JPH1194649A - Platinum temperature sensor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate breakage due to lead connection and prevent damage of electrical characteristics of a platinum thin film, by forming separately the platinum thin film serving as a temperature sensing element and an electrode made by printing and baking a thick film material having platinum as a major constituent. SOLUTION: After the temperature sensing element 2 of a platinum thin film is formed by vacuum deposition on an insulating substrate 1 having alumina as its main constituent, an electrode 3 is formed by printing and baking a thick film material having platinum as its major constituent, and a lead wire 6 is connected to the electrode 3. Stress generated at the time of bonding or welding of the lead wire 6 is prevented from being applied to the platinum thin film, by forming sepatately the temperature sensing element 2 of the platinum thin film and the electrode 3. Because the electrode 3 has, as its major constituent, the same element as the temperature sensing element 2 of the platinum thin film, temperature sensing characteristics and electrical characteristics of the platinum thin film are not damaged.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a platinum temperature sensor using a platinum thin film as a temperature sensing element.

[0002]

2. Description of the Related Art Conventionally, a lead wire connecting method of a plate-shaped platinum thin film temperature sensor having a lead wire is performed by welding or bonding a lead wire directly to an electrode portion patterned on a substrate surface, or by fixing an external lead frame and the above-mentioned method. A method of bonding an electrode portion with a thin wire has been applied.

[0003]

A conventional method for connecting a lead wire of a plate-shaped platinum thin film temperature sensor having lead wires is to directly connect a lead wire directly to an electrode portion formed on the surface of a substrate with the same platinum thin film as a thermosensitive element. Was fixed by welding or bonding.

[0004] In this method, the mechanical strength of the joint is weak, and even if reinforcement is made of glass or the like, the mechanical stress applied to the lead wire during the subsequent manufacturing process or when this platinum temperature sensor is attached to industrial equipment is used. Could be destroyed.

In the method of bonding the external lead wire and the electrode portion with a thin wire, it is necessary to package the resin by resin molding or the like, and it is difficult to reduce the size and weight.

[0006]

SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems. A first aspect of the present invention is to provide a flat insulating substrate and a platinum thin film temperature-sensitive element formed on the insulating substrate. A platinum temperature sensor having an electrode obtained by printing and firing a thick film material containing as a main component, wherein the platinum thin film temperature sensing element and a part of the electrode are arranged so as to overlap each other. .

According to a second aspect of the present invention, there can be provided the platinum temperature sensor according to the first aspect, wherein a part of the electrode and the temperature sensing element made of a platinum thin film formed on the insulating substrate are covered with the same insulating material such as glass. .

According to a third aspect of the present invention, a convex electrode connection portion is formed on the temperature sensing element on the insulating substrate, and the electrode is formed by printing and firing using a thick film material so as to overlap a narrow portion at the tip. Can be provided.

A fourth aspect of the present invention is the platinum of the first, second and third aspects, further comprising a secondary electrode obtained by laminating and printing a thick film material mainly composed of a dissimilar metal on the electrode connected to the temperature sensing element. A temperature sensor can be provided.

[0010]

According to the present invention, the stress generated at the time of welding or bonding a lead wire is formed by separately forming electrodes formed by printing and firing a platinum thin film serving as a temperature sensing element and a thick film material mainly composed of platinum. Is not added to the platinum thin film.

Further, since the electrode contains the same element as that of the platinum thin film thermosensitive element as a main component, the temperature sensing characteristics and the electrical characteristics of the platinum thin film are not impaired.

[0012]

[Embodiment 1] An embodiment according to the contents of the claims of the present invention will be described below with reference to the drawings.

FIG. 1 is an explanatory view showing a platinum temperature sensor of one embodiment.

After forming a platinum thin film thermosensitive element 2 on a margin substrate 1 mainly composed of alumina by vacuum evaporation, an electrode 3 is formed by printing and firing a thick film material mainly composed of platinum. The lead wire 6 was connected on this electrode.

[0015]

Embodiment 2 FIG. 2 is an explanatory view showing a platinum temperature sensor according to one embodiment.

