 enters the space created by the absence of the light control layer 21 . That is, in the wiring region SD, the end portion of the connecting portion 30 is sandwiched between the first transparent electrode layer 23A and the second transparent electrode layer 23B.

The connecting portion 30 includes a first conductive adhesive layer 31A that is an example of a first adhesive layer, a second conductive adhesive layer 31B that is an example of a second adhesive layer, a wiring member 32, and a sealing portion 36. there is
The first conductive adhesive layer 31A is bonded to the surface of the first transparent electrode layer 23A. The second conductive adhesive layer 31B is bonded to the surface of the second transparent electrode layer 23B.

The wiring member 32 is sandwiched between the first conductive adhesive layer 31A and the second conductive adhesive layer 31B and joined to these conductive adhesive layers 31A and 31B. That is, one surface in the thickness direction of the wiring member 32 is fixed to the first transparent electrode layer 23A via the first conductive adhesive layer 31A, and the other surface in the thickness direction of the wiring member 32 is It is fixed to the second transparent electrode layer 23B via the second conductive adhesive layer 31B.

When viewed from the direction facing the surface of the light control sheet 20, the joint portion between the wiring member 32 and the first conductive adhesive layer 31A overlaps the joint portion between the wiring member 32 and the second conductive adhesive layer 31B. there is The wiring member 32 is joined to the conductive adhesive layers 31A and 31B at the ends of the wiring member 32, and extends to the outside of the light control sheet 20 from this joining portion.

Examples of the conductive adhesive layers 31A and 31B include an anisotropic conductive film (ACF), an anisotropic conductive paste (ACP), and an isotropic conductive film (ICF). , an isotropic conductive paste (ICP) is used. Among the above materials, if the anisotropic material is used, when the wiring included in the wiring member 32 is formed in a pattern, a conductive path along the pattern can be formed in the conductive adhesive layers 31A and 31B. Therefore, it is easy to obtain the electrical characteristics according to the design. In addition, if an isotropic material is used, the resistance value of the entire first conductive adhesive layer 31A and the entire second conductive adhesive layer 31B can be kept low. Isotropic materials are suitable when large currents need to flow through the . In addition to these advantages, it is preferable to use an anisotropic conductive film as the conductive adhesive layers 31A and 31B from the viewpoint of ease of handling in the manufacturing process.

The wiring member 32 includes an insulating resin layer 33, which is a flexible base material made of an insulating resin such as polyimide, and a first wiring layer 34A and a second wiring layer 34B made of metal thin films such as copper. and a first protective layer 35A and a second protective layer 35B made of insulating resin. Specifically, as the wiring member 32, a flexible printed circuit board (FPC: Flexible Printed Circuits) is used.

The wiring layers 34A and 34B are supported by the insulating resin layer 33. As shown in FIG. Specifically, the first wiring layer 34A is attached to one of the two surfaces of the insulating resin layer 33 via an adhesive layer (not shown), and the two surfaces of the insulating resin layer 33 are bonded. A second wiring layer 34B is attached to the other of them via an adhesive layer (not shown).

The first protective layer 35A covers a part of the first wiring layer 34A on the side opposite to the insulating resin layer 33 with respect to the first wiring layer 34A. The second protective layer 35B covers a part of the second wiring layer 34B on the side opposite to the insulating resin layer 33 with respect to the second wiring layer 34B. At the end of the wiring member 32, the first wiring layer 34A is exposed from the first protective layer 35A, and the second wiring layer 34B is exposed from the second protective layer 35B.

The wiring member 32 is arranged such that the first wiring layer 34A faces the first conductive adhesive layer 31A and the second wiring layer 34B faces the second conductive adhesive layer 31B. A portion of the surface of the first wiring layer 34A exposed from the first protective layer 35A is bonded to the first conductive adhesive layer 31A, and a portion of the surface of the second wiring layer 34B is bonded to the second protective layer. The portion exposed from 35B is joined to the second conductive adhesive layer 31B. Part of the portion where the first protective layer 35A covers the first wiring layer 34A may also be bonded to the first conductive adhesive layer 31A, or the second protective layer 35B may cover the second wiring layer 34B. A portion of the covering portion may also be bonded to the second conductive adhesive layer 31B.

The sealing portion 36 is made of insulating resin. The sealing portion 36 covers the periphery of the connecting portion 30 between the first transparent electrode layer 23A and the second transparent electrode layer 23B. Specifically, the sealing portion 36 fills the gap between the connection portion 30 and the light control layer 21 in the light control region Si between the first transparent electrode layer 23A and the second transparent electrode layer 23B. has a part In addition, the sealing portion 36 includes a portion of the wiring member 32 extending from the joint portion with the conductive adhesive layers 31A and 31B to the outside of the light control sheet 20, the first transparent electrode layer 23A and the second transparent electrode layer 23B. has a portion that fills the gap between each of the

The sealing portion 36 protects the joints between the conductive adhesive layers 31A and 31B and the wiring member 32 and the joints between the conductive adhesive layers 31A and 31B and the transparent electrode layers 23A and 23B from contamination and the like. It is possible to suppress the deterioration of the bonding performance of In addition, since the sealing portion 36 is provided, contact between the first transparent electrode layer 23A and the second transparent electrode layer 23B and contact between the first conductive adhesive layer 31A and the second conductive adhesive layer 31B are prevented. can be suppressed, so short circuits can be suppressed.

In the present embodiment, the positions of the end surfaces of the first transparent electrode layer 23A and the first transparent support layer 24A are arranged along the thickness direction of the light control sheet 20 at the end of the light control sheet 20. It looks like it's aligned. Similarly, at the end of the light control sheet 20, the positions of the end surfaces of the second transparent electrode layer 23B and the second transparent support layer 24B are aligned along the thickness direction of the light control sheet 20. ing. In such a configuration, as shown in FIG. 2, the sealing portion 36 is provided from between the first transparent electrode layer 23A and the wiring member 32 to a position protruding outside the light control sheet 20; It is preferable to extend from between the second transparent electrode layer 23</b>B and the wiring member 32 to a position protruding outside the light control sheet 20 . As a result, the joints between the connecting portions 30 and the transparent electrode layers 23A and 23B are properly protected, and the occurrence of short circuits is also properly suppressed.

In the direction in which the wiring member 32 extends, the length of the portion sandwiched between the first transparent electrode layer 23A and the second transparent electrode layer 23B in the wiring member 32, in other words, between the layers of the light control sheet 20 The length of the inserted portion may be several millimeters or longer. With such a length, good bonding strength can be obtained between the connecting portion 30 and the transparent electrode layers 23A and 23B. Also, if the length of the portion is about 10 cm or less, a large dimming area Si can be secured.

[Planar structure of wiring member]
With reference to FIGS. 3 to 6, the planar structure of the wiring member 32 will be described with a focus on the structure of the wiring layers 34A and 34B. The first wiring layer 34A will be described below as an example, and in FIGS. 3 to 6, the region where the first wiring layer 34A is located is indicated by dots.

As shown in FIG. 3, the first wiring layer 34A has a flat film shape at the portion exposed from the first protective layer 35A, that is, the end portion that is joined to the first conductive adhesive layer 31A. In other words, the first wiring layer 34A spreads uniformly without having an opening at the end that is joined to the first conductive adhesive layer 31A. Also, the first wiring layer 34A has a flat film shape even in the portion covered with the first protective layer 35A.

Alternatively, instead of the above configuration, the first wiring layer 34A may be formed in a pattern at the portion that joins with the first conductive adhesive layer 31A. In other words, the first wiring layer 34A may have a conductor pattern at the end joined to the first conductive adhesive layer 31A. Such conductor patterns are formed, for example, by etching a thin metal film.

As shown in FIG. 4, the conductor pattern may be a pattern in which conductors are arranged in stripes. In this conductor pattern, the conductor portion 40, which is the portion where the conductor is positioned, has a belt-like shape extending along the direction in which the wiring member 32 extends. line up at intervals. A portion between the conductor portions 40 adjacent to each other is an opening portion 41, and the opening portion 41 also has a strip shape extending along the direction in which the wiring member 32 extends.

As shown in FIG. 5, the conductor pattern may be a pattern in which conductors are arranged in a mesh pattern. In this conductor pattern, the conductor portion 40 includes a plurality of belt-like portions extending along the direction in which the wiring member 32 extends, and a plurality of belt-like portions extending along the width direction of the wiring member 32. has a mesh shape in which the parts of A portion surrounded by the conductor portion 40 is an opening portion 41, and the opening portion 41 is located in a dot shape.

As shown in FIG. 6, the mesh pattern may be inclined with respect to the direction in which the wiring member 32 extends. That is, in this conductor pattern, the conductor portion 40 has a plurality of belt-like portions extending in a direction inclined with respect to the extending direction of the wiring member 32 and belt-like portions extending in a direction orthogonal to the belt-like portions. It has a mesh shape that

Note that the conductor pattern is not limited to the above example, and any pattern in which openings are defined between conductors may be used. The opening 41 may be sandwiched between the conductors 40 along at least one direction, and the entire circumference of the opening 41 may be surrounded by the conductors 40. It may be sandwiched between the conductor portions 40 in one direction and not sandwiched between the conductor portions 40 in the other direction.

In the opening 41, the adhesive layer or insulating resin layer 33 underlying the first wiring layer 34A is exposed from the first wiring layer 34A, and these exposed portions are bonded to the first conductive adhesive layer 31A. That is, the first conductive adhesive layer 31A contacts the metal at the conductor portion 40 and contacts the resin at the opening 41 portion. In this manner, the first conductive adhesive layer 31A is partially in contact with the resin at the joint portion between the wiring member 32 and the first conductive adhesive layer 31A, so that the first conductive adhesive layer 31A is in contact only with the metal. The strength of the bonding between the wiring member 32 and the first conductive adhesive layer 31A is higher than in the form shown in FIG. be done.

Although the ratio of the openings 41 is not particularly limited, the openings 41 are preferably arranged evenly. In other words, in a plan view of the area where the conductor pattern is positioned, it is preferable that the area ratio between the conductor portion 40 and the opening 41 in each unit area is constant. With such a configuration, it is possible to suppress unevenness in bonding strength in the bonding portion between the wiring member 32 and the first conductive adhesive layer 31A.

Further, when the wiring member 32 and the first conductive adhesive layer 31A are bonded by thermocompression bonding, since the openings 41 are evenly arranged, the pressure applied to the first conductive adhesive layer 31A during thermocompression bonding Force magnitudes are less likely to be biased within the joint. As a result, uneven bonding strength and uneven formation of conductive paths in the first conductive adhesive layer 31A can be suppressed. In particular, when the first conductive adhesive layer 31A is composed of an anisotropic conductive adhesive material, a conductive path along the conductor pattern is preferably formed in the first conductive adhesive layer 31A.

In general, when the wiring member 32 and the first conductive adhesive layer 31A are joined together, the wiring member 32 and the first conductive adhesive layer 31A are arranged so that the pressure position advances along the direction in which the wiring member 32 extends. are pressed in sequence. In such a manufacturing method, it is assumed that the conductor portions 40 are arranged at equal intervals in the width direction of the wiring member 32 and that the ratio of the areas of the conductor portions 40 and the openings 41 is constant in the direction in which the wiring member 32 extends. In addition, it is possible to appropriately suppress unevenness in bonding strength and uneven formation of conductive paths in the first conductive adhesive layer 31A.

Moreover, in the wiring member 32, it is preferable that the portion of the first wiring layer 34A covered with the first protective layer 35A be flat, that is, not patterned. In other words, the first wiring layer 34A preferably has a pattern portion 42 forming the conductor pattern and a non-pattern portion 43 that does not have the opening 41 and spreads out. The patterned portion 42 and the non-patterned portion 43 are connected to form one continuous layer. That is, the pattern portion 42 and the non-pattern portion 43 are electrically connected. The non-pattern portion 43 is located in a portion of the first wiring layer 34A extending from the end portion where the pattern portion 42 is located, that is, a portion of the wiring member 32 not joined to the first conductive adhesive layer 31A.

By connecting the end of the first wiring layer 34A opposite to the end joined to the first conductive adhesive layer 31A to the drive circuit, the first transparent electrode layer 23A and the power source are electrically connected. Connected. The drive circuit converts the voltage received from the power supply into a drive voltage and applies it to the first transparent electrode layer 23A through the first wiring layer 34A. Since it is sufficient for the first wiring layer 34A to function as a single wiring as a whole, if a pattern is not formed in a portion that is not joined to the first conductive adhesive layer 31A, the formation of the pattern is sufficient. It is possible to reduce the load required for wiring and to suppress the increase in the resistance value in the first wiring layer 34A.

A portion of the non-pattern portion 43 may be located in the portion of the wiring member 32 that is joined to the first conductive adhesive layer 31A, and a portion of the pattern portion 42 may be located in the first conductive adhesive layer 31A of the wiring member 32. It may be positioned at a portion not joined to the conductive adhesive layer 31A.

Although the first wiring layer 34A has been described above as an example, each of the above configurations can also be applied to the second wiring layer 34B, and similar effects can be obtained. The conductor pattern of the first wiring layer 34A and the conductor pattern of the second wiring layer 34B may be the same pattern or different patterns. The first wiring layer 34A and the second wiring layer 34B are insulated from each other, and the first wiring layer 34A and the second wiring layer 34B are connected to different terminals of the drive circuit. Then, the driving circuit applies a driving voltage to the second transparent electrode layer 23B through the second wiring layer 34B.