A platinum thin film temperature sensing element 2 and a thick film electrode 3 formed on the insulating substrate 1 are formed. Then, a glass thin film covering all of the platinum thin film temperature sensing element 2 and a part of the thick film electrode 3 is formed. A high quality insulating material 4 was printed and baked, and a lead wire 6 was connected to the electrode.

[0017]

Embodiment 3 FIG. 3 is an explanatory view showing a platinum temperature sensor of one embodiment.

FIG. 4 is an explanatory view showing a platinum temperature sensor according to the embodiment.

A convex electrode connecting portion is formed with the platinum thin film temperature sensing element 2 formed on the insulating substrate 1, and a thick film material is printed and fired so as to overlap the narrow portion 2a at the tip. Was formed.

Next, a vitreous insulating material 4 was printed and baked so as to cover all of the platinum thin film temperature sensing element 2 and a part of the thick film electrode 3, and a lead wire 6 was connected to this electrode.

[0021]

Embodiment 5 FIG. 5 is an explanatory view showing a platinum temperature sensor of one embodiment.

A platinum thin film temperature sensing element 2 formed on the insulating substrate 1 is formed with a convex electrode connecting portion, and a thick film material including a narrow end portion 2a is printed and fired to form an electrode 3. Formed.

Further, a different kind of metal such as Au
Electrode 5 obtained by laminating and printing a thick film material mainly composed of
Was formed, and a glassy insulating material 4 was printed and baked so as to cover the entire platinum thin film temperature sensing element 2 and a part of the thick film electrode 3, and a lead wire 6 was connected to this electrode.

[0024]

As described above, the product of the present invention has the effect of solving the problems of the prior art.

1 The product of the present invention is formed by separately forming electrodes formed by printing and firing a platinum thin film serving as a temperature sensing element and a thick film material containing platinum as a main component, so that the electrode is not broken by the stress of lead connection. Since the electrode contains the same element as the platinum thin film thermosensitive element as a main component, the electrical characteristics of the platinum thin film are not impaired.

(2) By coating a platinum thin film thermosensitive body and a part of the electrode with a vitreous insulating material, the platinum thin film is not exposed and the thermosensitive body can be protected.

3 A temperature sensitive element and a convex electrode connection portion are formed on a substrate, and a thick film material is printed and fired including a narrow portion at the tip to form an electrode. Even if the displacement occurs, exposure of the platinum thin film can be prevented.

4. An electrode suitable for the material of the lead wire to be connected and the connection method by forming a secondary electrode obtained by laminating and printing a thick film material mainly composed of a dissimilar metal on the electrode connected to the temperature sensing element. Materials can be selected.

[Brief description of the drawings]

FIG. 1 is a sectional view showing the structure of a platinum temperature sensor according to a first embodiment of the present invention.

FIG. 2 and

FIG. 3 is a cross-sectional view illustrating a structure of a platinum temperature sensor according to a second embodiment of the present invention.

FIG. 4 is a front view showing the structure of a platinum temperature sensor according to a third embodiment of the present invention.

FIG. 5 is a sectional view showing the structure of a platinum temperature sensor according to a fourth embodiment of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 Insulating substrate 1a Marginal area on insulating substrate surface 2 Platinum thin film temperature sensing element 2a Platinum thin film temperature sensing element tip convex part 3 Electrode 4 Glass coating 5 Secondary electrode 6 Lead wire

Claims (4)

[Claims] 1. A platinum temperature sensor having a planar insulating substrate, a platinum thin film temperature sensing element formed on the insulating substrate, and an electrode formed by printing and firing a thick film material containing platinum as a main component. A platinum temperature sensor, wherein a body and a part of the electrode overlap each other. 2. The platinum temperature sensor according to claim 1, wherein a part of the electrode and a part of the electrode are covered with the same insulating material such as glass. 3. A convex electrode connecting portion is formed on the temperature sensing element on the insulating substrate, and the electrode is formed by printing and firing using a thick film material so as to overlap a narrow portion at the tip. 1 and 2
Platinum temperature sensor. 4. The platinum temperature sensor according to claim 1, further comprising a secondary electrode formed by laminating, printing and firing a thick film material mainly composed of a dissimilar metal on said electrode connected to said temperature sensing element.