[Manufacturing method of light control unit]
The light control unit 10 is manufactured, for example, by the following manufacturing method.
First, a multilayer sheet having a light control layer 21 and electrode sheets 22A and 22B is formed. Then, a multilayer body having the light control layer 21 and the electrode sheets 22A and 22B is cut or punched out from the multilayer sheet in a shape corresponding to the shape of the transparent plate 50 . After or before the multilayer body is attached to the transparent plate 50 via the adhesive layer 51, the wiring area SD is formed to connect the connecting portion 30. As shown in FIG.

The wiring region SD is formed by removing the light control layer 21 from a portion of the multilayer body. For example, the gap between the first electrode sheet 22A and the second electrode sheet 22B is widened at the end of the multilayer body, and the light control layer 21 is partially removed. Thus, the light control sheet 20 is formed. Then, the light control unit 10 is formed by arranging the connection part 30 in the part from which the light control layer 21 was removed. A sealing portion may be formed on the outer periphery of the light control sheet 20 on the transparent plate 50 as necessary.

According to such a manufacturing method, in the end portion constituting the outer edge portion of the light control sheet 20 in the light control region Si, the end surfaces of the light control layer 21 and the electrode sheets 22A and 22B have the thickness of the light control sheet 20. aligned in the direction

According to the manufacturing method described above, the light control sheet 20 is formed by forming the light control layer 21 by injecting the liquid crystal between the electrode sheets 22A and 22B after forming the sealing structure between the two electrode sheets 22A and 22B. The efficiency of manufacturing the light control sheet 20 is improved as compared with the manufacturing method performed every time. In addition, since the outer shape of the light control sheet 20 is formed by cutting or punching from the multilayer sheet, it is easy to form the light control sheet 20 in a shape corresponding to the shape of the transparent plate 50 .

Furthermore, since the wiring region SD is formed by removing a part of the light control layer 21, compared with the manufacturing method in which the light control layer 21 is formed in a shape excluding the wiring region SD in advance, It is possible to reduce the burden required for forming the light modulating layer 21 . In addition, it is easy to adjust the size and arrangement of the wiring area SD.

[Action]
The action of the light control unit 10 will be described. In the light control unit 10, the connection portion 30 has the first wiring layer 34A of the wiring member 32 bonded to the surface of the first conductive adhesive layer 31A, and the second wiring member 32 connected to the surface of the second conductive adhesive layer 31B. It has a structure in which the wiring layer 34B is joined. In such a configuration, the joints between the conductive adhesive layers 31A and 31B and the wiring member 32 are widened, and the members forming the connection portion 30 are joined together by a joint structure using solder and lead wires. Dot-shaped junction structures such as are not included. Therefore, the reliability of bonding at the connecting portion 30 is enhanced. As a result, when the light control unit 10 is installed on the transparent plate 50 or when the light control unit 10 is moved together with the transparent plate 50 as in the case where the light control unit 10 is used for a window or the like, an external force is exerted on the connection part 30. Even if this acts, it is possible to suppress the occurrence of poor bonding in the connection portion 30 .

Furthermore, one surface of the wiring member 32 is fixed to the first transparent electrode layer 23A via the first conductive adhesive layer 31A, and the other surface of the wiring member 32 is fixed to the second conductive adhesive layer 31B via the second conductive adhesive layer 31B. It is fixed to the transparent electrode layer 23B. That is, both surfaces of the wiring member 32 are fixed to the light control sheet 20 . Therefore, for example, a wiring member connected to the first conductive adhesive layer 31A and a wiring member connected to the second conductive adhesive layer 31B are provided at different positions, and only one side of each wiring member is attached to the light control sheet 20. The wiring member 32 is more firmly fixed to the light control sheet 20 than in a fixed form.

Since the conventional connecting portion including solder and lead wires is inevitably thick, the transparent electrode layers 23A and 23B are interposed between the first transparent electrode layer 23A and the second transparent electrode layer 23B. It is extremely difficult to sandwich the connecting portion connecting to each of 23B. In contrast, with the connection portion 30 of the present embodiment, the total thickness of the connection portion 30 can be reduced. It is possible to realize a structure in which With such a structure, since the joints between the transparent electrode layers 23A and 23B and the connection section 30 are not exposed from the light control sheet 20, the joints come into contact with other members such as the transparent plate 50 and the connection section is closed. The application of impact to 30 is suppressed. As a result, it is possible to suppress the weakening of the joints due to the external force acting on the joints between the transparent electrode layers 23A and 23B and the connecting portion 30 and the joints between the conductive adhesive layers 31A and 31B and the wiring member 32 .

In the present embodiment, each of the first transparent electrode layer 23A and the second transparent electrode layer 23B and the connection portion 30 are connected to each other in one wiring region SD when viewed from the direction facing the surface of the light control sheet 20. electrically connected. With the structure of this embodiment, a wiring region for connecting the connecting portion to the first transparent electrode layer 23A and a wiring region for connecting the connecting portion to the second conductive adhesive layer 31B are provided separately. Since the ratio of the wiring area in the light control sheet 20 can be reduced compared to the form, a large light control area Si can be ensured.

Furthermore, the size of the area occupied by the wiring member on the outside of the light control sheet 20 is reduced compared to the configuration in which separate connection portions are connected to the first conductive adhesive layer 31A and the second conductive adhesive layer 31B. It is also possible to reduce the work and time required for assembling the connection portion to the light control sheet 20 .

In addition, in the structure of conventional light control units, when a structure in which copper tape is bonded to silver paste is adopted, the adhesive strength of the copper tape decreases in low-temperature, high-temperature, and high-humidity environments. and joint failure is likely to occur. On the other hand, as in the present embodiment, any one of an anisotropic conductive film, an anisotropic conductive paste, an isotropic conductive film, and an isotropic conductive paste is used as the conductive adhesive layers 31A and 31B. If the wiring layers 34A and 34B are bonded to the conductive adhesive layers 31A and 31B, the reliability of bonding at the connecting portion 30 can be sufficiently obtained even in a low-temperature environment, a high-temperature environment, or a high-humidity environment.

As described above, according to the light control unit 10 of the first embodiment, the following effects are obtained.
(1) The connecting portion 30 is composed of the two adhesive layers 31A and 31B and the wiring member 32, and the joint portion between the adhesive layers 31A and 31B and the wiring member 32 has a planar spread. Therefore, the reliability of bonding in the connecting portion 30 is enhanced compared to a configuration in which the connecting portion 30 includes a point-like bonding structure using solder and lead wires. Furthermore, since both surfaces of the wiring member 32 are fixed to the light control sheet 20 via the adhesive layers 31A and 31B, the wiring member 32 is firmly fixed to the light control sheet 20 .

(2) The first wiring layer 34A is bonded to the first conductive adhesive layer 31A bonded to the first transparent electrode layer 23A, and the second wiring layer 34B is bonded to the second transparent electrode layer 23B. It joins with the adhesion layer 31B. That is, the wiring member 32 is electrically connected to the first transparent electrode layer 23A on one side and electrically connected to the second transparent electrode layer 23B on the other side. Thus, when viewed from the direction facing the surface of the light control sheet 20, the connecting portion is electrically connected to the first transparent electrode layer 23A and the second transparent electrode layer 23B in one wiring region SD. Therefore, it is possible to reduce the ratio of the wiring area SD and the area occupied by the connecting portion 30 .

(3) If the wiring layers 34A and 34B have a flat film shape at the portions where the wiring layers 34A and 34B are joined to the conductive adhesive layers 31A and 31B, the wiring layers 34A and 34B have a pattern. In comparison, it is possible to reduce the load required for pattern formation. Moreover, the resistance value of the wiring layers 34A and 34B can be kept low.

(4) If the wiring layers 34A and 34B have conductor patterns in the portions where the wiring layers 34A and 34B are joined to the conductive adhesive layers 31A and 31B, the conductive adhesive layers 31A and 31B are attached to the wiring member 32, The metal is joined so that it is partially in contact with the resin. As a result, compared to the case where the conductive adhesive layers 31A and 31B are bonded to a uniform metal surface, the bonding strength between the conductive adhesive layers 31A and 31B and the wiring member 32 is increased. The reliability of joining is further improved.

(5) The sealing portion 36 fills the gap between the connection portion 30 and the light control layer 21 located in the light control region Si between the first transparent electrode layer 23A and the second transparent electrode layer 23B. there is According to such a configuration, the joints between the conductive adhesive layers 31A and 31B and the wiring member 32 and the joints between the conductive adhesive layers 31A and 31B and the transparent electrode layers 23A and 23B are protected from contamination and the like. It is possible to suppress the deterioration of the bonding performance of In addition, since contact between the first transparent electrode layer 23A and the second transparent electrode layer 23B and contact between the first conductive adhesive layer 31A and the second conductive adhesive layer 31B are suppressed, short circuits can be suppressed.

(6) The wiring member 32 is a flexible printed circuit board, and the conductive adhesive layers 31A and 31B are either an anisotropic conductive film, an anisotropic conductive paste, an isotropic conductive film, or an isotropic conductive paste. is. With the above configuration, the wiring member 32 suitable for use in the connecting portion 30 is realized. In addition, sufficient reliability of bonding at the connecting portion 30 can be obtained even in a low-temperature environment, a high-temperature environment, or a high-humidity environment.

(Second embodiment)
A second embodiment of the dimming unit will be described with reference to FIGS. 7 to 10. FIG. In the following, the differences between the second embodiment and the first embodiment will be mainly described, and the same reference numerals will be given to the same configurations as in the first embodiment, and the description thereof will be omitted.

[Configuration of light control unit]
As shown in FIG. 7, the light control unit 11 of the second embodiment includes a light control sheet 20 and two connection portions, a first connection portion 60A and a second connection portion 60B.
When viewed from the direction facing the surface of the light control sheet 20, the light control sheet 20 includes a light control area Si, a first wiring area SA, and a second wiring area SB. A first connection portion 60A is connected to the first wiring area SA, and a second connection portion 60B is connected to the second wiring area SB. The two wiring areas SA and SB are positioned at the ends of the light control sheet 20 and arranged along one side of the light control sheet 20 . The one side on which the wiring areas SA and SB are arranged may be any side, and may be set according to the arrangement of the transparent plate 50 and the drive circuit.

The first wiring area SA and the second wiring area SB are provided at positions including corners of the light control sheet 20, for example. That is, the first wiring region SA extends from a corner including one end of the one side of the light control sheet 20 along the side, and the first wiring region SA extends along the side from a corner including the other end of the one side. 2 wiring area SB extends.

Between the first wiring area SA and the second wiring area SB, an inter-terminal area Se, which is part of the dimming area Si, is located. In other words, the first wiring area SA, the inter-terminal area Se, and the second wiring area SB are arranged in this order along the one side of the light control sheet 20 when viewed from the direction facing the surface of the light control sheet 20. , the inter-terminal region Se is positioned between the first connection portion 60A and the second connection portion 60B.

The first connection portion 60A extends outside the light control sheet 20 from the first wiring area SA, and the second connection portion 60B extends outside the light control sheet 20 from the second wiring area SB. Outside the light control sheet 20, the first connection portion 60A and the second connection portion 60B are separated and separately connected to the drive circuit.

8 is a cross-sectional view taken along line VIII-VIII in FIG. 7. FIG.
As shown in FIG. 8, in the first wiring area SA, the first electrode sheet 22A and the second electrode sheet 22B are present in the same manner as the wiring area SD of the first embodiment, but the light control layer 21 is not present. . In the first wiring area SA, the end of the first connecting portion 60A is sandwiched between the first transparent electrode layer 23A and the second transparent electrode layer 23B.

The first connection portion 60A includes a conductive adhesive layer 61A that is an example of a first adhesive layer, an insulating adhesive layer 67A that is an example of a second adhesive layer, a first wiring member 62A, and a first sealing portion 66A. and

The conductive adhesive layer 61A is made of, for example, an anisotropic conductive film, an anisotropic conductive paste, an isotropic conductive film, or an isotropic conductive paste, similar to the conductive adhesive layers 31A and 31B of the first embodiment. Consists of either The insulating adhesive layer 67A may be composed of an adhesive that requires hardening when bonding objects, or may be composed of an adhesive that does not require hardening when bonding objects. The insulating adhesive layer 67A is made of, for example, a silicon-based or epoxy-based material.

As the first wiring member 62A, a flexible printed circuit board is used like the wiring member 32 of the first embodiment. A wiring layer 64A made of an attached metal thin film and a protective layer 65A covering a part of the wiring layer 64A are provided. At the end of the first wiring member 62A, the wiring layer 64A is exposed from the protective layer 65A. A wiring layer and a protective layer are not arranged on the other surface of the insulating resin layer 63A.

The conductive adhesive layer 61A is bonded to the surface of the first transparent electrode layer 23A, and the insulating adhesive layer 67A is bonded to the surface of the second transparent electrode layer 23B. The first wiring member 62A is arranged such that the wiring layer 64A faces the conductive adhesive layer 61A, and is sandwiched between the conductive adhesive layer 61A and the insulating adhesive layer 67A. A portion of the surface of the wiring layer 64A exposed from the protective layer 65A is joined to the conductive adhesive layer 61A. The surface of the insulating resin layer 63A opposite to the surface on which the wiring layer 64A is located is bonded to the insulating adhesive layer 67A. Part of the portion where the protective layer 65A covers the wiring layer 64A may also be joined to the conductive adhesive layer 61A.

That is, the surface on one side in the thickness direction of the first wiring member 62A is fixed to the first transparent electrode layer 23A via the conductive adhesive layer 61A, and the wiring layer 64A is connected to the first transparent electrode layer 23A. Conducting. On the other hand, the surface on the other side in the thickness direction of the first wiring member 62A is fixed to the second transparent electrode layer 23B via an insulating adhesive layer 67A, and the wiring layer 64A is connected to the second transparent electrode layer 23B. is insulated.

The wiring layer 64A, like the wiring layers 34A and 34B of the first embodiment, may be in the form of a flat film at the end that is joined to the conductive adhesive layer 61A, or may have a conductor pattern that defines the opening. may have.

The first sealing portion 66A is made of insulating resin. The first sealing portion 66A fills the gap between the first connection portion 60A and the light control layer 21 in the light control region Si between the first transparent electrode layer 23A and the second transparent electrode layer 23B. have a part. Further, the first sealing portion 66A includes a portion of the first wiring member 62A that extends outside the light control sheet 20 from a joint portion with each of the conductive adhesive layer 61A and the insulating adhesive layer 67A, and the first wiring member 62A. It has a portion that fills the gap between each of the transparent electrode layer 23A and the second transparent electrode layer 23B.

As in the first embodiment, the first sealing portion 66A provides a joint portion between each of the conductive adhesive layer 61A and the insulating adhesive layer 67A and the first wiring member 62A, and a transparent seal between these adhesive layers 61A and 67A and the first wiring member 62A. The joint portions with the electrode layers 23A and 23B can be protected. In addition, it is possible to suppress the occurrence of a short circuit due to contact between the first transparent electrode layer 23A and the second transparent electrode layer 23B. Also in the second embodiment, the first sealing portion 66A protrudes from between the first transparent electrode layer 23A and the first wiring member 62A to the outside of the light control sheet 20, the second transparent electrode layer 23B and the first wiring member 62A. It is preferable to have a portion protruding outside the light control sheet 20 from between the two wiring members 62B.

9 is a cross-sectional view taken along line IX-IX in FIG. 7. FIG.
As shown in FIG. 9, the second wiring region SB also has the first electrode sheet 22A and the second electrode sheet 22B, but does not have the light control layer 21, like the first wiring region SA. In the second wiring region SB, the end of the second connection portion 60B is sandwiched between the first transparent electrode layer 23A and the second transparent electrode layer 23B.

The second connection portion 60B includes a conductive adhesive layer 61B, an insulating adhesive layer 67B, a second wiring member 62B, and a second sealing portion 66B.
The conductive adhesive layer 61B, like the conductive adhesive layer 61A, is made of, for example, an anisotropic conductive film, an anisotropic conductive paste, an isotropic conductive film, or an isotropic conductive paste. Like the insulating adhesive layer 67A, the insulating adhesive layer 67B is made of, for example, a silicon-based or epoxy-based material.

As with the first wiring member 62A, a flexible printed circuit board is used as the second wiring member 62B. The second wiring member 62B includes an insulating resin layer 63B, a wiring layer 64B attached to one surface of the insulating resin layer 63B, and a protective layer 65B that partially covers the wiring layer 64B. At the end of the second wiring member 62B, the wiring layer 64B is exposed from the protective layer 65B. A wiring layer and a protective layer are not arranged on the other surface of the insulating resin layer 63B.

The conductive adhesive layer 61B is bonded to the surface of the second transparent electrode layer 23B, and the insulating adhesive layer 67B is bonded to the surface of the first transparent electrode layer 23A. The second wiring member 62B is arranged such that the wiring layer 64B faces the conductive adhesive layer 61B, and is sandwiched between the conductive adhesive layer 61B and the insulating adhesive layer 67B. A portion of the surface of the wiring layer 64B exposed from the protective layer 65B is bonded to the conductive adhesive layer 61B. The surface of the insulating resin layer 63B opposite to the surface where the wiring layer 64B is located is joined to the insulating adhesive layer 67B. Part of the portion where the protective layer 65B covers the wiring layer 64B may also be joined to the conductive adhesive layer 61B.

That is, the surface on one side in the thickness direction of the second wiring member 62B is fixed to the second transparent electrode layer 23B via the conductive adhesive layer 61A, and the wiring layer 64B is connected to the second transparent electrode layer 23B. Conducting. On the other hand, the surface on the other side in the thickness direction of the second wiring member 62B is fixed to the first transparent electrode layer 23A via an insulating adhesive layer 67B, and the wiring layer 64B is connected to the first transparent electrode layer 23A. is insulated.

As with the wiring layers 34A and 34B of the first embodiment, the wiring layer 64B may be in the form of a flat film at the end joined to the conductive adhesive layer 61B, or may have a conductor pattern that defines the opening. may have.

The second sealing portion 66B is made of insulating resin. The second sealing portion 66B fills the gap between the second connection portion 60B and the light control layer 21 in the light control region Si between the first transparent electrode layer 23A and the second transparent electrode layer 23B. have a part. In addition, the second sealing portion 66B includes a portion of the second wiring member 62B that extends outside the light control sheet 20 from a joint portion with each of the conductive adhesive layer 61B and the insulating adhesive layer 67B, and the first sealing portion 66B. It has a portion that fills the gap between each of the transparent electrode layer 23A and the second transparent electrode layer 23B.

The second sealing portion 66B separates the joint portions between each of the conductive adhesive layer 61B and the insulating adhesive layer 67B and the second wiring member 62B and the joint portions between the second connection portion 60B and the transparent electrode layers 23A and 23B. can be protected. In addition, it is possible to suppress the occurrence of a short circuit due to contact between the first transparent electrode layer 23A and the second transparent electrode layer 23B. The second sealing portion 66B also has a portion protruding outside the light control sheet 20 from between the first transparent electrode layer 23A and the second wiring member 62B, and between the second transparent electrode layer 23B and the second wiring member 62B. It is preferable to have a portion protruding outside the light control sheet 20 .

10 is a cross-sectional view taken along line XX in FIG. 7. FIG.
As shown in FIG. 10, in the inter-terminal region Se located between the first wiring region SA and the second wiring region SB, the light control layer 21 is between the first electrode sheet 22A and the second electrode sheet 22B. is sandwiched. The layer structure of the light control sheet 20 in the inter-terminal region Se matches that of other portions in the light control region Si. The first transparent electrode layer 23A and the first transparent support layer 24A that constitute the first electrode sheet 22A continuously extend from the inter-terminal region Se to each of the first wiring region SA and the second wiring region SB. The second transparent electrode layer 23B and the second transparent support layer 24B that constitute the second electrode sheet 22B also extend continuously from the inter-terminal region Se to each of the first wiring region SA and the second wiring region SB. .

The first connection portion 60A is connected to the light control sheet 20 by a conductive adhesive layer 61A on the side where the first transparent electrode layer 23A is located with respect to the first connection portion 60A, and the second transparent electrode layer 23B is located. It is connected to the light control sheet 20 by an insulating adhesive layer 67A on the side thereof. The second connection portion 60B is connected to the light control sheet 20 by an insulating adhesive layer 67B on the side where the first transparent electrode layer 23A is located with respect to the second connection portion 60B, and the second connection portion 60B is located on the side where the second transparent electrode layer 23B is located. side, it is connected to the light control sheet 20 by a conductive adhesive layer 61B.

That is, the first wiring member 62A of the first connection portion 60A and the light control sheet 20 are electrically connected to the driving voltage on the side where the first transparent electrode layer 23A is located with respect to the first wiring member 62A. It is The second wiring member 62B of the second connection portion 60B and the light control sheet 20 are electrically connected to the driving voltage on the side where the second transparent electrode layer 23B is positioned with respect to the second wiring member 62B. It is

By connecting the end of the wiring layer 64A of the first wiring member 62A opposite to the end joined to the conductive adhesive layer 61A to the drive circuit, the first transparent electrode layer 23A and the drive circuit are connected. are electrically connected. In addition, the end of the wiring layer 64B of the second wiring member 62B opposite to the end joined to the conductive adhesive layer 61B is connected to the drive circuit, thereby connecting the second transparent electrode layer 23B and the drive circuit. circuit is electrically connected.

The light control unit 11 of the second embodiment is manufactured by a method according to the light control unit 10 of the first embodiment. That is, a multilayer sheet having the light control layer 21 and the electrode sheets 22A and 22B is formed, and a multilayer body having the light control layer 21 and the electrode sheets 22A and 22B is formed from the multilayer sheet in a shape corresponding to the shape of the transparent plate 50. Cut out or punched out. Then, by removing the dimming layer 21 from a part of the multilayer body, the first wiring region SA and the second wiring region SB are formed, and the first connection portion 60A is connected to the first wiring region SA. , the second connection portion 60B is connected to the second wiring region SB.

[Action]
The action of the dimming unit 11 will be described. In the light control unit 11, the connection portions 60A and 60B are such that one surfaces of the wiring members 62A and 62B are bonded to the surfaces of the conductive adhesive layers 61A and 61B, and the wiring members 62A and 62B are bonded to the surfaces of the insulating adhesive layers 67A and 67B. It has a structure in which the other surface of 62B is joined. Therefore, also in the second embodiment, the joint portions between the conductive adhesive layers 61A, 61B and the insulating adhesive layers 67A, 67B and the wiring members 62A, 62B are widened to form the connection portions 60A, 60B. Bonding between members does not include point-like bonding structures such as bonding structures using solder and lead wires. Therefore, as in the first embodiment, the reliability of bonding at the connection portions 60A and 60B is enhanced.

Furthermore, in the second embodiment, the wiring members 62A and 62B are electrically connected to only one of the first transparent electrode layer 23A and the second transparent electrode layer 23B, while the wiring members 62A and 62B are electrically connected to the first transparent electrode layer 23A. and the second conductive adhesive layer 31B. That is, both surfaces of the wiring members 62A and 62B are fixed to the light control sheet 20. As shown in FIG. Therefore, the wiring member 32 is firmly fixed to the light control sheet 20 compared to the configuration in which the wiring members 62A and 62B are fixed only to the electrically connected transparent electrode layers 23A and 23B on one side.

A first wiring region SA for connecting the connecting portion to the first transparent electrode layer 23A and a first wiring region SA for connecting the connecting portion to the second transparent electrode layer 23B are provided separately. Therefore, since it is possible to set the wiring area at the same position as in the case where the conventional connection part including the solder and the lead wire is used, the burden required for designing the arrangement of the wiring area is small.

As described above, according to the light control unit 11 of the second embodiment, the following effects can be obtained in addition to the effects (1), (3) to (6) of the first embodiment.
(7) The wiring members 62A and 62B are fixed on one side to one of the transparent electrode layers 23A and 23B via the conductive adhesive layers 61A and 61B, and on the other side to the insulating adhesive layers 67A and 67B. It is fixed to the other of the transparent electrode layers 23A and 23B via. That is, the wiring members 62A and 62B are electrically connected to only one of the first transparent electrode layer 23A and the second transparent electrode layer 23B, while the first transparent electrode layer 23A and the second conductive adhesive are connected. layer 31B. Therefore, the wiring member 32 is firmly fixed to the light control sheet 20, although the connection part for connecting the transparent electrode layers 23A and 23B and the power source is provided for each transparent electrode layer.

<Modification>
The above embodiment can be implemented with the following modifications. It should be noted that the following modified examples can also be implemented in combination.
[Modification of Second Embodiment]
The first wiring area SA and the second wiring area SB may be arranged at positions along different sides of the light control sheet 20 when viewed from the direction facing the surface of the light control sheet 20 . That is, the first connection portion 60A and the second connection portion 60B do not have to be arranged along one side of the light control sheet 20 . According to such a configuration, the degree of freedom in the arrangement of the first connection portion 60A and the second connection portion 60B is increased, and the first connection portion 60A and the second connection portion can be arranged according to the size of the light control sheet 20, the installation location, and the like. It is also possible to adjust the position with 60B. Also, the first wiring area SA and the second wiring area SB may be provided at positions that do not include the corners of the light control sheet 20 . When the light control unit 11 is formed by the manufacturing method described in the second embodiment, all areas other than the wiring areas SA and SB on the light control sheet 20 are light control areas Si.

Note that, as in the second embodiment, the first wiring region SA and the second wiring region SB are arranged along one side of the light control sheet 20, and the first wiring region SA and the second wiring region SB If the inter-terminal region Se is positioned between them, the connecting portions 60A and 60B are collectively arranged along one side of the light control sheet 20 . As a result, a large rectangular area that does not include the wiring areas SA and SB can be secured in the light control area Si, so a large field of view can be secured through the light control sheet 20 . Furthermore, it is possible to suppress the expansion of the path from the connection portions 60A and 60B to the drive circuit and the expansion of the area required for arranging the connection portions 60A and 60B.

- In the first wiring member 62A, a metal thin film layer may be provided on the surface of the insulating resin layer 63A opposite to the surface on which the wiring layer 64A is located, and a protective layer may be provided. good too. The outermost surface of the first wiring member 62A opposite to the wiring layer 64A is bonded to the insulating adhesive layer 67A, and the metal thin film layer is insulated from the second transparent electrode layer 23B. Similarly, in the second wiring member 62B, a metal thin film layer may be provided on the surface of the insulating resin layer 63B opposite to the surface on which the wiring layer 64B is located, and a protective layer may be provided. may be The outermost surface of the second wiring member 62B opposite to the wiring layer 64B is bonded to the insulating adhesive layer 67B, and the metal thin film layer is insulated from the first transparent electrode layer 23A.

When the wiring members 62A and 62B have metal thin film layers on the front and back surfaces, the first wiring member 62A and the second wiring member 62B may be connected outside the light control sheet 20 . Specifically, the insulating resin layer 63A of the first wiring member 62A and the insulating resin layer 63B of the second wiring member 62B form one base material that is bifurcated near the light control sheet 20. As shown in FIG. A wiring layer 64A is a metal thin film layer positioned on one surface of the substrate, electrically connected to the first transparent electrode layer 23A in the first wiring region SA, and positioned on the other surface of the substrate. The metal thin film layer is the wiring layer 64B, which is electrically connected to the second transparent electrode layer 23B in the second wiring region SB. With such a configuration, it is possible to reduce the area occupied by the connection portions 60A and 60B on the outside of the light control sheet 20 .

If the first connection portion 60A and the second connection portion 60B are separated outside the light control sheet 20 as in the second embodiment, the first connection portion 60A and the second connection portion 60B can be separately attached to the wiring areas SA and SB as separate members. Therefore, compared with the form which the 1st connection part 60A and the 2nd connection part 60B are connected, the assembly of the light control unit 11 is easy.

- You may use a flexible flat cable (FFC:Flexible Flat Cable) as wiring member 62A, 62B. A flexible flat cable has a structure in which strip-shaped conductors arranged in parallel are sandwiched between two insulating resin films. A strip-shaped conductor is exposed from the insulating resin film on one side of the end of the flexible flat cable, and this exposed portion is joined to the conductive adhesive layers 61A and 61B. The ends of the other surface of the flexible flat cable are joined to the insulating adhesive layers 67A, 67B. A strip-shaped conductor corresponds to a wiring layer, a pattern in which strip-shaped conductors are arranged corresponds to a conductor pattern, and an insulating resin film corresponds to an insulating resin layer.

When a flexible printed circuit board is used as the wiring members 62A and 62B, the conductor pattern is formed by etching a metal thin film. In contrast, when flexible flat cables are used as the wiring members 62A and 62B, the wiring members 62A and 62B can be obtained at low cost. In flexible flat cables, although the degree of freedom in the pattern shape of the conductor pattern is limited, it is possible to adjust the ratio of the conductor portion and the opening portion by adjusting the width and arrangement interval of the belt-shaped conductor. It is also possible to improve the bonding strength by

[Modified Example of First Embodiment and Second Embodiment]
- In 1st Embodiment, the light control sheet 20 may have several wiring area|region SD, and the connection part 30 may be connected to each wiring area|region SD. In other words, the light control unit 10 may have a plurality of connection parts 30 . In such a configuration, the first wiring layers 34A of the plurality of connection portions 30 may be controlled to have the same potential, and the second wiring layers 34B of the plurality of connection portions 30 may be controlled to have the same potential. 30 may be separately connected to a drive circuit. Alternatively, the plurality of connecting portions 30 may be connected to each other outside the light control sheet 20 . In other words, each of the first wiring layer 34A and the second wiring layer 34B of the plurality of connection portions 30 is connected to one terminal on the input side of the signal from the drive circuit, and is connected to a plurality of terminals on the output side. The wiring of the structure may be configured.

Similarly, in the second embodiment, the light control sheet 20 has a plurality of first wiring regions SA, the light control unit 11 has a plurality of first connection portions 60A, and each first wiring region SA has a first wiring region SA. 60 A of connection parts may be connected. 60 A of several 1st connection parts may be connected to a drive circuit separately, and may be mutually connected in the outer side of the light control sheet 20. As shown in FIG. Further, the light control sheet 20 has a plurality of second wiring regions SB, the light control unit 11 has a plurality of second connection portions 60B, and the second connection portions 60B are connected to the respective second wiring regions SB. may The plurality of second connection portions 60B may be connected to the drive circuit separately, or may be connected to each other outside the light control sheet 20 .

According to each of the above configurations, it is possible to reduce the load on the driving circuit for controlling each of the first transparent electrode layer 23A and the second transparent electrode layer 23B to a predetermined potential. In particular, each of the above configurations is effective when the area of the dimming region Si is large.

- In 1st Embodiment, the wiring member 32 should just be equipped with the wiring layers 34A and 34B and the insulating resin layer 33 at least. Moreover, in the second embodiment, the wiring members 62A and 62B may include at least the wiring layers 64A and 64B and the insulating resin layers 63A and 63B. The wiring layers 34A, 34B, 64A, 64B may be metal layers, and may be composed of a plurality of layers including plated layers, etc. The insulating resin layers 33, 63A, 63B are resin layers. It may be provided and may be composed of a plurality of layers. The conductive adhesive layers 31A, 31B, 61A, and 61B may be layers having conductivity and adhesiveness, and may be composed of a plurality of layers. Any layer having properties and adhesiveness may be used, and may be composed of a plurality of layers.

- In 1st Embodiment, the connection part 30 does not need to be equipped with the sealing part 36. FIG. Also, in the second embodiment, the connection portions 60A and 60B may not include the sealing portions 66A and 66B.

- The light control sheet 20 may include other layers in addition to the light control layer 21 and the electrode sheets 22A and 22B. Other layers, for example, layers for protecting the light control layer 21 and the transparent electrode layers 23A and 23B, such as layers having an ultraviolet barrier function, contribute to control of light transmittance in the light control sheet 20. and a layer that enhances properties such as strength and heat resistance of the light control sheet 20 .

Further, the light control sheet 20 may include a pair of alignment layers sandwiching the light control layer 21 between the light control layer 21 and the electrode sheets 22A and 22B. The alignment layer is a layer that controls the alignment of the liquid crystal molecules included in the light control layer 21, and aligns the liquid crystal molecules in a predetermined direction when no drive voltage is applied. In the configuration including the alignment layer, the light control region Si becomes transparent when no drive voltage is applied to the transparent electrode layers 23A and 23B, and the light control region Si becomes transparent when the drive voltage is applied to the transparent electrode layers 23A and 23B. Si becomes opaque.

When the light control sheet 20 further includes layers other than the light control layer 21 and the electrode sheets 22A and 22B, in the wiring regions SA, SB and SD, between the first transparent electrode layer 23A and the second transparent electrode layer 23B It is sufficient that the sandwiched layers are removed and the connecting portions 30, 60A and 60B are sandwiched between the first transparent electrode layer 23A and the second transparent electrode layer 23B. Further, the external shape of the light control sheet 20 may be a shape other than a rectangle.

The light-modulating layer 21 may contain a pigment having a predetermined color that does not interfere with the movement of liquid crystal molecules in accordance with the magnitude of the voltage applied to the light-modulating layer 21 . Such a configuration realizes the light control sheet 20 having a predetermined color.

- Either the first electrode sheet 22A or the second electrode sheet 22B may be attached to the transparent plate 50 . Also, the light control sheet 20 may be sandwiched between two transparent plates 50 .

SA, SB, SD... wiring area, Si... light control area, Se... inter-terminal area, 10, 11, 100... light control unit, 20, 110... light control sheet, 21, 120... light control layer, 22A, 22B , 130A, 130B... electrode sheet, 23A, 23B, 140A, 140B... transparent electrode layer, 24A, 24B, 150A, 150B... transparent support layer, 30, 60A, 60B, 160A, 160B... connection part, 31A, 31B, 61A , 61B, 161... conductive adhesive layer, 32, 62A, 62B... wiring member, 33, 63A, 63B... insulating resin layer, 34, 64A, 64B... wiring layer, 35, 65A, 65B... protective layer, 36, 66A, 66B... Sealing part 50... Transparent plate 51... Adhesive layer 67A, 67B... Insulating adhesive layer 40... Conductor part 41... Opening part 42... Pattern part 43... Non-pattern part 162... Conductive tape 163 Solder 164 Lead wire.

Claims (9)

a light control sheet comprising a light control layer containing a liquid crystal composition, a first transparent electrode layer, and a second transparent electrode layer;
a connecting portion for connecting the first transparent electrode layer and a power supply;
A dimming unit comprising
The light control sheet includes a light control area and a wiring area,
In the light control region, the light control layer is sandwiched between the first transparent electrode layer and the second transparent electrode layer,
In the wiring region, the first transparent electrode layer and the second transparent electrode layer sandwich an end portion of the connection portion,
When viewed from the direction facing the surface of the light control sheet, the wiring area is arranged along the side of the light control sheet, and the wiring area is a portion where the side of the light control sheet is located. surrounded by the dimming area except for
The connecting portion includes a first adhesive layer bonded to the first transparent electrode layer in the wiring region, a second adhesive layer bonded to the second transparent electrode layer in the wiring region, and the first adhesive layer bonded to the second transparent electrode layer in the wiring region. a wiring member sandwiched between an adhesive layer and the second adhesive layer and joined to these adhesive layers,
The first adhesive layer has conductivity,
The wiring member includes a wiring layer in contact with the first adhesive layer, and an insulating resin layer positioned between the first transparent electrode layer and the second transparent electrode layer and supporting the wiring layer. light unit. The connection part is located between the first transparent electrode layer and the second transparent electrode layer, in the laminate of the wiring member, the first adhesive layer, and the second adhesive layer, and the light control region. The light control unit according to claim 1 , further comprising a sealing portion that fills a gap with the light control layer. a light control sheet comprising a light control layer containing a liquid crystal composition, a first transparent electrode layer, and a second transparent electrode layer;
a connecting portion for connecting the first transparent electrode layer and a power supply;
A dimming unit comprising
The light control sheet includes a light control area and a wiring area,
In the light control region, the light control layer is sandwiched between the first transparent electrode layer and the second transparent electrode layer,
In the wiring region, the first transparent electrode layer and the second transparent electrode layer sandwich an end portion of the connection portion,
The connecting portion includes a first adhesive layer bonded to the first transparent electrode layer in the wiring region, a second adhesive layer bonded to the second transparent electrode layer in the wiring region, and the first adhesive layer bonded to the second transparent electrode layer in the wiring region. a wiring member sandwiched between an adhesive layer and the second adhesive layer and joined to these adhesive layers;
The first adhesive layer has conductivity,
The wiring member includes a wiring layer in contact with the first adhesive layer, and an insulating resin layer positioned between the first transparent electrode layer and the second transparent electrode layer and supporting the wiring layer ,
The connecting portion is further located between the first transparent electrode layer and the second transparent electrode layer, in the laminate of the wiring member, the first adhesive layer, and the second adhesive layer, and the light control region. A sealing portion that fills the gap between the light control layer and the
When viewed from the direction facing the surface of the light control sheet, the sealing portion is located between the tip of the wiring member and the light control layer in the direction in which the wiring member extends, and in the direction in which the wiring member extends. The gap is filled between the end of the wiring member and the light control layer in the orthogonal direction.
dimming unit. the wiring layer is a first wiring layer,
The second adhesive layer has conductivity,
4. The wiring member according to any one of claims 1 to 3, wherein the wiring member includes a second wiring layer in contact with the second adhesive layer on a side opposite to the first wiring layer with respect to the insulating resin layer. dimming unit. The light control unit according to any one of claims 1 to 3, wherein the second adhesive layer is an insulating adhesive layer. The connection portion is a first connection portion, and the light control unit includes a second connection portion for connecting the second transparent electrode layer and a power supply,
The wiring area is a first wiring area, the light control sheet includes a second wiring area, and the first transparent electrode layer and the second transparent electrode layer are connected to each other in the second wiring area. sandwiching the ends of the
The second connecting portion includes an insulating adhesive layer bonded to the first transparent electrode layer in the second wiring region, and a conductive adhesive layer bonded to the second transparent electrode layer in the second wiring region. and a second wiring member sandwiched between the insulating adhesive layer and the conductive adhesive layer and joined to these adhesive layers,
The light control unit according to claim 5 , wherein the second wiring member includes a wiring layer in contact with the conductive adhesive layer and an insulating resin layer supporting the wiring layer. The light control unit according to any one of claims 1 to 6 , wherein the wiring layer in contact with the first adhesive layer has a flat film shape at a portion in contact with the first adhesive layer. The light control unit according to any one of claims 1 to 6 , wherein the wiring layer in contact with the first adhesive layer has a conductor pattern in a portion in contact with the first adhesive layer. The wiring member bonded to the first adhesive layer and the second adhesive layer is a flexible printed circuit board,
The first adhesive layer is composed of any one of an anisotropic conductive film, an anisotropic conductive paste, an isotropic conductive film, and an isotropic conductive paste. Any one of claims 1 to 8 . The dimming unit described in .

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